Specific Process Knowledge/Thermal Process/Furnace Noble: Difference between revisions
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'''Feedback to this page''': '''[mailto:thinfilm@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Thermal_Process/Furnace_Noble click here]''' | '''Feedback to this page''': '''[mailto:thinfilm@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Thermal_Process/Furnace_Noble click here]''' | ||
[[Category: Equipment |Thermal Noble]] | |||
[[Category: Thermal process|Noble]] | |||
[[Category: Furnaces|Noble]] | |||
'''<p style="color:red;"> The Noble furnace has been decomissioned in January 2020.</span>''' | |||
==Noble furnace== | ==Noble furnace== | ||
The Noble Furnace is | The Noble Furnace is used for annealing and oxidation of different samples. Annealing can be done in a nitrogen or argon atmosphere. A bubbler has also been installed in the furnace, so it is possible to do both wet and dry oxidations. The maximum temperature of the furnace is 1000 <sup>o</sup>C. | ||
In the Noble Furnaces more dirty samples with metals and some specific polymers are allowed. Different sample holder are available for wafers and smaller samples (placed on a Si carrier wafer). | In the Noble Furnaces more dirty samples with metals and some specific polymers are allowed. Different sample holder are available for wafers and smaller samples (placed on a Si carrier wafer). | ||
The furnace is located in service area | The furnace is located in service area Cx1. | ||
Please check the cross contamination information in LabManager before you use the furnace. | Please check the cross contamination information in LabManager before you use the furnace. | ||
[[Image:Noble.JPG|thumb|300x300px|Noble furnace. Positioned in service area | [[Image:Noble.JPG|thumb|300x300px|Noble furnace. Positioned in service area Cx1/ Photo: DTU Nanolab internal]] | ||
'''The user manual, technical information and contact information can be found in LabManager:''' | '''The user manual, technical information and contact information can be found in LabManager:''' | ||
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Oxidation: | Oxidation: | ||
*Dry | *Dry | ||
*Wet (with bubbler. | *Wet (with bubbler. Water steam + N<sub>2</sub>) | ||
Annealing: | Annealing: | ||
*N<sub>2</sub> | *N<sub>2</sub> | ||
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*N<sub>2</sub>: 0-5 SLM | *N<sub>2</sub>: 0-5 SLM | ||
*O<sub>2</sub>: 0-5 SLM | *O<sub>2</sub>: 0-5 SLM | ||
* | *Ar: 0-7 SLM | ||
|- | |- | ||
!style="background:silver; color:black" align="center" valign="center" rowspan="2"|Substrates | !style="background:silver; color:black" align="center" valign="center" rowspan="2"|Substrates | ||
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| style="background:LightGrey; color:black"|Substrate material allowed | | style="background:LightGrey; color:black"|Substrate material allowed | ||
|style="background:WhiteSmoke; color:black"| | |style="background:WhiteSmoke; color:black"| | ||
*Silicon samples | *Silicon samples | ||
*Silicon samples with metals | *Silicon samples with metals | ||
*Silicon sample with polymers (only approved materials) | *Silicon sample with polymers (only approved materials) | ||
|- | |- | ||
|} | |} | ||