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'''Feedback to this page''': '''[mailto:labadviser@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Characterization/SEM:_Scanning_Electron_Microscopy  click here]'''
{{cc-nanolab}}


'''Feedback to this page''': '''[mailto:labadviser@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php/Specific_Process_Knowledge/Characterization/SEM:_Scanning_Electron_Microscopy  click here]'''
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=Scanning Electron Microscopy at Nanolab=
There is a large range of scanning electron microscopes (SEMs) at DTU Nanolab. The first couple of sections on this page are about the SEMs in and around the fabrication part of Nanolab in building 346 and 451. The last section is about the SEMs in building 314, which is our dedicated characterization facility.


[[image:SEM-Leo.jpg|200x200px|right|thumb|The Leo SEM]]
== Scanning electron microscopy in and around the cleanroom==
[[image:SEM-FEI-1.jpg|200x200px|right|thumb|The FEI SEM]]
{{Template:ContentbySEMresponsibles}}
[[image:SEM-Jeol.jpg|200x200px|right|thumb|The Jeol SEM is located outside the cleanroom in the basement ]]


== Scanning electron microscopy at Danchip==
The four SEMs in building 346 and 451 cover a wide range of needs both in the cleanroom and outside: From fast in-process verification of different process parameters such as etch rates, step coverages or lift-off quality to ultra high resolution images on any type of sample intended for publication.


The SEM's at Danchip cover a wide range of needs both in the cleanroom and outside: From the fast in-process verification of different process parameters such as etch rates, step coverages or lift-off quality to the ultra high resolution images on any type of sample intended for publication.
* The [[Specific_Process_Knowledge/Characterization/SEM_Supra_1|SEM Supra 1]] is located in the basement outside the cleanroom. It is serving two purposes: Serving the users that have samples from outside the cleanroom and serving as training tool; all new SEM users with no/little SEM experience must be trained on this tool and gain basic knowledge (typically 10 hours of usage) here before being qualified for training on the SEMs in the cleanroom.


The 'workhorse' SEM that will cover most users needs is the [[/Leo|Leo SEM]]. It is a very reliable and rugged instrument that provides high quality images of most samples. Excellent images on a large variety of materials such as semiconductors, semiconductor oxides or nitrides, metals, thin films and some polymers may be acquired on the [[/Leo|Leo SEM]]. As such, we prefer that new users that have no prior SEM experience get trained on the Leo SEM before they start using the other SEM's.
* The [[Specific_Process_Knowledge/Characterization/SEM_Supra_2|SEM Supra 2]] and [[Specific_Process_Knowledge/Characterization/SEM_Supra_3|SEM Supra 3]] are located in the cleanroom where they serve as general imaging tools for samples that have been fabricated in the cleanroom. Like SEM Supra 1, they are VP models from Carl Zeiss and will produce excellent images on any sample. The possibility of operating at higher chamber pressures in the VP mode makes imaging of bulk non-conducting samples possible. The [[Specific_Process_Knowledge/Characterization/SEM_Supra_2|SEM Supra 2]] is also equipped with an airlock and an EDX detector.


The [[/Zeiss|Zeiss SEM]] and the [[/Supra60VP|Supra 60 VP SEM]] are both 'Supra VP' models from Carl Zeiss (a 40 and 60 respectively). As such they share a lot of similaritites but they also differ in some respects. The SmartSEM operator software installed on both SEM's is also running on the Leo.
* The [[Specific_Process_Knowledge/Characterization/SEM_Gemini_1|SEM Gemini 1]] is a state-of-the-art SEM from Carl Zeiss that was installed in the cleanroom in the autumn of 2023. It has an impressive range of detectors and modes that are intended to be used for the most demanding samples.


The [[/Zeiss|Zeiss SEM]] was installed in the cleanroom in 2010 and quickly became the 'Weapon of choice' for many SEM users. It's a state-of-the-art SEM that will produce excellent images on almost any sample.  
* The [[Specific_Process_Knowledge/Characterization/SEM_Tabletop_1|SEM Tabletop 1]] is a tabletop SEM that is located in the basement outside the cleanroom. It has a limited resolution, but it is fast and easy to use, also for non-conducting samples. Training in the others SEMs is not required to use this SEM.


