Specific Process Knowledge/Bonding/Imprinter 02: Difference between revisions
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'''Feedback to this page''': '''[mailto:labadviser@ | '''Feedback to this page''': '''[mailto:labadviser@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php/Specific_Process_Knowledge/Bonding/Imprinter_02 click here]''' | ||
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The Imprinter 02 is a system for bonding. | The Imprinter 02 is a system for bonding. Three different types of Polymer bonds can be done: PMMA, SU8 and BCB (more information [[Specific Process Knowledge/Bonding|here]]). It not is possible to mechanically align the wafers. It is also possible to process pieces. | ||
The user manual, quality control procedure and results, user APV(s), and contact information can be found in [http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=401| LabManager]. | |||
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Latest revision as of 18:16, 27 May 2025
The content on this page, including all images and pictures, was created by DTU Nanolab staff, unless otherwise stated.
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The Imprinter 02 is a system for bonding. Three different types of Polymer bonds can be done: PMMA, SU8 and BCB (more information here). It not is possible to mechanically align the wafers. It is also possible to process pieces.
The user manual, quality control procedure and results, user APV(s), and contact information can be found in LabManager.
| Purpose | Bonding |
|
|---|---|---|
| Performance | Alignment accuracy |
|
| Process parameter range | Process Temperature |
|
| Process pressure |
| |
| Piston Force |
| |
| Substrates | Batch size |
|
| Substrate material allowed |
| |
| Material allowed on the substrate |
|