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|  width="30" align="center" style="writing-mode: vertical-lr; transform: rotate(180deg);background:#f0f0f0;"|[[Specific_Process_Knowledge/Characterization/XPS|XPS]]
|  width="30" align="center" style="writing-mode: vertical-lr; transform: rotate(180deg);background:#f0f0f0;"|[[Specific_Process_Knowledge/Characterization/XPS|XPS]]
|  width="30" align="center" style="writing-mode: vertical-lr; transform: rotate(180deg);background:#f0f0f0;"|[[Specific_Process_Knowledge/Characterization/PL_mapper|PL mapper]]
|  width="30" align="center" style="writing-mode: vertical-lr; transform: rotate(180deg);background:#f0f0f0;"|[[Specific_Process_Knowledge/Characterization/PL_mapper|PL mapper]]
|  width="30" align="center" style="writing-mode: vertical-lr; transform: rotate(180deg);background:#f0f0f0;"|[[Specific_Process_Knowledge/Characterization/4-Point_Probe|4-point probe]]
|  width="30" align="center" style="writing-mode: vertical-lr; transform: rotate(180deg);background:#f0f0f0;"|[[Specific Process Knowledge/Characterization/Four-Point Probe|4-point probe]]
|  width="30" align="center" style="writing-mode: vertical-lr; transform: rotate(180deg);background:#f0f0f0;"|[[Specific_Process_Knowledge/Characterization/Probe_station|Probe station]]
|  width="30" align="center" style="writing-mode: vertical-lr; transform: rotate(180deg);background:#f0f0f0;"|[[Specific_Process_Knowledge/Characterization/Probe_station|Probe station]]
|  width="30" align="center" style="writing-mode: vertical-lr; transform: rotate(180deg);background:#f0f0f0;"|[[Specific_Process_Knowledge/Characterization/XRD|XRD]]
|  width="30" align="center" style="writing-mode: vertical-lr; transform: rotate(180deg);background:#f0f0f0;"|[[Specific_Process_Knowledge/Characterization/XRD|XRD]]
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|-style="background:#C0C0C0;" align="center"
|-style="background:#C0C0C0;" align="center"
|align="left"| [[Specific_Process_Knowledge/Characterization/Element_analysis|Element analysis]]||||x||||||||||||||x||x  4)||||||x  4)||||||||||||||
|align="left"| [[Specific_Process_Knowledge/Characterization/Element_analysis|Element analysis]]||||x||||||||||||||x||x  <sup>{{fn|4}}</sup>||||||x  <sup>{{fn|4}}</sup>||||||||||||||
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|-style="background:#DCDCDC;" align="center"
|align="left"| [[Specific_Process_Knowledge/Characterization/Stress_measurement|Film stress]]||||||||x||||||||||||||||||x  7)||||||||||||||
|align="left"| [[Specific_Process_Knowledge/Characterization/Stress_measurement|Film stress]]||||||||x||||||||||||||||||x  <sup>{{fn|7}}</sup>||||||||||||||
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|-style="background:#DCDCDC;" align="center"
|align="left"| Reflectivity||||||||||||x||x||||||x 6)||||||||||||||||||||x
|align="left"| Reflectivity||||||||||||x||x||||||x <sup>{{fn|6}}</sup>||||||||||||||||||||x
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|align="left"| Step coverage||x  1)||x  1)||||||||||||||||||||||||||||||||||||
|align="left"| Step coverage||x  <sup>{{fn|1}}</sup>||x  <sup>{{fn|1}}</sup>||||||||||||||||||||||||||||||||||||
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|align="left"| [[Specific_Process_Knowledge/Characterization/Measurement_of_film_thickness_and_optical_constants|Thin film thickness]]||x  1)||x  1)||x  2)||x  2)||x  ||x||x||||||x 5)||x  3)||||x||||||||||||||
|align="left"| [[Specific_Process_Knowledge/Characterization/Measurement_of_film_thickness_and_optical_constants|Thin film thickness]]||x  <sup>{{fn|1}}</sup>||x  <sup>{{fn|1}}</sup>||x  <sup>{{fn|2}}</sup>||x  <sup>{{fn|2}}</sup>||x  ||x||x||||||x <sup>{{fn|5}}</sup>||x  <sup>{{fn|3}}</sup>||||x||||||||||||||
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|-style="background:#DCDCDC;" align="center"
|align="left"| [[Specific_Process_Knowledge/Characterization/Thickness_Measurer|Wafer thickness]]||x  1)||x  1)||||||||||||x||||||||||||||||||||||||
|align="left"| [[Specific_Process_Knowledge/Characterization/Thickness_Measurer|Wafer thickness]]||x  <sup>{{fn|1}}</sup>||x  <sup>{{fn|1}}</sup>||||||||||||x||||||||||||||||||||||||
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<br clear="all">
 
<sup>{{fn|1}}</sup> Using the cross section method<br>
 
<sup>{{fn|2}}</sup> Using the create step method<br>
 
<sup>{{fn|3}}</sup> With known resistivity<br>
# Using the cross section method
<sup>{{fn|4}}</sup> Composition information for crystalline materials<br>
# Using the create step method
<sup>{{fn|5}}</sup> Only single layer<br>
# With known resistivity
<sup>{{fn|6}}</sup> Good for characterization of VCSEL structures and DBR mirrors<br>
# Composition information for crystalline materials
<sup>{{fn|7}}</sup> Only for crystalline films<br>
# Only single layer
# Good for characterization of VCSEL structures and DBR mirrors
# Only for crystalline films