Operated by the same user interface as the Leo, it is quite straight forward to change between the two instruments.
SEM Supra 1, 2 and 3 and the SEM Gemini 1 are all manufactured by Carl Zeiss. The SEM Supra 1, 2 and 3 all have the same graphical user interface and nearly identical electron optics. But there are there are small hardware and software differences, thus a training is needed for each SEM you want to use.


The SEM Tabletop 1 is manufactured by Hitachi.


The [[/FEI|FEI SEM]] is a versatile microscope with two vacuum modes (High Vacuum and Low Vacuum) and 6 different detectors, offering excellent resolution on any type of sample or material including graphene and carbon nanotubes. Somewhat more fragile compared to the robust Leo, it is our intention that only users with special needs (for instance thick polymers, glass substrates or EDX/micromanipulator experiments) that will be trained.
== Common challenges in scanning electron microscopy ==


Outside the cleanroom in the basement of building 346, the [[/Jeol|Jeol SEM]] provides a possibilty of imaging samples that do not go into the cleanroom.
*[[/samplemount| Sample mounting]]


'''The user manuals, quality control procedures and results, user APVs, technical information and contact information can be found in LabManager:'''
==Comparison of SEM's in building 346/451==
 
* [http://www.labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=37| The SEM Leo page in LabManager],
* [http://www.labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=239| The SEM FEI page in LabManager],
* [http://www.labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=275| The SEM Zeiss page in LabManager],
* [http://www.labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=149| The SEM Jeol page in LabManager],
 
== Process information ==
*[[/Leo|The Leo SEM]]
*[[/Zeiss|The Zeiss SEM]]
*[[/FEI|The FEI SEM]]
*[[/Jeol|The Jeol SEM]]
 
==Equipment performance and process related parameters==


{| border="2" cellspacing="0" cellpadding="0"  
{| border="2" cellspacing="0" cellpadding="0"  
!colspan="2" border="none" style="background:silver; color:black;" align="center"|Equipment  
!colspan="2" border="none" style="background:silver; color:black;" align="center"|Equipment  
|style="background:WhiteSmoke; color:black" align="center"|[[/Leo|SEM Leo]]
|style="background:WhiteSmoke; color:black" align="center"|[[Specific_Process_Knowledge/Characterization/SEM_Supra_1|SEM Supra 1]]
|style="background:WhiteSmoke; color:black" align="center"|[[/Zeiss|SEM Zeiss]]
|style="background:WhiteSmoke; color:black" align="center"|[[Specific_Process_Knowledge/Characterization/SEM_Supra_2|SEM Supra 2]]
|style="background:WhiteSmoke; color:black" align="center"|[[/Supra60VP|SEM Supra 60VP]]
|style="background:WhiteSmoke; color:black" align="center"|[[Specific_Process_Knowledge/Characterization/SEM_Supra_3|SEM Supra 3]]
 
