Template:SEM comparison table 314: Difference between revisions
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! Equipment | ! Equipment | ||
<!-- ![[Specific Process Knowledge/Characterization/SEM Inspect S|SEM Inspect S]] --> | <!-- ![[Specific Process Knowledge/Characterization/SEM Inspect S|SEM Inspect S]] --> | ||
![[LabAdviser/314/SEM/Nova|Nova]] | ![[LabAdviser/314/Microscopy 314-307/SEM/Nova|Nova]] | ||
![[LabAdviser/314/SEM/QFEG|QFEG]] | ![[LabAdviser/314/Microscopy 314-307/SEM/QFEG|QFEG]] | ||
![[LabAdviser/314/SEM/AFEG|AFEG]] | ![[LabAdviser/314/Microscopy 314-307/SEM/AFEG|AFEG]] | ||
![[LabAdviser/314/FIB/Helios|Helios]] | ![[LabAdviser/314/Microscopy 314-307/FIB/Helios|Helios]] | ||
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*X Ray Analysis with EDS | *X Ray Analysis with EDS | ||
*Crystallographic analysis using EBSD and both On and Off axis TKD | *Crystallographic analysis using EBSD and both On and Off axis TKD | ||
* In-situ experiments with Heating and Gas injection | |||
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*Conductive samples in High Vac | *Conductive samples in High Vac | ||
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*Conductive samples in High Vac | *Conductive samples in High Vac | ||
*Charge reduction in Low Vac | *Charge reduction in Low Vac | ||
*X Ray Analysis with EDS and WDS | |||
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*Conductive samples in High Vac | *Conductive samples in High Vac | ||
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** 4.0nm at 30kV (BSE) | ** 4.0nm at 30kV (BSE) | ||
** > 12nm at 3kV (SE) --> | ** > 12nm at 3kV (SE) --> | ||
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*High Vacuum operation in Mode II: | |||
**1.0 nm at 15 kV (TLD detector and optimum working distance) | |||
**1.8 nm at 1 kV (TLD detector and optimum working distance) | |||
*Low Vacuum operation in Mode II: | |||
**1.5 nm at 10 kV (Helix detector and optimum working distance) | |||
**1.8 nm at 3 kV (Helix detector and optimum working distance) | |||
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* High vacuum | * High vacuum | ||
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**3.0 nm at 3 kV (SE) | **3.0 nm at 3 kV (SE) | ||
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* Electron Column | * Electron Column Operation in Mode II | ||
**0.8nm @15kV | **0.8nm @15kV | ||
**0.9nm @1kV | **0.9nm @1kV | ||
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* Z 50mm | * Z 50mm | ||
* R 360⁰ | * R 360⁰ | ||
* T 70⁰ | * T 70⁰ Manual | ||
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* X 150mm Piezo | * X 150mm Piezo | ||