Specific Process Knowledge/Wafer cleaning/Post CMP Cleaner: Difference between revisions
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'''Feedback to this page''': '''[mailto:labadviser@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Wafer_cleaning/Post_CMP_Cleaner click here]''' | |||
'''All links to Labmanager requires login.''' | |||
== Post CMP Cleaner) == | == Post CMP Cleaner) == | ||
[[image: | [[image:post cmp cleaner.jpg|400px|right|thumb|The Post CMP CLeaner in cleanroom A-5]] | ||
The post CMP Cleaner is designed for removing slurry residues from polishing wafers. | The post CMP Cleaner is designed for removing slurry residues from polishing wafers. The Post CMP cleaner is the recommended cleaning tool after using the '''[http://labadviser.nanolab.dtu.dk/index.php/Specific_Process_Knowledge/Back-end_processing/Polisher_CMP Polisher CMP]'''. | ||
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<!-- give the link to the equipment info page in LabManager: --> | <!-- give the link to the equipment info page in LabManager: --> | ||
[http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=431 The Post CMP Cleaner in LabManager] | [http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=431 The Post CMP Cleaner in LabManager] | ||
==Equipment performance and process related parameters== | |||
{| border="2" cellspacing="0" cellpadding="2" | |||
!colspan="2" border="none" style="background:silver; color:black;" align="center"|Equipment | |||
|style="background:WhiteSmoke; color:black"|<b>Post CMP Cleaner</b> | |||
<!-- |style="background:WhiteSmoke; color:black"|<b>Equipment 2</b> --> | |||
|- | |||
!style="background:silver; color:black;" align="center" width="60"|Purpose | |||
|style="background:LightGrey; color:black"| | |||
Cleaning of | |||
|style="background:WhiteSmoke; color:black"| | |||
*Samples from the CMP | |||
<!-- |style="background:WhiteSmoke; color:black"| | |||
*Purpose 1 | |||
*Purpose 2 | |||
*Purpose 3 --> | |||
|- | |||
|- | |||
!style="background:silver; color:black" align="center" valign="center" rowspan="4"|Process parameter range | |||
|- | |||
|style="background:LightGrey; color:black"|Mechanical Cleaning | |||
|style="background:WhiteSmoke; color:black"| | |||
*Brush Cleaning | |||
|- | |||
|style="background:LightGrey; color:black"|Power | |||
|style="background:WhiteSmoke; color:black"| | |||
*Megasonic Power from 0-40 W (in water) | |||
|- | |||
|style="background:LightGrey; color:black"|Arm sweep | |||
|style="background:WhiteSmoke; color:black"| | |||
*4" and 6" (20x20mm and 2" run with a 4" sweep) | |||
|- | |||
!style="background:silver; color:black" align="center" valign="center" rowspan="3"|Substrates | |||
|style="background:LightGrey; color:black"|Sample size | |||
|style="background:WhiteSmoke; color:black"| | |||
*<nowiki></nowiki> one 20x20mm piece | |||
*one 50 mm wafer | |||
*one 2" wafer | |||
*one 100 mm wafer | |||
*one 150 mm wafer | |||
<!-- |style="background:WhiteSmoke; color:black"| | |||
*<nowiki>#</nowiki> small samples | |||
*<nowiki>#</nowiki> 50 mm wafers | |||
*<nowiki>#</nowiki> 100 mm wafers | |||
*<nowiki>#</nowiki> 150 mm wafers --> | |||
|- | |||
| style="background:LightGrey; color:black"|Allowed materials | |||
|style="background:WhiteSmoke; color:black"| | |||
*Silicon | |||
*Polysilicon | |||
*Silicon Oxide | |||
*Glass/Quartz | |||
<!-- |style="background:WhiteSmoke; color:black"| | |||
*Allowed material 1 | |||
*Allowed material 2 | |||
*Allowed material 3 --> | |||
|- | |||
|} | |||
<br clear="all" /> | |||