LabAdviser/Process Flow/Solar cell process flow: Difference between revisions
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|Expose photoresist in aligner | |Expose photoresist in aligner | ||
|The resist layer on the wafer frontside is exposed in the aligner, with a dark field mask. Align the mask to wafer flat, and use hard contact. | |The resist layer on the wafer frontside is exposed in the aligner, with a dark field mask. Align the mask to wafer flat, and use hard contact. | ||
|Here you can see a comparison between different [[ | |Here you can see a comparison between different [[Specific Process Knowledge/Lithography/UVExposure|aligners]]. | ||
Specific Process Knowledge/Lithography/ | |||
|[[image:2 lithography mask 1.jpg|250x350px|center]] | |[[image:2 lithography mask 1.jpg|250x350px|center]] | ||
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