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Specific Process Knowledge/Thin film deposition/Electroplating-Ni: Difference between revisions

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Uniformity across a 4" wafer is around 5% for the standard processes (the edge being slightly thicker than the center of the sample). Running at high current densities will deposit a nickel layer that is quite soft. Decreasing current density will increase tensile strength of the deposited nickel.
Uniformity across a 4" wafer is around 5% for the standard processes (the edge being slightly thicker than the center of the sample). Running at high current densities will deposit a nickel layer that is quite soft. Decreasing current density will increase tensile strength of the deposited nickel.


'''The user manual(s), quality control procedure(s) and results, user APV(s), technical information and contact information can be found in LabManager:'''
<!-- remember to remove the type of documents that are not present -->
<!-- give the link to the equipment info page in LabManager: -->
[http://labmanager.dtu.dk/function.php?module=Machine&view=view&mach=274 Electroplating-Ni Info on LabManager]
== Process information ==
*[[Specific Process Knowledge/Thin film deposition/Deposition of Nickel/Electroplating of nickel|Description of standard processes]]


==Equipment performance and process related parameters==
==Equipment performance and process related parameters==
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