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Specific Process Knowledge/Lithography/EBeamLithography/FirstEBL: Difference between revisions

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*AR-600-71  
*AR-600-71  
*Remover 1165
*Remover 1165
|[[media:Process_Flow_CSAR.docx‎|CSAR]] <br> [[media:Process Flow CSAR with Al.docx|CSAR with Al]] <br> [[media:Process_Flow_LOR5A_CSAR_Developer_TMAH_Manual.docx|LOR5A with CSAR]] <br>  
|[[Media:Process Flow CSAR.docx|CSAR]] <br> [[Media:Process Flow CSAR with Al.docx|CSAR with Al]] <br> [[Media:Process Flow LOR5A CSAR Developer TMAH Manual.docx|LOR5A with CSAR]] <br>  


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*Login to the support PC using your DTU credentials.
*Login to the support PC using your DTU credentials.
*Open “FFFTP”
*Open the “FFFTP setup” folder found on the desktop
*Click “New connection” and fill the fields as shown in the "Host Setting" window below
*Double click "FFFTP setup.reg" and accept the warnings
*Password is "Jeoleb"
*Initial Local Folder should be your own M-drive or similar


Now FFFTP is setup with access to the JEOL 9500 computer on your Windows account. Open FFFTP and click "Connect" in. It should open with your M drive on the left side and the JEOL9500 PC on the right hand side. You can now drag and drop files between the two folders or browse for other folders. The SDF and JDF files go in the same folder, the pattern data however goes into a separate folder. The correct folders are:
*SDF/JDF: /home/eb0/jeoleb/job/1nlab
*V30: /home/eb0/jeoleb/pattern/nanolabv30


{| style="border: none; border-spacing: 0; margin: 1em auto; text-align: center;"
{| style="border: none; border-spacing: 0; margin: 1em auto; text-align: center;"
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| [[image:FFFTP.png|1200px]]
| [[image:FFFTP2.png|800px]]
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Setup of FFFTP connection to the JEOL 9500 control PC and user interface of the FFFTP file transfer program. Local drive is on the left window and destination drive is on the right window.
User interface of the FFFTP file transfer program. Local drive is on the left window and destination drive is on the right window.
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Now you can click "Connect" in FFFTP and it opens with your drive on the left side and the JEOL9500 PC on the right hand side. You can now drag and drop files between the two folders. The SDF and JDF files go in the same folder, the pattern data however goes into a separate folder. The correct folders are:
*SDF/JDF: /home/eb0/jeoleb/job/danchip
*V30: /home/eb0/jeoleb/pattern/danchipv30


=Job file compilation=
=Job file compilation=
Once the files are transferred to the EBL control computer they can be compiled into a magazine file. The Unix interface has several desktops. Desktop one is used for EBL control and desktop two is used for file compilation. In a terminal window on desktop two the SDF, JDF and V30 files can be compiled into a MGN file with the SCHD command. Compile the files with the following procedure
Once the files are transferred to the EBL control computer they can be compiled into a magazine file. The Unix interface has several desktops. Desktop one is used for EBL control and desktop two is used for file compilation. In a terminal window on desktop two the SDF, JDF and V30 files can be compiled into a MGN file with the SCHD command. Compile the files with the following procedure:


*Select a terminal window
*Select a terminal window
*Make sure to be in the correct folder by writing "cd job/danchip"
*Make sure to be in the correct folder by writing "cd job/1nlab"
*Compile by writing "schd -exptime sdffilename", replacing sdffilename with the actual filename
*Compile by writing "schd -exptime sdffilename", replacing sdffilename with the actual filename
*Verify that the compiler presents a sequence list with a time estimate, this indicates successful compilation
*Verify that the compiler presents a sequence list with a time estimate, this indicates successful compilation
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Terminal window after compilation. The first line changes working directory, second line calls compilation. Image: Thomas Pedersen.
Terminal window after compilation. The first line changes working directory, second line calls compilation.
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If compilation is successful the terminal will provide a table of exposure sequences and their corresponding exposure times. Also, a .MGN file will be generated in the same folder as the SDF file. This file holds all relevant exposure information and it is this file one will load to the Expose module to initiate exposure.
 
If compilation is successful the terminal will provide a table of exposure sequences and their corresponding exposure times. Also, a .MGN file will be generated in 1nlab folder. This file contains all relevant exposure information and it is this file one will load to the Expose module to initiate exposure.


If compilation does not succeed the terminal will respond with a number of errors indicating which line(s) of the SDF or JDF file is causing the error. The system is extremely sensitive to syntax error and all users will experience compilation errors. The errors can be difficult to decipher, please refer to the '''Compilation Error Guide. UPDATE'''
If compilation does not succeed the terminal will respond with a number of errors indicating which line(s) of the SDF or JDF file is causing the error. The system is extremely sensitive to syntax error and all users will experience compilation errors. The errors can be difficult to decipher, please refer to the '''Compilation Error Guide. UPDATE'''


=Job file verification=
=Job file verification=
To ensure that the pattern and exposure parameters are correct the MGN file should always be verified to some extent. It is rarely feasible or necesarry to manually validate all parts of a design but one should at least inspect a few parts of the pattern to verify it looks correct and also verify that pattern placement is as expected. This can be done using the Array Check Program '''(ACHK)''' found on the '''Analysis''' pane. The '''Analysis''' pane is usually open on the right hand side of the second desktop, if not, it can be opened from the '''EBX Menu.''' Pattern check can be done by the following procedure
To ensure that the pattern and exposure parameters are correct the MGN file should always be verified to some extent. It is rarely feasible or necessary to manually validate all parts of a design but one should at least inspect a few parts of the pattern to verify it looks correct and also verify that pattern placement is as expected. This can be done using the Array Check Program '''(ACHK)''' found on the '''Analysis''' pane. The '''Analysis''' pane is usually open on the right hand side of the second desktop, if not, it can be opened from the '''EBX Menu.''' Pattern check can be done by the following procedure:


*Open '''ACHK''' from the '''Analysis''' pane
*Open '''ACHK''' from the '''Analysis''' pane
*Click  “File” -> “Open” and open your magazine file
*Click  “File” -> “Open” and open your magazine file
*The pattern placement is now shown. Zoom into the pattern by left click and drag a box to zoom on
*The pattern placement is now shown. Zoom into the pattern by left click and drag a box to zoom in
*Click an instance of the pattern, it changes color to red
*Click an instance of the pattern, it changes color to red
*To the se actual pattern of the selected instance click '''View''' -> '''Shot shape display...'''
*To see the actual pattern of the selected instance click '''View''' -> '''Shot shape display...'''
*In '''Shot shape display''' click '''Simulation'''  
*In '''Shot shape display''' click '''Simulation'''  
*Change the '''Objective aperture''' on the drop down to the correct aperture, in this case aperture 6 and click '''OK'''. This will set the correct beam size for visualization  
*Change the '''Objective aperture''' on the drop down to the correct aperture, in this case aperture 6 and click '''OK'''. This will set the correct beam size for visualization  
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'''ACHK''' shows how patterns are placed on the substrate. It will however only show the bounding box of the pattern. In this case the pattern is very small compared to the 4" wafer and thus one has to zoom into the center to see the 10 instances of the design. Image: Thomas Pedersen.
'''ACHK''' shows how patterns are placed on the substrate. It will however only show the bounding box of the pattern. In this case the pattern is very small compared to the 4" wafer and thus one has to zoom into the center to see the 10 instances of the design.
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Use Shot shape display to verify that the pattern and beam pitch/overlap looks as intended. Image: Thomas Pedersen.
Use Shot shape display to verify that the pattern and beam pitch/overlap looks as intended.
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Operation screen of the automatic cassette transfer system / auto stocker. Photo: Thomas Pedersen.
Operation screen of the automatic cassette transfer system / auto stocker.
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Samples can be loaded into appropriate cassettes on the cassette preparation table. Photo: Thomas Pedersen.
Samples can be loaded into appropriate cassettes on the cassette preparation table.
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'''Calibration''' and '''RESTOR''' windows. Image: Thomas Pedersen.
'''Calibration''' and '''RESTOR''' windows.
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Result display of current measurement. Image: Thomas Pedersen.
Result display of current measurement.
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Correct result of '''INITAE''' (left) and '''INITBE''' (right). Image: Thomas Pedersen.
Correct result of '''INITAE''' (left) and '''INITBE''' (right).  
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Load the '''daily''' batch command and execute it. Image: Thomas Pedersen.
Load the '''daily''' batch command and execute it.
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Comparison of two drift measurements. Image: Thomas Pedersen.
Comparison of two drift measurements.  
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Parameters of the '''HEIMAP''' subprogram used for the tutorial exposure. Image: Thomas Pedersen.
Parameters of the '''HEIMAP''' subprogram used for the tutorial exposure.  
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Acquire the calibration data and then apply the data to save. Image: Thomas Pedersen.
Acquire the calibration data and then apply the data to save.  
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'''Expose''' window with .mgn file loaded for exposure. Notice that the '''Progress''' part of the window still shows the previous exposure information. This field will not update until exposure is started. Image: Thomas Pedersen.
'''Expose''' window with .mgn file loaded for exposure. Notice that the '''Progress''' part of the window still shows the previous exposure information. This field will not update until exposure is started.  
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Use the '''Pattern writing execution check''' window to verify the cassette number and estimated execution time. Image: Thomas Pedersen.
Use the '''Pattern writing execution check''' window to verify the cassette number and estimated execution time.  
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=Development=
=Development=
Development of EBL resist can be done in two ways, either in beakers or on the semi-automatic E-beam developer tool, [[Specific_Process_Knowledge/Lithography/Development#Developer:_E-beam|Developer:E-beam.]] The latter is equipped with ZED N50 for development of ZEP resist and AR 600-546 for development of CSAR. The system can handle chips or wafers up to 6”. It has predefined develop cycle times of 15, 30, 60 and 120 seconds. For other developers users have to use the EBL development fumehood in E4 and manually develop their substrates in beakers of appropriate size. Please observe there are beakers dedicated solvent developers such as isopropanol and other beakers dedicated alkaline developers.  
Development of EBL resist can be done in two ways, either in beakers or on the semi-automatic E-beam developer tool, [[Specific_Process_Knowledge/Lithography/Development#Developer:_E-beam|Developer:E-beam.]] The latter is equipped with ZED N50 for development of CSAR (AR-P 6200). The system can handle chips or wafers up to 8”. It has predefined develop cycle times of 15, 30, 60 and 120 seconds. For other developers users have to use the EBL development fumehood in E4 and manually develop their substrates in beakers of appropriate size. Please observe there are beakers dedicated solvent developers such as isopropanol and other beakers dedicated alkaline developers.  


For this turorial job we simply put the 4" wafer on the center of the vacuum chuck, clamp it with vacuum, select the 60 sec AR 600-546 recipe and press start.
For this turorial job we simply put the 4" wafer on the center of the vacuum chuck, clamp it with vacuum, select the 60 sec recipe and press start.


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{| style="border: none; border-spacing: 0; margin: 1em auto; text-align: center;"
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Developer: E-beam is a semi-automatic puddle developer with AR 600-546 and ZED N50 developers. Image: Thomas Pedersen.
Developer: E-beam is a semi-automatic puddle developer with ZED N50 developer.
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Result of the tutorial job after development. Image: Thomas Pedersen.
Result of the tutorial job after development.
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