Specific Process Knowledge/Characterization: Difference between revisions

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 {| {{table } }
 |  width="30" align="center" style="writing-mode: vertical-lr; transform: rotate(180deg);background:#f0f0f0;"|
-|  width="30" align="center" style="writing-mode: vertical-lr; transform: rotate(180deg);background:#f0f0f0;"|[[Specific_Process_Knowledge/Characterization/Optical_microscope| Optical Micro- scopes]]
+|  width="30" align="center" style="writing-mode: vertical-lr; transform: rotate(180deg);background:#f0f0f0;"|[[Specific_Process_Knowledge/Characterization/Optical_microscope| Optical Microscopes]]
 |  width="30" align="center" style="writing-mode: vertical-lr; transform: rotate(180deg);background:#f0f0f0;"|[[Specific Process Knowledge/Characterization/SEM: Scanning Electron Microscopy|SEM (incl. EDX)]]
 |  width="30" align="center" style="writing-mode: vertical-lr; transform: rotate(180deg);background:#f0f0f0;"|[[Specific Process Knowledge/Characterization/AFM: Atomic Force Microscopy|AFM]]
-|  width="30" align="center" style="writing-mode: vertical-lr; transform: rotate(180deg);background:#f0f0f0;"|[[Specific Process Knowledge/Characterization/Profiler|Stylus profiler]]
+|  width="30" align="center" style="writing-mode: vertical-lr; transform: rotate(180deg);background:#f0f0f0;"|[[Specific Process Knowledge/Characterization/Topographic measurement#Comparison of Stylus Profilers, Optical Profilers and AFMs at Nanolab|Stylus profilers]]
-|  width="30" align="center" style="writing-mode: vertical-lr; transform: rotate(180deg);background:#f0f0f0;"|[[Specific_Process_Knowledge/Characterization/Profiler#Optical_Profiler_(Sensofar_S_Neox)|Optical profiler]]
+|  width="30" align="center" style="writing-mode: vertical-lr; transform: rotate(180deg);background:#f0f0f0;"|[[Specific_Process_Knowledge/Characterization/Topographic_measurement#Comparison of Stylus Profilers, Optical Profilers and AFMs at Nanolab|Optical profilers]]
-|  width="30" align="center" style="writing-mode: vertical-lr; transform: rotate(180deg);background:#f0f0f0;"|[[Specific_Process_Knowledge/Characterization/Optical_characterization#Filmtek_4000|Filmtek (reflec- tometer)]]
+|  width="30" align="center" style="writing-mode: vertical-lr; transform: rotate(180deg);background:#f0f0f0;"|[[Specific_Process_Knowledge/Characterization/Optical_characterization#Filmtek_4000|Filmtek (reflectometer)]]
-|  width="30" align="center" style="writing-mode: vertical-lr; transform: rotate(180deg);background:#f0f0f0;"|[[Specific_Process_Knowledge/Characterization/Optical_characterization#Ellipsometer|Ellip- someter]]
+|  width="30" align="center" style="writing-mode: vertical-lr; transform: rotate(180deg);background:#f0f0f0;"|[[Specific_Process_Knowledge/Characterization/Optical_characterization#Ellipsometer|Ellipsometer]]
 |  width="30" align="center" style="writing-mode: vertical-lr; transform: rotate(180deg);background:#f0f0f0;"|[[Specific_Process_Knowledge/Characterization/Thickness_Measurer|Thickness stylus]]
 |  width="30" align="center" style="writing-mode: vertical-lr; transform: rotate(180deg);background:#f0f0f0;"|[[Specific_Process_Knowledge/Characterization/XPS|XPS]]
 |  width="30" align="center" style="writing-mode: vertical-lr; transform: rotate(180deg);background:#f0f0f0;"|[[Specific_Process_Knowledge/Characterization/PL_mapper|PL mapper]]