|style="background:WhiteSmoke; color:black" align="center"|[[Specific_Process_Knowledge/Characterization/SEM_Gemini_1|SEM Gemini 1]]
|style="background:WhiteSmoke; color:black" align="center"|[[/FEI|SEM FEI]]
|style="background:WhiteSmoke; color:black" align="center"|[[Specific_Process_Knowledge/Characterization/SEM_Tabletop_1|SEM Tabletop 1]]
|style="background:WhiteSmoke; color:black" align="center"|[[/Jeol|SEM Jeol]]
<!--|style="background:WhiteSmoke; color:black" align="center"|[[Specific Process Knowledge/Characterization/SEM FEI QUANTA 200 3D|FEI Quanta 200 3D]]-->
|-
|-
!colspan="2" border="none" style="background:silver; color:black;" align="center"|Model  
!colspan="2" border="none" style="background:silver; color:black;" align="center"|Model  
|style="background:WhiteSmoke; color:black" align="center"| Leo 1550 SEM
|style="background:WhiteSmoke; color:black" align="center"| Zeiss Supra 40 VP
|style="background:WhiteSmoke; color:black" align="center"| Zeiss Supra 40 VP
|style="background:WhiteSmoke; color:black" align="center"| Zeiss Supra 60 VP
|style="background:WhiteSmoke; color:black" align="center"| Zeiss Supra 60 VP
|style="background:WhiteSmoke; color:black" align="center"| FEI Nova 600 NanoSEM
|style="background:WhiteSmoke; color:black" align="center"| Zeiss Supra 40 VP
|style="background:WhiteSmoke; color:black" align="center"| Jeol JSM 5500 LV
|style="background:WhiteSmoke; color:black" align="center"| Zeiss GeminiSEM 560
|style="background:WhiteSmoke; color:black" align="center"| SEM Tabletop 1
<!--|style="background:WhiteSmoke; color:black" align="center"| FEI Quanta 200 3D-->
|-
!style="background:silver; color:black" align="center" valign="center" rowspan="2"|Purpose
|style="background:LightGrey; color:black" align="center" | Imaging and measurement of
|style="background:WhiteSmoke; color:black"|
* Conducting samples
* Semi-conducting samples
* Thin (~ 5 µm <) layers of non-conducting materials such as polymers
* Thick polymers, glass or quartz samples
|style="background:WhiteSmoke; color:black"|
* Conducting samples
* Semi-conducting samples
* Thin (~ 5 µm <) layers of non-conducting materials such as polymers
* Thick polymers, glass or quartz samples
|style="background:WhiteSmoke; color:black"|
* Conducting samples
* Semi-conducting samples
* Thin (~ 5 µm <) layers of non-conducting materials such as polymers
* Thick polymers, glass or quartz samples
|style="background:WhiteSmoke; color:black"|
* Conducting samples
* Semi-conducting samples
* Thin (~ 5 µm <) layers of non-conducting materials such as polymers
* Thick polymers, glass or quartz samples
|style="background:WhiteSmoke; color:black"|
* Conducting samples
* Semi-conducting samples
* Thin (~ 5 µm <) layers of non-conducting materials such as polymers
* Thick polymers, glass or quartz samples
<!--|style="background:WhiteSmoke; color:black"|
* Conductive samples-->
|-
|style="background:LightGrey; color:black" align="center" |Other purpose
|style="background:WhiteSmoke; color:black"| <!-- comment -->
|style="background:WhiteSmoke; color:black"|
* Surface material analysis using EDX
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
|-
|-
!style="background:silver; color:black;" align="center" width="60"|Purpose
!style="background:silver; color:black;" align="center" width="60"|Instrument location
|style="background:LightGrey; color:black"| Imaging and measurement of
|style="background:LightGrey; color:black"|  
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
* Any (semi)conducting sample that may have thin (> ~ 5 µm) layers of non-conducting materials on top
*Basement of building 346
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
* Any sample except bulk insulators such as polymers, glass or quartz wafers
*Cleanroom of DTU Nanolab in building 346
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
* Any sample except bulk insulators such as polymers, glass or quartz wafers TEST
*Cleanroom of DTU Nanolab in building 346
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
* All samples
*Cleanroom of DTU Nanolab in building 346
* Bulk insulators such as polymer-, glass or quartz wafers
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
* Samples from the 'real' world outside the lab
*Building 451 - room 913
(in the North-East corner of the building's basement)
<!--|style="background:WhiteSmoke; color:black"|
*DTU CEN-->
 
