Specific Process Knowledge/Etch/III-V ICP: Difference between revisions
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'''Feedback to this page''': '''[mailto:labadviser@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php?title=Specific_Process_Knowledge/Etch/III-V_ICP click here]''' | '''Feedback to this page''': '''[mailto:labadviser@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php?title=Specific_Process_Knowledge/Etch/III-V_ICP click here]''' | ||
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[[Image:III-VICP.jpg |300x300px|thumb|The SPTS III/V ICP in the | [[Image:III-VICP.jpg |300x300px|thumb|The SPTS III/V ICP in the DTU Nanolab cleanroom B-1]] | ||
== The III-V ICP == | == The III-V ICP == | ||
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Name: PRO ICP <br> | Name: PRO ICP <br> | ||
Vendor: STS (now SPTS) <br> | Vendor: STS (now SPTS) <br> | ||
The III-V ICP is a state-of-the-art etch tool. The combination of advanced hardware and software enables you to either use the optimized standard processes or to tailor etch processes for your specific needs. The tool can be used for etching of different materials, but is primarily intented for etching of III-V materials. | The III-V ICP is a state-of-the-art etch tool. The combination of advanced hardware and software enables you to either use the optimized standard processes or to tailor etch processes for your specific needs. The tool can be used for etching of different materials, but is primarily intented for etching of III-V materials. There are two endpoint systems connected to the system. An Optical End Point System (OES) and a LASER End Point system (LEP). Information on these can be found here: [[Specific Process Knowledge/Etch/DryEtchProcessing]] | ||
'''The user manual, user APV and contact information can be found in LabManager:''' | '''The user manual, user APV and contact information can be found in LabManager:''' | ||
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== Additional information == | == Additional information == | ||
''' | === Endpoint detection === | ||
The III-V ICP is equipped with two endpoint detection systems - an optical endpoint detection system and a laser interferometric system. Click [[Specific Process Knowledge/Etch/OES |'''here''']] to access the page common to all dry etch tools that are equipped with an optical endpoint detection system. | |||
=== Wafer bonding === | |||
To find information on how to bond wafers or chips to a carrier wafer, click [[Specific Process Knowledge/Etch/DryEtchProcessing/Bonding| here]]. | To find information on how to bond wafers or chips to a carrier wafer, click [[Specific Process Knowledge/Etch/DryEtchProcessing/Bonding| here]]. | ||