Specific Process Knowledge/Back-end processing/Polishing machine: Difference between revisions

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-Details will come by the end of 2012. See LabManager for now.
+{{cc-nanolab}}
-/Jesper Hanberg
+'''Feedback to this page''': '''[mailto:danchipsupport@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://http://labadviser.danchip.dtu.dk/index.php?title=Specific_Process_Knowledge/Back-end_processing/Die_Bonder click here]'''
+'''<p style="color:red;">The Polisher/Lapper has been decomissioned end of 2024.</p>
+== Polisher/Lapper ==
+The Logitech PM5 Polisher/Lapper is for thinning down wafers and other substrates.
+==Equipment performance and process related parameters==
+[[File:IMG_20230228_113121.jpg|thumb|350px|PM5 lapper in Fume hood]]
+{| border="2" cellspacing="0" cellpadding="2"
+!colspan="2" border="none" style="background:silver; color:black;" align="center"|Equipment
+|style="background:WhiteSmoke; color:black"|<b>Polisher/Lapper</b>
+<!-- |style="background:WhiteSmoke; color:black"|<b>Equipment 2</b> -->
+|-
+!style="background:silver; color:black;" align="center" width="60"|Purpose
+|style="background:LightGrey; color:black"|
+Thinning of substrates of
+|style="background:WhiteSmoke; color:black"|
+*InP
+*GaAs
+*Silicon
+*Metals
+*Glass/Quartz
+<!-- |style="background:WhiteSmoke; color:black"|
+*Purpose 1
+*Purpose 2
+*Purpose 3 -->
+|-
+!style="background:silver; color:black" align="center" valign="center" rowspan="2"|Performance
+|style="background:LightGrey; color:black"| Thinning
+|style="background:WhiteSmoke; color:black"|
+*Removal rate: 1-10µm/min
+*Thickness accuracy: +/- 10 µm
+*Thickness homogeneity: +/- 10 µm
+*Roughness: +/- ? µm
+<!-- |style="background:WhiteSmoke; color:black"|
+*Performance range 1
+*Performance range 2
+*Performance range 3 -->
+|-
+|style="background:LightGrey; color:black"|Polishing
+|style="background:WhiteSmoke; color:black"|
+*Removal rate: ~1 µm/min
+*Thickness accuracy: ? µm
+*Thickness homogeneity: ? µm
+*Roughness: +/- ? µm
+<!-- |style="background:WhiteSmoke; color:black"|
+*Performance range -->
+|-
+!style="background:silver; color:black" align="center" valign="center" rowspan="4"|Process parameter range
+|style="background:LightGrey; color:black"|Polishing liquid
+|style="background:WhiteSmoke; color:black"|
+*Al2O3 (alumina) powder: 3, 9 or 20 µm
+*Chemlox (for polishing)
+*SF1 Polishing Fluid (for polishing e.g. SiO2)
+|-
+|style="background:LightGrey; color:black"|Polishing cloths
+|style="background:WhiteSmoke; color:black"|
+*Chemcloth Polishing Cloths (for use with SF1 liquid)
+|-
+|style="background:LightGrey; color:black"|Rotation speed
+|style="background:WhiteSmoke; color:black"|
+*Thinning: 5-20 rpm
+*Polishing: 5-80 rpm
+|-
+|style="background:LightGrey; color:black"|Arm sweep
+|style="background:WhiteSmoke; color:black"|
+*Thinning: stationary
+*Polishing: 12% (inner) - 80% (outer)
+|-
+!style="background:silver; color:black" align="center" valign="center" rowspan="3"|Substrates
+|style="background:LightGrey; color:black"|Batch size
+|style="background:WhiteSmoke; color:black"|
+*<nowiki>#</nowiki> small samples
+*one 50 mm wafer
+*one 100 mm wafer
+<!-- |style="background:WhiteSmoke; color:black"|
+*<nowiki>#</nowiki> small samples
+*<nowiki>#</nowiki> 50 mm wafers
+*<nowiki>#</nowiki> 100 mm wafers
+*<nowiki>#</nowiki> 150 mm wafers -->
+|-
+| style="background:LightGrey; color:black"|Allowed materials
+|style="background:WhiteSmoke; color:black"|
+*InP
+*GaAs
+*Silicon
+*Metals
+*Glass/Quartz
+<!-- |style="background:WhiteSmoke; color:black"|
+*Allowed material 1
+*Allowed material 2
+*Allowed material 3 -->
+|-
+|}
+[[File:IMG_20230228_113134.jpg|thumb|left|300px|lapping jig]]
+[[File:IMG_20230228_113127.jpg|thumb|1000px|mounting/measuring space]]
+<br clear="all" />