Specific Process Knowledge/Back-end processing/Polishing machine: Difference between revisions

@@ Line 3: / Line 3: @@
 '''Feedback to this page''': '''[mailto:danchipsupport@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://http://labadviser.danchip.dtu.dk/index.php?title=Specific_Process_Knowledge/Back-end_processing/Die_Bonder click here]'''
+'''<p style="color:red;">The Polisher/Lapper has been decomissioned end of 2024.</p>
-<big>''' Machine decommissioned end of 2024 '''
-</big>
 == Polisher/Lapper ==
-'''<p style="color:red;">The Polisher/Lapper has been decomissioned end of 2024.</p>
-<!-- copyright issue rkc -->
-<!-- copyright issue rkc [[image:Logitech pm5 1.jpg|400px|right|thumb|The Logitech PM5 Polisher/Lapper]]
-Training is required before using th machine. The machine is equipped with a LabManager lock.-->
-The Logitech PM5 Polisher/Lapper is for thinning down wafers and other substrates.
-'''The user manual, user APV, technical information and contact information can be found in LabManager:'''
-<!-- remember to remove the type of documents that are not present -->
-<!-- give the link to the equipment info page in LabManager: -->
+The Logitech PM5 Polisher/Lapper is for thinning down wafers and other substrates.
-[http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=299 The Logitech PM5 Polisher/Lapper in LabManager]
 ==Equipment performance and process related parameters==