-|  width="30" align="center" style="writing-mode: vertical-lr; transform: rotate(180deg);background:#f0f0f0;"|[[Specific_Process_Knowledge/Characterization/4-Point_Probe|4-point probe]]
+|  width="30" align="center" style="writing-mode: vertical-lr; transform: rotate(180deg);background:#f0f0f0;"|[[Specific Process Knowledge/Characterization/Four-Point Probe|4-point probe]]
 |  width="30" align="center" style="writing-mode: vertical-lr; transform: rotate(180deg);background:#f0f0f0;"|[[Specific_Process_Knowledge/Characterization/Probe_station|Probe station]]
 |  width="30" align="center" style="writing-mode: vertical-lr; transform: rotate(180deg);background:#f0f0f0;"|[[Specific_Process_Knowledge/Characterization/XRD|XRD]]
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 |-style="background:#C0C0C0;" align="center"
-|align="left"| [[Specific_Process_Knowledge/Characterization/Element_analysis|Element analysis]]||||x||||||||||||||x||x   4)||||||x   4)||||||||||||||
+|align="left"| [[Specific_Process_Knowledge/Characterization/Element_analysis|Element analysis]]||||x||||||||||||||x||x   <sup>{{fn|4}}</sup>||||||x   <sup>{{fn|4}}</sup>||||||||||||||
 |-
 |-style="background:#DCDCDC;" align="center"
-|align="left"| [[Specific_Process_Knowledge/Characterization/Stress_measurement|Film stress]]||||||||x||||||||||||||||||x   7)||||||||||||||
+|align="left"| [[Specific_Process_Knowledge/Characterization/Stress_measurement|Film stress]]||||||||x||||||||||||||||||x   <sup>{{fn|7}}</sup>||||||||||||||
 |-
 |-style="background:#C0C0C0;" align="center"
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 |-
 |-style="background:#DCDCDC;" align="center"
-|align="left"| Reflectivity||||||||||||x||x||||||x 6)||||||||||||||||||||x
+|align="left"| Reflectivity||||||||||||x||x||||||x <sup>{{fn|6}}</sup>||||||||||||||||||||x
 |-
 |-style="background:#C0C0C0;" align="center"
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 |-
 |-style="background:#C0C0C0;" align="center"
-|align="left"| Step coverage||x  1)||x   1)||||||||||||||||||||||||||||||||||||
+|align="left"| Step coverage||x  <sup>{{fn|1}}</sup>||x   <sup>{{fn|1}}</sup>||||||||||||||||||||||||||||||||||||
 |-
 |-style="background:#DCDCDC;" align="center"
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 |-
 |-style="background:#DCDCDC;" align="center"
-|align="left"| [[Specific_Process_Knowledge/Characterization/Measurement_of_film_thickness_and_optical_constants|Thin film thickness]]||x  1)||x   1)||x   2)||x   2)||x  ||x||x||||||x 5)||x   3)||||x||||||||||||||
+|align="left"| [[Specific_Process_Knowledge/Characterization/Measurement_of_film_thickness_and_optical_constants|Thin film thickness]]||x  <sup>{{fn|1}}</sup>||x   <sup>{{fn|1}}</sup>||x   <sup>{{fn|2}}</sup>||x   <sup>{{fn|2}}</sup>||x  ||x||x||||||x <sup>{{fn|5}}</sup>||x   <sup>{{fn|3}}</sup>||||x||||||||||||||
 |-
 |-style="background:#C0C0C0;" align="center"
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 |-
 |-style="background:#DCDCDC;" align="center"
-|align="left"| [[Specific_Process_Knowledge/Characterization/Thickness_Measurer|Wafer thickness]]||x  1)||x   1)||||||||||||x||||||||||||||||||||||||
+|align="left"| [[Specific_Process_Knowledge/Characterization/Thickness_Measurer|Wafer thickness]]||x  <sup>{{fn|1}}</sup>||x   <sup>{{fn|1}}</sup>||||||||||||x||||||||||||||||||||||||
