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Specific Process Knowledge/Bonding/Imprinter 02: Difference between revisions

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'''Feedback to this page''': '''[mailto:labadviser@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Bonding/Imprinter_02 click here]'''
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'''Feedback to this page''': '''[mailto:labadviser@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php/Specific_Process_Knowledge/Bonding/Imprinter_02 click here]'''
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The Imprinter 02 is a system for bonding. Three different types of Polymer bonds  can be done: PMMA, SU8 and BCB (more information [[Specific Process Knowledge/Bonding|here]]). It not is possible to mechanically align the wafers. It is also possible to process pieces.


'''All links to Labmanager requires login'''
The user manual, quality control procedure and results, user APV(s), and contact information can be found in [http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=401| LabManager].
 
The Imprinter 02 is a system for bonding. 3 different types of Polymer bonds [[Specific Process Knowledge/Bonding|bonding]] can be done: PMMA, SU8 and BCB. It not is possible to mechanically align the wafers. It is also possible to process pieces.
 
'''The user manual, quality control procedure and results, user APV(s), and contact information can be found in LabManager:'''
Equipment info in [http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=401| LabManager]


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==Overview of the performance of the Imprinter 02 and some process related parameters==
==Overview of the performance of the Imprinter 02 and some process related parameters==


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