Specific Process Knowledge/Wafer cleaning/IMEC: Difference between revisions
| (5 intermediate revisions by 2 users not shown) | |||
| Line 1: | Line 1: | ||
{{cc-nanolab}} | |||
'''Feedback to this page''': '''[mailto:labadviser@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php/Specific_Process_Knowledge/Wafer_cleaning/IMEC click here]''' | '''Feedback to this page''': '''[mailto:labadviser@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php/Specific_Process_Knowledge/Wafer_cleaning/IMEC click here]''' | ||
'''Please note: This elaborate cleaning method is only used very rarely. It has turned out that at DTU Nanolab an '[http://labadviser.nanolab.dtu.dk/index.php/Specific_Process_Knowledge/Wafer_cleaning/RCA RCA clean]' prior to bonding (and do the cleaning and bonding very early in the morning with few people and thus lower particle level in the cleanroom) gives the best results. If you for some reason still prefer to do the IMEC clean described below, please contact DTU Nanolab to make arrangements. We do not have dedicated IMEC equipment which is immediately ready for use. | |||
<br> | |||
<br> | <br> | ||
===The IMEC process: Cleaning of wafers prior to fusion bonding=== | ===The IMEC process: Cleaning of wafers prior to fusion bonding=== | ||
The IMEC cleaning process is used in circumstances where extraordinary clean wafers are required. It is primarily intended for cleaning wafers prior to fusion bonding. This procedure is based on the IMEC cleaning process: ''M. Meuris et al. "The IMEC clean: A new concept for particle and metal removal on Si surfaces.", Solid state Technology, Vol. 38, Issue 7, pp 109-113, 1995.'' | The IMEC cleaning process is used in circumstances where extraordinary clean wafers are required. It is primarily intended for cleaning wafers prior to fusion bonding. This procedure is based on the IMEC cleaning process with slight modifications by Karen Birkelund.: ''M. Meuris et al. "The IMEC clean: A new concept for particle and metal removal on Si surfaces.", Solid state Technology, Vol. 38, Issue 7, pp 109-113, 1995.'' | ||
'''Information about equipment relevant to this procedure can be found in LabManager:'''<br> | '''Information about equipment relevant to this procedure can be found in LabManager:'''<br> | ||
| Line 18: | Line 18: | ||
Info page for '[http://labmanager.dtu.dk/function.php?module=Machine&view=view&mach=413 Wet bench 05: Al etch]'<br> | Info page for '[http://labmanager.dtu.dk/function.php?module=Machine&view=view&mach=413 Wet bench 05: Al etch]'<br> | ||
Info page for '[http://labmanager.dtu.dk/function.php?module=Machine&view=view&mach=383 Wafer Cleaning]'<br> | Info page for '[http://labmanager.dtu.dk/function.php?module=Machine&view=view&mach=383 Wafer Cleaning]'<br> | ||