Specific Process Knowledge/Thin film deposition/Wordentec: Difference between revisions
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'''Feedback to this page''': '''[mailto:labadviser@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.labadviser.dtu.dk/index.php/Specific_Process_Knowledge/Thin_film_deposition/Wordentec click here]''' | |||
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[[Category:Equipment|Thin film Wordentec]] | |||
[[Category:Thin Film Deposition|Wordentec]] | |||
'''<p style="color:red;">The Wordentec QCL 800 has been decomissioned in 2025.</p>''' | |||
==Wordentec QCL 800== | ==Wordentec QCL 800== | ||
[[Image:Wordentec.jpg|300x300px|thumb|Wordentec: positioned in cleanroom D-2 in the Wordentec room]] | [[Image:Wordentec.jpg|300x300px|thumb|Wordentec: positioned in cleanroom D-2 in the Wordentec room]] | ||
The Wordentec is a machine for: | The Wordentec is a machine for: | ||
*Deposition of | *Deposition of metals by e-beam evaporation | ||
*Deposition of | *Deposition of metals by thermal evaporation | ||
*Deposition of materials | *Deposition of materials by DC sputtering | ||
*Cleaning | *Cleaning samples before deposition by Argon RF sputter cleaning | ||
The Wordentec is designed to deposit on 1-6 samples in sequence | |||
Adaptors exist for deposition on 2", 4" and 6" wafers | The Wordentec is designed to deposit on 1-6 samples in sequence. | ||
The Wordentec supports either single sample deposition on each sample or batch deposition | Adaptors exist for deposition on 2", 4" and 6" wafers and deposition is possible on samples of almost any size and shape, as long as they do not exceed a 6" diameter. | ||
The Wordentec supports either single sample deposition for running a separate recipe on each sample or batch deposition for six wafers in sequence. It is possible to freely combine processes from the machine's different sources. | |||
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<!-- give the link to the equipment info page in LabManager: --> | <!-- give the link to the equipment info page in LabManager: --> | ||
[http://labmanager | [http://labmanager.dtu.dk/function.php?module=Machine&view=view&mach=167 Wordentec in LabManager] | ||
==Process information== | ==Process information== | ||
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[http://labadviser. | [http://labadviser.nanolab.dtu.dk/index.php/Specific_Process_Knowledge/Thin_film_deposition/Deposition_of_Gold#Studies_of_Au_deposition_processes_in_the_Wordentec| Temperature and roughness studies of Au deposition processes in the Wordentec] | ||
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It is possible to sputter deposit almost any material, provided that it is possible to deposit with DC | It is possible to sputter deposit almost any material, provided that it is possible to deposit with DC | ||
sputtering. The materials available currently | sputtering. The materials available currently include: | ||
*[[Specific Process Knowledge/Thin film deposition/Deposition of TiW|TiW]] alloy (10%/90% by weight) | *[[Specific Process Knowledge/Thin film deposition/Deposition of TiW|TiW]] alloy (10%/90% by weight) | ||
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===Thickness measurement=== | ===Thickness measurement=== | ||
Read about how the machine measures the thickness of the growing film using a quartz crystal monitor [[Specific_Process_Knowledge/Thin_film_deposition/Temescal# | Read about how the machine measures the thickness of the growing film using a quartz crystal monitor [[Specific_Process_Knowledge/Thin_film_deposition/Temescal/Good to know about the Temescal#Deposition rate and thickness measurement accuracy|'''here''']]. | ||
===Particulates in the films=== | ===Particulates in the films=== | ||
Read about some tests that we made of particulates in e-beam evaporated Al, Ni, and TiAu films made in the Wordentec and the Temescal | Read about some tests that we made of particulates in e-beam evaporated Al, Ni, and TiAu films made in the Wordentec and the Temescal | ||
[[Specific_Process_Knowledge/Thin_film_deposition/Temescal | [[Specific_Process_Knowledge/Thin_film_deposition/Temescal/Particulates in Temescal Au films|'''here''']]. | ||
==Equipment performance and process related parameters Wordentec== | ==Equipment performance and process related parameters Wordentec== | ||
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'''*''' ''For e-beam evaporation and sputtering, permission is required for thicknesses above 600 nm. For thermal evaporation, permission is required for thicknesses above 120 nm. This is to ensure that there will be enough material present. Contact metal@ | '''*''' ''For e-beam evaporation and sputtering, permission is required for thicknesses above 600 nm. For thermal evaporation, permission is required for thicknesses above 120 nm. This is to ensure that there will be enough material present. Contact metal@nanolab.dtu.dk or thinfilm@nanolab.dtu.dk'' | ||
'''**''' ''Percent variation calculated as (Max-Min)/Average. For thermally evaporated Al, the max was on one side of the wafer rather than in the middle. Measured by Rebecca Ettlinger, Nov. 2018.'' | |||