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Specific Process Knowledge/Back-end processing/Polishing machine: Difference between revisions

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'''Feedback to this page''': '''[mailto:danchipsupport@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://http://labadviser.danchip.dtu.dk/index.php?title=Specific_Process_Knowledge/Back-end_processing/Die_Bonder click here]'''
'''Feedback to this page''': '''[mailto:danchipsupport@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://http://labadviser.danchip.dtu.dk/index.php?title=Specific_Process_Knowledge/Back-end_processing/Die_Bonder click here]'''
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'''<p style="color:red;">The Polisher/Lapper has been decomissioned end of 2024.</p>


== Polisher/Lapper ==
== Polisher/Lapper ==


[[image:Logitech pm5 1.jpg|400px|right|thumb|The Logitech PM5 Polisher/Lapper]]
Training is required before using th machine. The machine is equipped with a LabManager lock.
The Logitech PM5 Polisher/Lapper is for thinning down wafers and other substrates.


'''The user manual, user APV, technical information and contact information can be found in LabManager:'''
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The Logitech PM5 Polisher/Lapper is for thinning down wafers and other substrates.
[http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=299 The Logitech PM5 Polisher/Lapper in LabManager]


==Equipment performance and process related parameters==
==Equipment performance and process related parameters==


[[File:IMG_20230228_113121.jpg|thumb|350px|PM5 lapper in Fume hood]]
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[[File:IMG_20230228_113134.jpg|thumb|left|300px|lapping jig]]
[[File:IMG_20230228_113127.jpg|thumb|1000px|mounting/measuring space]]


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