Specific Process Knowledge/Wafer cleaning: Difference between revisions
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'''Feedback to this page''': '''[mailto:labadviser@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Wafer_cleaning click here]''' | '''Feedback to this page''': '''[mailto:labadviser@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Wafer_cleaning click here]''' | ||
== Cleaning of wafers == | == Cleaning of wafers == | ||
__NOTOC__ | __NOTOC__ | ||
During processing it is sometimes mandatory, necessary or just recommended to clean the wafers or the photo lithographic masks. This can be done by different cleaning procedures depending on what the wafers have been exposed to and where they are going to be further processed. In the comparison table below is listed different cleaning procedures available at nanolab. | During processing it is sometimes mandatory, necessary or just recommended to clean the wafers or the photo lithographic masks. This can be done by different cleaning procedures depending on what the wafers have been exposed to, and where they are going to be further processed. In the comparison table below is listed different cleaning procedures available at nanolab. | ||
===Wafers that go into the high temperature furnaces=== | ===Wafers that go into the high temperature furnaces=== | ||
As a general rule all wafers that go into the high temperature furnaces need a full RCA clean directly before the furnace step. | As a general rule all wafers that go into the high temperature furnaces need a full RCA clean directly before the furnace step. | ||
There are, however, some exception to this rule. Please find more information on wafer cleaning before furnace processes [https://labadviser.nanolab.dtu.dk/index.php?title=Specific_Process_Knowledge/Thermal_Process/Storage_and_cleaning_of_wafer_to_the_A,_B,_C_and_E_stack_furnaces here]. | |||
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===Items that have been outside the cleanroom=== | ===Items that have been outside the cleanroom=== | ||
Before bringing samples into the cleanroom you have to get approval from | Before bringing samples into the cleanroom you have to get approval from Nanolab ("Bring samples into cleanroom"-procedure). The approval process and cleaning procedure is described on <b>[[Specific_Process_Knowledge/Wafer_cleaning/Bring_samples_into_cleanroom | here]]</b>. Please note that the approval for bringing samples into the cleanroom is personal (and fellow group members need to send in seperate request). | ||
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===Masks=== | ===Masks=== | ||
Masks that have become dirty by dust particles or resist residues have to be cleaned in the 7-up (mask) bath before use. | Masks that have become dirty by dust particles or resist residues have to be cleaned in the 7-up (mask) bath before use. You can find more information [https://labadviser.nanolab.dtu.dk/index.php?title=Specific_Process_Knowledge/Wafer_cleaning/7-up_%26_Piranha here]. | ||
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Make the surface hydrophillic | Make the surface hydrophillic | ||
|Removing dust and particles | |Removing dust and particles | ||
| | |Removing slurry residues from the CMP | ||
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|Recommended cleaning and treatment before wafer bonding | |Recommended cleaning and treatment before wafer bonding | ||
|Mandatory cleaning of very dirty items that enters the cleanroom. Should always be followed by a piranha clean. | |Mandatory cleaning of very dirty items that enters the cleanroom. Should always be followed by a piranha clean. | ||
| | |Recommended cleaning after CMP | ||
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*<nowiki>#</nowiki>1-25 2" and 4" wafers | *<nowiki>#</nowiki>1-25 2" and 4" wafers | ||
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*All sizes that can go into the bath| | *All sizes that can go into the bath | ||
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*<nowiki>#</nowiki>1 20x20mm sample as well as 2", 4" and 6inch wafers | |||
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*All materials | *All materials | ||
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*Silicon | |||
*Poly Silicon | |||
*Silicon Oxide | |||
*Quartz/fused silica | |||
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