Specific Process Knowledge/Characterization/Thickness Measurer: Difference between revisions
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==Thickness | '''Feedback to this page''': '''[mailto:labadviser@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php/Specific_Process_Knowledge/Characterization/Thickness_Measurer click here]''' | ||
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==Thickness Measurer== | |||
[[Image:Thicknessmeasurer2007.jpg|thumb|300x300px|Thickness Measurer. Positioned in cleanroom D-3]] | [[Image:Thicknessmeasurer2007.jpg|thumb|300x300px|Thickness Measurer. Positioned in cleanroom D-3]] | ||
The | There are 2 thickness measurers in the cleanroom, both positioned in cleanroom D-3. The Thickness measurer is for measuring all sorts of samples. The thickness measurer (wafers) is solely for measuring the thickness of wafers or depths of grooves on wafers. | ||
During a KOH etch it can be helpful to ensure no over-etching by making a thickness measurement during the etching. | During a KOH etch it can be helpful to ensure no over-etching by making a thickness measurement during the etching. | ||
The user manual, technical information and contact information can be found in | |||
[http://www.labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=198 LabManager]. | |||
==Quality Control - Recipe Parameters and Limits== | ==Quality Control - Recipe Parameters and Limits== | ||
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The measured standard thickness is 0.1 mm. The measured result has to be within ± 0.005 mm. The QC is preformed once a year. | The measured standard thickness is 0.1 mm. The measured result has to be within ± 0.005 mm. The QC is preformed once a year. | ||
*[http://www.labmanager.danchip.dtu.dk/d4Show.php?id=1831&mach=198 The QC procedure]<br> | *[http://www.labmanager.danchip.dtu.dk/d4Show.php?id=1831&mach=198 The QC procedure]<br> | ||
*[ | *[https://labmanager.dtu.dk/view_binary.php?type=data&mach=198 The newest QC data]<br> | ||
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==Equipment performance and process related parameters== | ==Equipment performance and process related parameters== | ||
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*Wafer thickness | *Wafer thickness | ||
*Depths of larger grooves | *Depths of larger grooves | ||
*Heigth of larger | *Heigth of larger samples | ||
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Thickness resolution | Thickness resolution | ||
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*< | *< 1 µm | ||
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*No restrictions | *No restrictions | ||
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Purpose | |||
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Thickness measurer (wafers) | |||
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*Wafer thickness | |||
*Depths of larger grooves | |||
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Performance | |||
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Thickness resolution | |||
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*< 1 µm | |||
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Substrates | |||
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Batch size | |||
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*One sample | |||
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| style="background:LightGrey; color:black"|Substrate materials allowed | |||
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*Only wafers | |||
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