Specific Process Knowledge/Direct Structure Definition: Difference between revisions
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[[image:Define your structure directly.png|right|x200px|Define the structure directly on your sample]] | |||
'''Feedback to this page''': '''[mailto:labadviser@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Characterization click here]''' | '''Feedback to this page''': '''[mailto:labadviser@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Characterization click here]''' | ||
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By direct structure definition is meant a technique by which you create structures directly in the device material. Some of the techniques may require a master. | By direct structure definition is meant a technique by which you create structures directly in the device material. Some of the techniques may require a master. | ||
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== Choose method of structuring/equipment == | == Choose method of structuring/equipment == | ||
* [[Specific Process Knowledge/Lithography/UVLithography|UV Lithography]] | * [[Specific Process Knowledge/Lithography/UVLithography|UV Lithography]] | ||
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* [[Specific Process Knowledge/Back-end processing/Laser Micromachining Tool|Laser Micromachining Tool/ablation]] | * [[Specific Process Knowledge/Back-end processing/Laser Micromachining Tool|Laser Micromachining Tool/ablation]] | ||
* [[Specific Process Knowledge/Back-end processing/Disco Saw|Dicing saw]] | * [[Specific Process Knowledge/Back-end processing/Disco Saw|Dicing saw]] | ||
* Dry Etching without mask | |||
== Comparison of equipment/material == | == Comparison of equipment/material == | ||