Jump to content

Specific Process Knowledge/Thin film deposition/Furnace LPCVD Nitride: Difference between revisions

← Older edit
VisualWikitext
Pevo (talk | contribs)
DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers
2,366 edits
Mmat (talk | contribs)
NLAB-Employees-701, NLAB-LabmanagerAllUsers, Administrators
1,957 edits
mNo edit summary
 
(10 intermediate revisions by 3 users not shown)
Line 1: Line 1:
{{cc-nanolab}}
'''Feedback to this page''': '''[mailto:labadviser@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php/Specific_Process_Knowledge/Thin_film_deposition/Furnace_LPCVD_Nitride click here]'''
'''Feedback to this page''': '''[mailto:labadviser@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php/Specific_Process_Knowledge/Thin_film_deposition/Furnace_LPCVD_Nitride click here]'''


Line 4: Line 6:
[[Category: Thin Film Deposition|LPCVD nitride]]
[[Category: Thin Film Deposition|LPCVD nitride]]
[[Category: Furnaces|LPCVD nitride]]
[[Category: Furnaces|LPCVD nitride]]
==Deposition of Silicon Nitride using LPCVD==


[[image:DC_nyhed_3.jpg|320x320px|right|thumb|6" LPCVD nitride furnace (E3) located in cleanroom E-6]]
[[image:DC_nyhed_3.jpg|320x320px|right|thumb|6" LPCVD nitride furnace (E3) located in cleanroom E-6]]
[[image:Furnace_nitride1.jpg|300x300px|right|thumb|4" LPCVD nitride furnace (B2) located in cleanroom B-1]]
[[image:Furnace_nitride1.jpg|300x300px|right|thumb|4" LPCVD nitride furnace (B2) located in cleanroom B-1]]
==Deposition of Silicon Nitride using LPCVD==


DTU Nanolab has two LPCVD (Low Pressure Chemical Vapour Deposition) furnaces <!--[[Specific Process Knowledge/Thin film deposition/B2 Furnace LPCVD Nitride|LPCVD furnaces]]--> for deposition of silicon nitride:
DTU Nanolab has two LPCVD (Low Pressure Chemical Vapour Deposition) furnaces <!--[[Specific Process Knowledge/Thin film deposition/B2 Furnace LPCVD Nitride|LPCVD furnaces]]--> for deposition of silicon nitride:
Line 21: Line 22:


The LPCVD nitride has a very good step coverage, and the film thickness is very uniform over the wafers.  
The LPCVD nitride has a very good step coverage, and the film thickness is very uniform over the wafers.  


'''The user manuals, quality control procedures and results, user APVs, technical information and contact information can be found in LabManager:'''
'''The user manuals, quality control procedures and results, user APVs, technical information and contact information can be found in LabManager:'''


[http://labmanager.dtu.dk/function.php?module=Machine&view=view&mach=84 4" LPCVD nitride furnace (B2)],
[http://labmanager.dtu.dk/function.php?module=Machine&view=view&mach=84 4" LPCVD nitride furnace (B2)]  


[http://labmanager.dtu.dk/function.php?module=Machine&view=view&mach=250 6" LPCVD nitride furnace (E3)]
[http://labmanager.dtu.dk/function.php?module=Machine&view=view&mach=250 6" LPCVD nitride furnace (E3)]
[https://labmanager.dtu.dk/d4Show.php?id=1926 Furnace computer manual]
== Manual for the furnace computer to the A, B, C and E stack furnaces ==
The A, B, C and E stack furnaces can be controlled either from a touch screen by each furnace or from a furnace computer. The user manual for the furnace computer can be found here:
[[media:Furnace_computer_manual.pdf|Manual for furnace computers for the A, B, C and E stack furnaces]]




Line 42: Line 53:


*[[/Deposition of low stress nitride using the 6" LPCVD nitride furnace|Deposition of low stress nitride using the 6" LPCVD nitride furnace ]]
*[[/Deposition of low stress nitride using the 6" LPCVD nitride furnace|Deposition of low stress nitride using the 6" LPCVD nitride furnace ]]
*[[/Deposition of stoichiometric nitride using the 6" LPCVD nitride furnace|Deposition of stoichiometric nitride using the 6" LPCVD nitride furnace <span style="color:Red">(Only available for 6" wafers and special permission required)</span>]]
*[[/Deposition of stoichiometric nitride using the 6" LPCVD nitride furnace|Deposition of stoichiometric nitride using the 6" LPCVD nitride furnace <span style="color:Red">(4" wafers need a special permission using as a back up of 4" LPCVD nitride furnace, B2)</span>]]


*[[/Using LPCVD silicon nitride as a masking material for KOH etching|Using LPCVD silicon nitride as a masking material for KOH etching]]
*[[/Using LPCVD silicon nitride as a masking material for KOH etching|Using LPCVD silicon nitride as a masking material for KOH etching]]
== Manual for the furnace computer to the A, B, C and E stack furnaces ==
The A, B, C and E stack furnaces can be controlled either from a touch screen by each furnace or from a furnace computer. The user manual for the furnace computer can be found here:
[[media:Furnace_computer_manual.pdf|Manual for furnace computers for the A, B, C and E stack furnaces]]


==Equipment performance and process related parameters==
==Equipment performance and process related parameters==
Retrieved from "https://labadviser.nanolab.dtu.dk//index.php?title=Specific_Process_Knowledge/Thin_film_deposition/Furnace_LPCVD_Nitride"