|-
|-
!style="background:silver; color:black" align="center" valign="center" rowspan="2"|Performance
!style="background:silver; color:black" align="center" valign="center" rowspan="2"|Performance
|style="background:LightGrey; color:black" rowspan="2"|Resolution
|style="background:LightGrey; color:black" rowspan="2" align="center" |Resolution
|style="background:Whitesmoke; color:black" colspan="5" align="center"| The resolution of a SEM is strongly dependent on the type of sample and the skills of the operator. The highest resolution is probably only achieved on special samples
|style="background:Whitesmoke; color:black" colspan="5" align="center"| The resolution of a SEM is strongly dependent on the type of sample and the skills of the operator. The highest resolution is probably only achieved on special samples
|-
|-
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
* ~ 5 nanometers (limited by vibrations)
* 1-2 nm (limited by vibrations)
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
* 1-2 nm (limited by vibrations)
* 1-2 nm (limited by vibrations)
Line 80: Line 114:
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
* 1-2 nm (limited by vibrations)
* 1-2 nm (limited by vibrations)
<!--|style="background:WhiteSmoke; color:black"|
* ~3.5 nm (limited by instrument)-->
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
* 20 nm (limited by instrument)
* ~25 nm (limited by instrument)
|-
|-
!style="background:silver; color:black" align="center" valign="center" rowspan="4"|Instrument specifics
!style="background:silver; color:black" align="center" valign="center" rowspan="5"|Instrument specifics
|style="background:LightGrey; color:black"|Detectors
|style="background:LightGrey; color:black" align="center" |Detectors
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
* Secondary electron (Se2)
* Secondary electron (Se2)
* Inlens secondary electron (Inlens)
* Inlens secondary electron (Inlens)
* Backscatter electron (QBSD)
* 4 Quadrant Backscatter electron (QBSD)
* Variable pressure secondary electron (VPSE)
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
* Secondary electron (Se2)
* Secondary electron (Se2)
* Inlens secondary electron (Inlens)
* Inlens secondary electron (Inlens)
* Backscatter electron (QBSD)
* 4 Quadrant Backscatter electron (QBSD)
* Variable pressure secondary electron (VPSE)
* Variable pressure secondary electron (VPSE)
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
* Secondary electron (Se2)
* Secondary electron (Se2)
* Inlens secondary electron (Inlens)
* Inlens secondary electron (Inlens)
* Backscatter electron (QBSD)
* High Definition four quadrant Angular Selective Backscattered electron detector (HDAsB)  
* Variable pressure secondary electron (VPSE)
* Variable pressure secondary electron (VPSE)
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
* Secondary electron (ETD)
* Secondary electron (Se2)
* Inlens secondary electron (TLD)
* Inlens secondary electron (Inlens)
* Backscatter electron (BSD)
* Inlens backscatter electron (Inlens ESB)
* Variable pressure secondary electron (LVD)
* Retractable, column mounted six segment backscatter electron (aBSD)
* High resolution varable pressure secondary (Helix)
* Variable pressure secondary electron (VPSE)
* Retractable, four segment tranmitted electron (aSTEM)
<!--|style="background:WhiteSmoke; color:black"|
* Secondary electron (Everhart-Thornley (ETD))
* Backscatter electron (BSD) - Add-on
* Large Field Detector (LFD) - Add-on
* CCD camera -->
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
* Secondary electron (SEI)
* Secondary electron (SE)
* Backscatter electron (BEI)
* Backscatter electron (BSE)
|-
|-
|style="background:LightGrey; color:black"|Stage
|style="background:LightGrey; color:black" align="center" |Stage
|style="background:WhiteSmoke; color:black"|
* X, Y: 125 &times; 100 mm
* T: 0 to 90<sup>o</sup>
* R: 360<sup>o</sup>
* Z: 48 mm
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
* X, Y: 130 &times; 130 mm
* X, Y: 130 &times; 130 mm
Line 124: Line 162:
* T: -10 to 70<sup>o</sup>  
* T: -10 to 70<sup>o</sup>  
* R: 360<sup>o</sup>  
* R: 360<sup>o</sup>  
* Z: XXX mm
* Z: 50 mm
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
* X, Y: 150 &times; 150 mm
* X, Y: 130 &times; 130 mm
* T: -10 to 60<sup>o</sup>  
* T: -4 to 70<sup>o</sup>
* R: 360<sup>o</sup>  
* R: 360<sup>o</sup>  
* Z: 10 mm
* Z: 50 mm
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
* X, Y: 73 &times; 40 mm
* X, Y: 130 &times; 130 mm
* T: -10 to 90<sup>o</sup>  
* T: -4 to 70<sup>o</sup>
* R: 360<sup>o</sup>  
* R: 360<sup>o</sup>  
* Z: 38 mm
* Z: 50 mm
|style="background:WhiteSmoke; color:black"|
* X, Y: 35 mm
* T: No tilt
* R: No rotation
* Z: 0 mm
|-
|-
|style="background:LightGrey; color:black"|Electron source
|style="background:LightGrey; color:black" align="center" |Electron source
|style="background:Whitesmoke; color:black" colspan="4" align="center"| FEG (Field Emission Gun) source
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
* FEG (Field Emission Gun) source
* Thermionic tungsten filament
|style="background:WhiteSmoke; color:black"|
<!--|style="background:WhiteSmoke; color:black"|
* FEG (Field Emission Gun) source
