Specific Process Knowledge/Thin film deposition/Deposition of Aluminium: Difference between revisions
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== Deposition of Aluminium == | == Deposition of Aluminium == | ||
Aluminium can be deposited by e-beam evaporation, sputtering and thermal evaporation. In the chart | Aluminium can be deposited by e-beam evaporation, sputtering and thermal evaporation. In the chart below we compare the different methods and available equipment. | ||
==Sputtering of Aluminium== | ==Sputtering of Aluminium== | ||
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==Comparison of Al deposition options== | ==Comparison of Al deposition options== | ||
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Almost any that does not degas. See the [http://labmanager.dtu.dk/function.php?module=XcMachineaction&view=edit&MachID=404 cross-contamination sheet]. | Almost any that does not degas. See the [http://labmanager.dtu.dk/function.php?module=XcMachineaction&view=edit&MachID=404 cross-contamination sheet]. | ||
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==Aluminium deposition on AZ5214 for lift-off== | ==Aluminium deposition on AZ5214 for lift-off== | ||
Negative photolithography process is | Negative photolithography process is recommended. | ||
Positive photolithography process from 1.5 µm is possible especially for thin layers of metal. | |||
The more pattern the easier the lift-off. | |||
It was tried (jan09) to lift 2.5 µm Al on 4.2 µm negative resist on top of 11 µm APOX SiO2 in an acetone sonic-bath. | |||
The Al deposition was done in steps evaporating 500 nm a time with 5 min pause and pressure down to at least 2 E-6 mbar before proceeding. | |||