Specific Process Knowledge/Thin film deposition/Deposition of Aluminium: Difference between revisions

@@ Line 7: / Line 7: @@
 == Deposition of Aluminium ==
-Aluminium can be deposited by e-beam evaporation, sputtering and thermal evaporation. In the chart at the bottom of the page we compare the different methods and available equipment.
+Aluminium can be deposited by e-beam evaporation, sputtering and thermal evaporation. In the chart below we compare the different methods and available equipment.
 ==Sputtering of Aluminium==
@@ Line 149: / Line 148: @@
 ==Aluminium deposition on AZ5214 for lift-off==
-Negative photolithography process is recomended.
+Negative photolithography process is recommended.
-Positive photolithography process from 1,5 µm is possible especially for thin layers of metal.
+Positive photolithography process from 1.5 µm is possible especially for thin layers of metal.
-The more pattern the easyer lift.
+The more pattern the easier the lift-off.
-It was tried (jan09) to lift 2.5 µm Al on 4.2µ negative resist on top of 11 µm Apox SiO2 in an acetone sonic-bath.
+It was tried (jan09) to lift 2.5 µm Al on 4.2 µm negative resist on top of 11 µm APOX SiO2 in an acetone sonic-bath.
-The Al deposition process was done in steps evaporating 500 nm a time with 5 min pause and pressure down to at least 2E-6.
+The Al deposition was done in steps evaporating 500 nm a time with 5 min pause and pressure down to at least 2 E-6 mbar before proceeding.