Specific Process Knowledge/Thin film deposition/Deposition of Platinum: Difference between revisions
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'''Feedback to this page''': '''[mailto: | '''Feedback to this page''': '''[mailto:labadviser@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php/Specific_Process_Knowledge/Thin_film_deposition/Deposition_of__Platinum click here]''' | ||
<i> Unless otherwise stated, this page is written by <b>DTU Nanolab internal</b></i> | <i> Unless otherwise stated, this page is written by <b>DTU Nanolab internal</b></i> | ||
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|-style="background:silver; color:black" | |-style="background:silver; color:black" | ||
! | ! | ||
! E-beam evaporation ([[Specific Process Knowledge/Thin film deposition/Temescal| | ! E-beam evaporation ([[Specific Process Knowledge/Thin film deposition/Temescal|E-beam evaporator (Temescal)]] and [[Specific Process Knowledge/Thin film deposition/10-pocket e-beam evaporator|E-beam evaporator (10-pockets)]]) | ||
! Sputter deposition ([[Specific Process Knowledge/Thin film deposition/Lesker|Lesker]]) | ! Sputter deposition ([[Specific Process Knowledge/Thin film deposition/Lesker|Lesker]]) | ||
! Sputter deposition ([[Specific Process Knowledge/Thin film deposition/Cluster-based multi-chamber high vacuum sputtering deposition system|Sputter-system Metal-Oxide (PC1) and Sputter-system Metal-Nitride (PC3)]]) | ! Sputter deposition ([[Specific Process Knowledge/Thin film deposition/Cluster-based multi-chamber high vacuum sputtering deposition system|Sputter-system Metal-Oxide (PC1) and Sputter-system Metal-Nitride (PC3)]]) | ||
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|-style="background:WhiteSmoke; color:black" | |-style="background:WhiteSmoke; color:black" | ||
! General description | ! General description | ||
|E-beam deposition of Pt | |E-beam deposition of Pt | ||
|Sputter deposition of Pt | |Sputter deposition of Pt | ||
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! Pre-clean | ! Pre-clean | ||
|Ar ion | |||
|Ar ion etch (only in E-beam evaporator Temescal) | |||
|none | |none | ||
|RF Ar clean | |RF Ar clean | ||
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|-style="background:WhiteSmoke; color:black" | |-style="background:WhiteSmoke; color:black" | ||
! Layer thickness | ! Layer thickness | ||
|10Å - 600nm* | |10Å - 600nm* | ||
|10Å - 600nm* | |10Å - 600nm* | ||
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|-style="background:LightGrey; color:black" | |-style="background:LightGrey; color:black" | ||
! Deposition rate | ! Deposition rate | ||
|0.5Å/s to 10Å/s | |0.5Å/s to 10Å/s | ||
|up to 3.74 Å/s | |up to 3.74 Å/s | ||
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*Up to 3x8" wafers (ask for holder) | *Up to 3x8" wafers (ask for holder) | ||
*smaller wafers and pieces | *smaller wafers and pieces | ||
| | | | ||
*1x4" wafer or | *1x4" wafer or | ||
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|- | |- | ||
|-style="background:LightGrey; color:black" | |-style="background:LightGrey; color:black" | ||
!Allowed materials | |||
! Allowed materials | |||
| | | | ||
Almost any that does not degas at your intended substrate temperature. See the [http://labmanager.dtu.dk/function.php?module=XcMachineaction&view=edit&MachID=511 cross-contamination sheet]. | |||
| | | | ||
* | *Almost any that does not degas. | ||
| | | | ||
* | *Almost any that does not degas at your intended substrate temperature. See cross contamination sheets for [http://labmanager.dtu.dk/function.php?module=XcMachineaction&view=edit&MachID=441 PC1] and [http://labmanager.dtu.dk/function.php?module=XcMachineaction&view=edit&MachID=442 PC3] | ||
|-style="background:WhiteSmoke; color:black" | |-style="background:WhiteSmoke; color:black" | ||
! Comment | ! Comment | ||
| Pt tends to exhibit tensile stress, see section on [[Specific Process Knowledge/Characterization/Stress measurement|stress in thin films]]. | |||
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|} | |} | ||
'''*''' ''If depositing a total of more than 600 nm, please write to metal@ | '''*''' ''If depositing a total of more than 600 nm, please write to metal@nanolab.dtu.dk well in advance to ensure that enough material is present.'' | ||