 |-
 |-style="background:#C0C0C0;" align="center"
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 |-
 |}
+<br clear="all">
+<sup>{{fn|1}}</sup> Using the cross section method<br>
+<sup>{{fn|2}}</sup> Using the create step method<br>
+<sup>{{fn|3}}</sup> With known resistivity<br>
-# Using the cross section method
+<sup>{{fn|4}}</sup> Composition information for crystalline materials<br>
-# Using the create step method
+<sup>{{fn|5}}</sup> Only single layer<br>
-# With known resistivity
+<sup>{{fn|6}}</sup> Good for characterization of VCSEL structures and DBR mirrors<br>
-# Composition information for crystalline materials
+<sup>{{fn|7}}</sup> Only for crystalline films<br>
-# Only single layer
-# Good for characterization of VCSEL structures and DBR mirrors
-# Only for crystalline films
 == Choose characterization topic ==
@@ Line 144: / Line 141: @@
 ===AFM===
-*[[/AFM: Atomic Force Microscopy|AFM - ''Atomic Force Microscopy'']]
+*[[/AFM: Atomic Force Microscopy|''Atomic Force Microscopy (AFM)'']]
 ===Electrical measurements===
-*[[/4-Point Probe|4-Point Probe]]
+*[[/Four-Point Probe|4-Point Probe]]
 *[[/Probe station|Probe station]]
 *[[/III-V ECV-profiler|III-V ECV-profiler (Electrochemical Capacitance-Voltage carrier density profiler)]]
@@ Line 156: / Line 153: @@
 ===Optical and stylus profilers===
-*[[/Profiler#Optical_Profiler_(Sensofar)|Optical Profiler (Sensofar)]]
+*[[/Sensofar_S_Neox|Sensofar S Neox (Optical Profiler)]]
-*[[/Profiler#Dektak XTA_new stylus profiler|Dektak XTA stylus profiler]]
+*[[/Dektak_XTA|Dektak XTA (Stylus Profiler)]]
-*[[/Profiler#Stylus Profiler (Tencor P17)|P17 stylus profiler from KLA-Tencor]]
+*[[/Tencor_P17|Tencor P17 (Stylus Profiler)]]
-*[[/Profiler#Dektak_III-V_Profiler|Dektak 3ST stylus profiler]]
+*[[/Dektak_3ST|Dektak 3ST (Stylus profiler)]]
-*[[/Profiler#Stylus_Profiler:_Dektak150|Stylus Profiler:Dektak150]]
+*[[/Dektak_150|Dektak 150 (Stylus Profiler)]]
 ===Optical microscopes===
@@ Line 173: / Line 170: @@
 ===SEMs at DTU Nanolab - building 307/314===
 <!-- *[[LabAdviser/CEN/Quanta 3D FIB/SEM|FIB-SEM FEI QUANTA 200 3D]] -->
-*[[LabAdviser/CEN/Helios Nanolab 600|Dual Beam FEI Helios Nanolab 600]]
+*[[LabAdviser/314/Microscopy 314-307/FIB/Helios|Dual Beam FEI Helios Nanolab 600]]
-*[[LabAdviser/CEN/Nova NanoSEM 600|SEM FEI Nova 600 NanoSEM]]
+*[[LabAdviser/314/Microscopy 314-307/SEM/Nova|SEM FEI Nova 600 NanoSEM]]
-*[[LabAdviser/CEN/Quanta FEG 200 ESEM|SEM FEI Quanta 200 ESEM FEG]]
+*[[
+LabAdviser/314/Microscopy 314-307/SEM/QFEG|SEM FEI Quanta 200 ESEM FEG]]
 <!-- *[[LabAdviser/CEN/Inspect S|SEM Inspect S]] -->
@@ Line 186: / Line 184: @@
 ===TEMs at DTU Nanolab - building 307/314===
-*[[LabAdviser/CEN/Titan ATEM |Titan ATEM]]
+*[[LabAdviser/314/Microscopy 314-307/TEM/ATEM |Titan ATEM]]
-*[[LabAdviser/CEN/Titan ETEM |Titan ETEM]]
+*[[LabAdviser/314/Microscopy 314-307/TEM/ETEM |Titan ETEM]]
-*[[LabAdviser/CEN/Tecnai TEM |Tecnai TEM]]
+*[[LabAdviser/314/Microscopy 314-307/TEM/T20 |Tecnai TEM]]
 ===XRD===
@@ Line 204: / Line 202: @@
 ==Decommissioned equipment==
 *[[/KLA-Tencor Surfscan 6420|KLA-Tencor Surfscan 6420]]
-*[[/X-Ray Diffractometer|Phillips X-Ray Diffractometer that was owned by DTU Fotonik]]
+*[[/X-Ray Diffractometer|Phillips X-Ray Diffractometer (owned by DTU Fotonik)]]