Specific Process Knowledge/Etch/ICP Metal Etcher/Barc Etch: Difference between revisions
Appearance
No edit summary |
mNo edit summary |
||
| (16 intermediate revisions by one other user not shown) | |||
| Line 1: | Line 1: | ||
{{cc-nanolab}} | |||
'''Feedback to this page''': '''[mailto:labadviser@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php/Specific_Process_Knowledge/Etch/ICP_Metal_Etcher/Barc_Etch click here]''' | |||
<br> | |||
==Barc Etch== | ==Barc Etch== | ||
Etching barc with a | Etching barc with a CF4 recipe for barc etching is a good idea if you are on the limit of having enough DUV resist mask to reach etch depth you need. Here is an example of a barc etch I have started testing. I have also tried with and O2 descum process for comparison. | ||
{| border="1" cellspacing="1" cellpadding="2" align="left" | |||
! Parameter | |||
! Barc etch with CF4 | |||
! Barc etch with O2 | |||
|- | |||
|Coil power||800W||120w | |||
|- | |||
|Platen power||100W||15W | |||
|- | |||
|Pressure||3 mTorr||5mTorr | |||
|- | |||
|Flow rate CF4||4 sccm|| | |||
|- | |||
|Flow rate H2||20sccm|| | |||
|- | |||
|Flow rate O2||||10sccm | |||
|- | |||
|T||0 degrees||0 degrees | |||
|- | |||
|} | |||
<br/> | |||
{| border="1" cellspacing="1" cellpadding="2" align="left" | |||
! Parameter | |||
! Results with 'Barc etch with CF' | |||
! Results with 'Barc etch with O2' | |||
|- | |||
|Etch rate in barc||'''52 nm in 30s''' ''[bghe 20150519]''||'''62 nm in 50s''' ''[bghe 20150521]'' | |||
|- | |||
|Etch rate in KRF resist||'''27 nm in 30s''' ''[bghe 20150519]''||'''73 nm in 50s''' ''[bghe 20150521]'' | |||
|- | |||
|Selectivity KRF:Barc||'''1:2''' ||'''1:0.8''' | |||
|- | |||
|Etch 65nm barc||'''Use 40-45s'''||'''Use 55-60s''' | |||
|- | |||
|} | |||
<br/> | |||