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'''Feedback to this page:  
'''Feedback to this page:  
[mailto:labadviser@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Etch/DRIE-Pegasus click here]'''
[mailto:labadviser@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php/Specific_Process_Knowledge/Etch/DRIE-Pegasus click here]'''
[[Category: Equipment |Etch DRIE]]
[[Category: Equipment |Etch DRIE]]
[[Category: Etch (Dry) Equipment|DRIE]]
[[Category: Etch (Dry) Equipment|DRIE]]
{{contentbydryetch}}
<!--Checked for updates on 28/6-2023 - ok/jmli -->


= DRIE-Pegasus 1=
= DRIE-Pegasus 1=


[[Image:DRIE-Pegasus.jpg |frame|left|x300px|The DRIE-Pegasus 1 load lock and cassette loader in the Danchip cleanroom A-1]]
[[Image:DRIE-Pegasus.jpg |frame|left|x300px|The DRIE-Pegasus 1 load lock and cassette loader in the Nanolab cleanroom A-1. {{photo1}} ]]


'''The user manual(s), quality control procedure(s) and results, user APV(s), technical information and contact information can be found in LabManager:'''
'''The user manual(s), quality control procedure(s) and results, user APV(s), technical information and contact information can be found in LabManager:'''


Equipment info in [http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=265| LabManager]
Equipment info in [http://labmanager.dtu.dk/function.php?module=Machine&view=view&mach=265| LabManager]


== Process information ==
== Process information ==
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=== Other etch processes ===
=== Other etch processes ===


*[[Specific Process Knowledge/Etch/DRIE-Pegasus/nanoetch|Nanostructure etches including nano1.42]]
*[[Specific Process Knowledge/Etch/DRIE-Pegasus/DREM| DREM processes]]
 
*[[Specific Process Knowledge/Etch/DRIE-Pegasus/nanoetch|Continuous nanostructure etches including nano1.42]]


*[[Specific Process Knowledge/Etch/DRIE-Pegasus/DUVetch|Etch processes with DUV masks]]
*[[Specific Process Knowledge/Etch/DRIE-Pegasus/DUVetch|Etch processes with DUV masks]]
*[[Specific Process Knowledge/Etch/DRIE-Pegasus/Barc|BARC etches]]


*[[Specific Process Knowledge/Etch/DRIE-Pegasus/Isotropic|Isotropic etches]]
*[[Specific Process Knowledge/Etch/DRIE-Pegasus/Isotropic|Isotropic etches]]


More processes, such as for DUV resist, are currently being developed, but they are not quite 'ready for publication' at LabAdviser so please contact Jonas (mailto:jml@danchip.dtu.dk) for more information.
More processes, such as for DUV resist, are currently being developed, but they are not quite 'ready for publication' at LabAdviser so please contact Jonas ([mailto:jmli@dtu.dk jmli@dtu.dk]) for more information.


  <!--  *[[Specific Process Knowledge/Etch/DRIE-Pegasus/slopedsidewalls|Etches that produce positively sloped sidewalls for imprinting purposes]] -->
  <!--  *[[Specific Process Knowledge/Etch/DRIE-Pegasus/slopedsidewalls|Etches that produce positively sloped sidewalls for imprinting purposes]] -->
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=== Advanced Processing - Henri Jansen style ===
=== Advanced Processing - Henri Jansen style ===
* [[Specific Process Knowledge/Etch/DRIE-Pegasus/Etch silicon nanostructures|Etch silicon nanostructures ]]
* [[Specific Process Knowledge/Etch/DRIE-Pegasus/Etch high aspect ratio silicon microstructures|Etch high aspect ratio silicon microstructures ]]
* [[Specific Process Knowledge/Etch/DRIE-Pegasus/Etch high aspect ratio silicon microstructures|Etch high aspect ratio silicon microstructures ]]
* [[Specific Process Knowledge/Etch/DRIE-Pegasus/Etch 3 dimensional silicon microstructures|Etch 3 dimensional silicon microstructures]]
* [[Specific Process Knowledge/Etch/DRIE-Pegasus/Etch 3 dimensional silicon microstructures|Etch 3 dimensional silicon microstructures]]
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To find information on how to bond wafers or chips to a carrier wafer, click [[Specific Process Knowledge/Etch/DryEtchProcessing/Bonding| here]].
To find information on how to bond wafers or chips to a carrier wafer, click [[Specific Process Knowledge/Etch/DryEtchProcessing/Bonding| here]].


=== Acceptance test ===
The instrument was opened for users in April 2010 when the acceptance test was signed. This was based on the performance of five standard recipes (A, B, C, D and SOI) that are further examined below. The acceptance test report is found [[Media:Pegasus_AcceptanceTest.pdf|here]].


'''Characterisation of etched trenches'''
'''Characterisation of etched trenches'''
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'''Internal Danchip Process log for Pegasus 1'''
'''Internal Nanolab Process log for Pegasus 1'''


Process log at Danchip [http://labintra.danchip.dtu.dk/index.php/Main_Page/Process_Logs/jmli/Pegasus]
Process log at Nanolab [http://labintra.nanolab.dtu.dk/index.php/Main_Page/Process_Logs/jmli/Pegasus]
Retrieved from "https://labadviser.nanolab.dtu.dk//index.php?title=Specific_Process_Knowledge/Etch/DRIE-Pegasus/Pegasus-1"