Specific Process Knowledge/Etch/DRIE-Pegasus/TrenchCharacterisation: Difference between revisions

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 = Characterization of DRIE silicon trenches =
-Dry etched silicon trenches come in many sizes and shapes. In most cases the best way of characterizing them is to cleave the wafer perpendicularly to the trench and inspect the profile in an SEM or optical microscope. The SEM provides by far the best information as there are no challenges with limited depth of focus or image resolution. To make a complete data set with, say, variations trench widths as
+Dry etched silicon trenches come in many sizes and shapes. In most cases the best way of characterizing them is to cleave the wafer perpendicularly to the trench and inspect the profile in an SEM or optical microscope. The SEM provides by far the best information as there are no challenges with limited depth of focus or image resolution. To make a complete data set with, say, variations trench widths or etch loads
-The work of adding measurements to SEM images, collecting the data and making sure that it is complete is, however, tedious.
+the work of adding measurements to SEM images, collecting the data and making sure that it is complete is, however, tedious. Instead of adding a ton of measurements to each SEM image while at the SEM and hence spend an unreasonable amount of time there, one can postpone making the measurements till afterwards by using a Matlab script as the one described below.
 == Using Matlab scripts ==
-A Matlab script automating the measurements from SEM images has been developed. It follows the sequence:
+A Matlab script automating the measurements from SEM images on etched trenches has been developed in the Matlab AppDesigner. It follows the sequence:
-# '''Input parameters''': The information required in terms of
+# '''Input parameters''': The information about the etch process can be entered manually or read from a text file.
 ## Date
-## Wafer info: Substrate size, conditions, mask material and thickness
+## User
-## Material etched, exposed area
+## Wafer info: Substrate size, material etched, etch load, mask material and thickness
-## Recipe:
+## Chamber conditioning, steps before the actual etch
+## Wafer ID, Labmanager process log
+## Recipe, duration, number of cycles
+## Comments
+## Mask thickness before and after etch
+# '''Input images''': A list of SEM images (only tiff format images from Carl Zeiss SEM's that have a correct header can be used) is entered and measurement points are added to every image one by one.
+## The pixel size in the the SEM image is read from the tiff image header
-Many users make measurements using the annotations in the SEM. Either top view measurements of heights/widths or tilted samples
-=== Input parameters ===
-'''At the SEM'''
- However, instead of adding a ton of measurements to each SEM image while at the SEM and hence spend an unreasonable amount of time there, one can postpone making the measurements till afterwards. The only requirement is that the pixel size of every SEM image is known - one can add it to the datazone: See any SEM manual for instructions - for instance [http://labmanager.dtu.dk/d4Show.php?id=2180&mach=275#dafs29430 '''HERE''']
 '''Making measurements'''
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 === Where have these numbers been used? ===
-* [http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Etch/DRIE-Pegasus/processA#Results:_Etched_depths_in_trenches_of_different_widths| Investigation of Process A performance on Pegasus 1]
+* [[Specific_Process_Knowledge/Etch/DRIE-Pegasus/processA]]