* Tungsten filament-->
|style="background:WhiteSmoke; color:black"|
* FEG (Field Emission Gun) source
|style="background:WhiteSmoke; color:black"|
* FEG (Field Emission Gun) source
|style="background:WhiteSmoke; color:black"|
* Tungsten filament
|-
|-
|style="background:LightGrey; color:black"|Operating pressures
|style="background:LightGrey; color:black" align="center" |Operating pressures
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
* Fixed at High vacuum (2 &times; 10<sup>-5</sup>mbar - 10<sup>-6</sup>mbar)
* Fixed at High vacuum (2 &times; 10<sup>-4</sup>mbar - 10<sup>-6</sup>mbar)
* Variable at Low vacuum (0.1 mbar-2 mbar)
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
* Fixed at High vacuum (2 &times; 10<sup>-4</sup>mbar - 10<sup>-6</sup>mbar)
* Fixed at High vacuum (2 &times; 10<sup>-4</sup>mbar - 10<sup>-6</sup>mbar)
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|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
* Fixed at High vacuum (2 &times; 10<sup>-4</sup>mbar - 10<sup>-6</sup>mbar)
* Fixed at High vacuum (2 &times; 10<sup>-4</sup>mbar - 10<sup>-6</sup>mbar)
* Variable at Low vacuum (0.1 mbar-2 mbar)
* Variable at Low vacuum  
** Standard VP (variable pressure): 5-60 Pa
** Nano VP, 350 um beamsleeve aperture: 5-150 Pa
** Nano VP, 800 um beamsleeve aperture: 5-40 Pa
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
* Fixed at High vacuum
* Conductor vacuum mode: 5 Pa
* Standard vacuum mode: 30 Pa
* Charge-up reduction vacuum mode: 50 Pa
<!--|style="background:WhiteSmoke; color:black"|
* High vacuum and Low vacuum-->
|-
|-
!style="background:silver; color:black" align="center" valign="center" rowspan="3"|Substrates
|style="background:LightGrey; color:black" align="center" |Options
|style="background:LightGrey; color:black"|Sample sizes
|style="background:WhiteSmoke; color:black"|
* All software options available
* Electron magnetic noise cancellations system
|style="background:WhiteSmoke; color:black"|
* Antivibration platform
* Fjeld M-200 airlock taking up to 8" wafers
* Oxford Instruments X-Max<sup>N</sup> 50 mm<sup>2</sup> SDD EDX detector and AZtec software package
|style="background:WhiteSmoke; color:black"|
*High Definition four quadrant Angular Selective Backscattered electron detector (HDAsB)
|style="background:WhiteSmoke; color:black"|
* Antivibration platform
* Electron magnetic noise cancellations system
* Zeiss airlock taking up to 6" wafers
* Plasma cleaner
* Sample bias option
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
* Wafers up to 6" (only full view up to 4")
<!--|style="background:WhiteSmoke; color:black"|
* Focused ion beam (FIB) (Ga<sup>+</sup> ions)-->
|-
!style="background:silver; color:black" align="center" valign="center" rowspan="3" align="center" |Substrates
|style="background:LightGrey; color:black" align="center" |Sample sizes
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
* Up to 6" wafer with full view
* Up to 6" wafer with full view  
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
* Up to 8" wafer with 6" view
* Up to 8" wafer with 6" view
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
* Up to 6" wafer with full view
* Up to 6" wafer with full view
* A 12" wafer holder has been made but it requires special training
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
* Up to 4" wafer
* Up to 6" wafer with full view
|style="background:WhiteSmoke; color:black"|
*  Up to 70 mm with full wiew
<!--|style="background:WhiteSmoke; color:black"|
* Wafers won´t fit without a proper holder. The height of the sample is critical, should be as small, as possible-->
|-
|-
| style="background:LightGrey; color:black"|Allowed materials
| style="background:LightGrey; color:black" align="center" |Allowed materials
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
* Any standard cleanroom material except graphene or CNT samples
* Any standard cleanroom material and samples from the Laser Micromachining tool and the Polymer Injection Molding tool
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
* Any standard cleanroom material except graphene or CNT samples
* Any standard cleanroom materials
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
* Any standard cleanroom material except graphene or CNT samples
* Any standard cleanroom materials
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
* Any standard cleanroom material including graphene or CNT samples
* Any standard cleanroom materials
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
* Any standard cleanroom material including graphene or CNT samples
* Any standard cleanroom material and samples from the Laser Micromachining tool and the Polymer Injection Molding tool
* Biological samples
* Some biological samples (ask for permission)
<!--|style="background:WhiteSmoke; color:black"|
* Conductive materials
* No biological samples-->
|-  
|-  
|}
|}
<br clear="all" />
==Comparison of the SEMs at DTU Nanolab - building 307/314 ==
Due to ongoing development of tools and processes, some information regarding available SEMs may be incomplete or not quite up-to-date.
{{SEM comparison table 314}}
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