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This page is under construction. In time we will fill it with relevant process examples and relevant data.
=Mix-and-match with EBL and UV lithography=
=Mix-and-match with EBL and UV lithography=
Using mix-and-match it is possible to combine EBL and UV lithography using selected resists. Read more on the [[Specific_Process_Knowledge/Lithography/Mix-and-match|Mix-and-match page.]]
Using mix-and-match it is possible to combine EBL and UV lithography using selected resists. Read more on the [[Specific_Process_Knowledge/Lithography/Mix-and-match|Mix-and-match page.]]
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By default the subfield size is 4x4 µm. This will match for instance a beam pitch of 200 nm, since it will place 20 beam shots along each axis. It does not match a beam pitch of 190 nm for instance, since 4000 nm / 190 nm = 21.05. If one wants a beam pitch of 190 nm the subfield size should be changed to 3.990 x 3.990 µm. This is done in the JDF file by changing the '''SPPRM''' command from the usual '''SPPRM 4.0,,,,1.0,1''' to '''SPPRM 3.99,,,,1.0,1''', since the first number determines subfield size.
By default the subfield size is 4x4 µm. This will match for instance a beam pitch of 200 nm, since it will place 20 beam shots along each axis. It does not match a beam pitch of 190 nm for instance, since 4000 nm / 190 nm = 21.05. If one wants a beam pitch of 190 nm the subfield size should be changed to 3.990 x 3.990 µm. This is done in the JDF file by changing the '''SPPRM''' command from the usual '''SPPRM 4.0,,,,1.0,1''' to '''SPPRM 3.99,,,,1.0,1''', since the first number determines subfield size.
A significant limitation of this approach is that the beam pitch as determined by the SHOT S command has a maximum value of 1020 units, i.e. 251 nm. The method described below does not have this limitation.


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