Specific Process Knowledge/Bonding/Imprinter 02: Difference between revisions
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'''Feedback to this page''': '''[mailto:labadviser@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php/Specific_Process_Knowledge/Bonding/Imprinter_02 click here]''' | |||
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The Imprinter 02 is a system for bonding. Three different types of Polymer bonds can be done: PMMA, SU8 and BCB (more information [[Specific Process Knowledge/Bonding|here]]). It not is possible to mechanically align the wafers. It is also possible to process pieces. | |||
The user manual, quality control procedure and results, user APV(s), and contact information can be found in [http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=401| LabManager]. | |||
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==Overview of the performance of the Imprinter 02 and some process related parameters== | ==Overview of the performance of the Imprinter 02 and some process related parameters== | ||
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*SU-8 | *SU-8 | ||
*BCB | *BCB | ||
*Metals: Au, Sn, Ag, Al, Ti. | *Metals: Au, Sn, Ag, Al, Ti.. | ||
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