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[[image:Define your structure directly.png|right|x200px|Define the structure directly on your sample]]


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= Direct Structure Definiton =
[[image:Define your structure directly.png|right|x200px|Define the structure directly on your sample]]
By direct structure definition is meant a technique by which you create structures directly in the device material. Some of the techniques may require a master.
By direct structure definition is meant a technique by which you create structures directly in the device material. Some of the techniques may require a master.
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* [[Specific Process Knowledge/Back-end processing/Laser Micromachining Tool|Laser Micromachining Tool/ablation]]
* [[Specific Process Knowledge/Back-end processing/Laser Micromachining Tool|Laser Micromachining Tool/ablation]]
* [[Specific Process Knowledge/Back-end processing/Disco Saw|Dicing saw]]
* [[Specific Process Knowledge/Back-end processing/Disco Saw|Dicing saw]]
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* Dry Etching without mask
== Materials for structuring ==
 
*Polymers
 
** SU-8
*** [[Specific Process Knowledge/Lithography/UVLithography|UV Lithography]]
** Topas
*** [[Specific Process Knowledge/Back-end processing/Polymer Injection Molder|Polymer Injection Molder]]
*** [[Specific Process Knowledge/Lithography/NanoImprintLithography|Nano Imprint Lithography]]
*** [[Specific Process Knowledge/Back-end processing/Laser Micromachining Tool|Laser ablation]]
** PMMA
*** [[Specific Process Knowledge/Lithography/NanoImprintLithography|Nano Imprint Lithography]]
*** [[Specific Process Knowledge/Back-end processing/Laser Micromachining Tool|Laser ablation]]
** AZ resists
*** [[Specific Process Knowledge/Lithography/UVLithography|UV Lithography]]
*** [[Specific Process Knowledge/Lithography/3DLithography|2-Photon Polymerization Lithography]]
** ...
*Metals/Silicon/Graphene
**[[Specific Process Knowledge/Back-end processing/Laser Micromachining Tool|Laser ablation]]
*Glass
**[[Specific Process Knowledge/Back-end processing/Laser Micromachining Tool|Laser ablation]]
** [[Specific Process Knowledge/Back-end processing/Disco Saw|Dicing saw]]
**[[Specific Process Knowledge/Back-end processing/Sandblasting|Sandblasting (at DTU Nanotech).]]
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== Comparison of equipment/material ==
== Comparison of equipment/material ==


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