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'''Feedback to this page''': '''[mailto:labadviser@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php?title=Specific_Process_Knowledge/Thin_film_deposition/thermalevaporator click here]'''  
'''Feedback to this page''': '''[mailto:labadviser@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php?title=Specific_Process_Knowledge/Thin_film_deposition/thermalevaporator click here]'''  


<i> This page is written by <b>DTU Nanolab staff</b></i>
<i> This page is written by <b>DTU Nanolab staff</b></i>
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==Thermal evaporator- A system for deposition of metals==
==Thermal evaporator for metal deposition==
[[Image:IMG_2592_edit.jpg|300x300px|thumb| Positioned in cleanroom A-1.]]
[[Image:IMG_2592_edit.jpg|300x300px|thumb| Positioned in cleanroom A-1.]]


This evaporator is intuitive to operate and does not have a lot of bells and whistles. You can see the instrument specifications below.
This instrument is NANO 36 Thermal evaporator from Kurt J. Lesker. Instrument specifications below. It takes around 1 hour for a round of deposition (depending on thickness and rate of course). The small chamber means that the deposited thickness may vary quite a bit across large samples, as further described in the specifications table.  


The main purpose of the thermal evaporator is to deposit Al for removing charging of the resist when doing EBL on isolating substrate. It can also be used for Cr evaporation for the same purpose, and evaporation of Ag, Au, Cu, and Ge. We have also attempted to evaporate Zn, but this resulted in heavy contamination of the chamber that required a lot of effort to clean and the process was not stable.  
The main purpose of this evaporator is to deposit Al for dissipation of charge when doing electron beam lithography on insulating substrates. It can also be used for Cr evaporation for the same purpose. The advantage of Al is that it can be removed simultaneously with the e-beam resist. However Cr may allow even better resolution of the lithography.
 
Additionally we have processes for evaporation of Ag, Au, Cu, and Ge. We have also attempted to evaporate Zn, but this resulted in heavy contamination of the chamber. You are always welcome to ask for other metals in the machine.  


Up to two sources can be present at the same time (metals in a boat, crucible or rod for evaporation) but there is only one power supply, so only one material can be evaporated at a time.
Up to two sources can be present at the same time (metals in a boat, crucible or rod for evaporation) but there is only one power supply, so only one material can be evaporated at a time.


'''The user manual, APV, technical information and contact information can be found in LabManager:'''  
'''The user manual, APV, technical information, cross-contamination sheet and contact information can be found in LabManager:'''  
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*[[Specific Process Knowledge/Thin film deposition/Deposition of Aluminium/Thermal deposition of Al|Aluminium]]
*[[Specific Process Knowledge/Thin film deposition/Deposition of Aluminium/Thermal deposition of Al|Aluminium]]
*[[Specific Process Knowledge/Thin film deposition/Deposition of Silver|Silver]]
*[[Specific Process Knowledge/Thin film deposition/Deposition of Silver/Deposition of Silver in Thermal Evaporator|Silver]]
*[[Specific Process Knowledge/Thin film deposition/Deposition of Chromium/Thermal evaporation of Cr in Thermal evaporator|Chromium]]
*[[Specific Process Knowledge/Thin film deposition/Deposition of Chromium/Thermal evaporation of Cr in Thermal evaporator|Chromium]]
*[[Specific Process Knowledge/Thin film deposition/Deposition of Germanium/Thermal Ge evaporation Thermal Evaporator|Germanium]]
*[[Specific Process Knowledge/Thin film deposition/Deposition of Germanium/Thermal Ge evaporation Thermal Evaporator|Germanium]]
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!style="background:silver; color:black" align="left" valign="top" rowspan="5"|Performance
!style="background:silver; color:black" align="left" valign="top" rowspan="5"|Performance
|style="background:LightGrey; color:black"|Film thickness||style="background:WhiteSmoke; color:black"|
|style="background:LightGrey; color:black"|Film thickness||style="background:WhiteSmoke; color:black"|
*10Å - 1µm (Al and Ag)
*10Å - 1µm (Al)
*up to 100 nm (Cr) (ask if you wish to deposit more)
*10Å - 0.5µm (Ag)
*for other metals ask if in doubt
*up to 100 nm (Cr)
*ask the [mailto:thinfilm@nanolab.dtu.dk Thin Film group] if in doubt or if you wish to exceed the limits
|-
|-
|style="background:LightGrey; color:black"|Deposition rate
|style="background:LightGrey; color:black"|Deposition rate
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|style="background:LightGrey; color:black"|Batch size
|style="background:LightGrey; color:black"|Batch size
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
*Up to 8" wafer
*Up to 1 x 6 " or 8" wafer
*Or several smaller pieces
*Up to 3 x 4" wafers
*Many smaller pieces
*Deposition on one side of the substrate
*Deposition on one side of the substrate
|-
|-
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