== Choose characterization topic ==
== Choose characterization topic ==
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===Electrical measurements===
===Electrical measurements===
*[[/4-Point Probe|4-Point Probe]]
*[[/Four-Point Probe|4-Point Probe]]
*[[/Probe station|Probe station]]
*[[/Probe station|Probe station]]
*[[/III-V ECV-profiler|III-V ECV-profiler (Electrochemical Capacitance-Voltage carrier density profiler)]]
*[[/III-V ECV-profiler|III-V ECV-profiler (Electrochemical Capacitance-Voltage carrier density profiler)]]
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===SEMs at DTU Nanolab - building 307/314===
===SEMs at DTU Nanolab - building 307/314===
<!-- *[[LabAdviser/CEN/Quanta 3D FIB/SEM|FIB-SEM FEI QUANTA 200 3D]] -->
<!-- *[[LabAdviser/CEN/Quanta 3D FIB/SEM|FIB-SEM FEI QUANTA 200 3D]] -->
*[[LabAdviser/CEN/Helios Nanolab 600|Dual Beam FEI Helios Nanolab 600]]
*[[LabAdviser/314/Microscopy 314-307/FIB/Helios|Dual Beam FEI Helios Nanolab 600]]
*[[LabAdviser/CEN/Nova NanoSEM 600|SEM FEI Nova 600 NanoSEM]]
*[[LabAdviser/314/Microscopy 314-307/SEM/Nova|SEM FEI Nova 600 NanoSEM]]
*[[LabAdviser/CEN/Quanta FEG 200 ESEM|SEM FEI Quanta 200 ESEM FEG]]
*[[
LabAdviser/314/Microscopy 314-307/SEM/QFEG|SEM FEI Quanta 200 ESEM FEG]]
<!-- *[[LabAdviser/CEN/Inspect S|SEM Inspect S]] -->
<!-- *[[LabAdviser/CEN/Inspect S|SEM Inspect S]] -->


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===TEMs at DTU Nanolab - building 307/314===
===TEMs at DTU Nanolab - building 307/314===
*[[LabAdviser/CEN/Titan ATEM |Titan ATEM]]
*[[LabAdviser/314/Microscopy 314-307/TEM/ATEM |Titan ATEM]]
*[[LabAdviser/CEN/Titan ETEM |Titan ETEM]]
*[[LabAdviser/314/Microscopy 314-307/TEM/ETEM |Titan ETEM]]
*[[LabAdviser/CEN/Tecnai TEM |Tecnai TEM]]
*[[LabAdviser/314/Microscopy 314-307/TEM/T20 |Tecnai TEM]]


===XRD===
===XRD===
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==Decommissioned equipment==
==Decommissioned equipment==
*[[/KLA-Tencor Surfscan 6420|KLA-Tencor Surfscan 6420]]
*[[/KLA-Tencor Surfscan 6420|KLA-Tencor Surfscan 6420]]
*[[/X-Ray Diffractometer|Phillips X-Ray Diffractometer that was owned by DTU Fotonik]]
*[[/X-Ray Diffractometer|Phillips X-Ray Diffractometer (owned by DTU Fotonik)]]

Latest revision as of 15:09, 20 June 2025

The content on this page, including all images and pictures, was created by DTU Nanolab staff, unless otherwise stated.

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Overview of characteristics and where to measure it

Optical Microscopes SEM (incl. EDX) AFM Stylus profilers Optical profilers Filmtek (reflectometer) Ellipsometer Thickness stylus XPS PL mapper 4-point probe Probe station XRD Life time scanner Drop shape analyser Hardness tester Particle scanner IR-camera III-V ECV-profiler Microspectrophotometer (Craic 20/30 PV)
Breakdown voltage
Carrier density/doping profile x
Charge carrier life time x
Contact angle hydrophobic/hydrophillic x
Crystallinity x
Deposition uniformity x x x
Dimensions(in plane) x x (x) (x) x x
Dimensions(height)/Topography (x) (x) x x x
Electrical conductivity x
Element analysis x x x 4 x 4
Film stress x x 7
Imaging x x x x x
Material Hardness x
Band gap x x x
Particles x x x x x
Phase changes
Reflectivity x x x 6 x
Refractive index x x
Resistivity x
Step coverage x 1 x 1
Surface roughness x x x x
Thermal conductivity
Thin film thickness x 1 x 1 x 2 x 2 x x x x 5 x 3 x
Voids in wafer bonding x x x
Wafer thickness x 1 x 1 x
Work function x


1 Using the cross section method
2 Using the create step method
3 With known resistivity
4 Composition information for crystalline materials
5 Only single layer
6 Good for characterization of VCSEL structures and DBR mirrors
7 Only for crystalline films

Choose characterization topic

Choose equipment

AFM

Electrical measurements

Element analysis

Optical and stylus profilers

Optical microscopes

Optical characterization

SEMs at DTU Nanolab - building 307/314

LabAdviser/314/Microscopy 314-307/SEM/QFEG|SEM FEI Quanta 200 ESEM FEG]]

SEM's in building 346

TEMs at DTU Nanolab - building 307/314

XRD

Various

Decommissioned equipment

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