Specific Process Knowledge/Thermal Process/Annealing: Difference between revisions
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'''Feedback to this page''': '''[mailto:labadviser@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php/Specific_Process_Knowledge/Thermal_Process/Annealing click here]''' | '''Feedback to this page''': '''[mailto:labadviser@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php/Specific_Process_Knowledge/Thermal_Process/Annealing click here]''' | ||
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==Annealing== | ==Annealing== | ||
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*350 <sup>o</sup>C - 1150 <sup>o</sup>C | *350 <sup>o</sup>C - 1150 <sup>o</sup>C | ||
*Max 500 <sup>o</sup>C for wafers and samples with Al | |||
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*Vacuum: 20 <sup>o</sup>C - 1050 <sup>o</sup>C¨ | *Vacuum: 20 <sup>o</sup>C - 1050 <sup>o</sup>C¨ | ||