Specific Process Knowledge/Lithography/Pretreatment: Difference between revisions
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|-style="background:WhiteSmoke; color:black" | |-style="background:WhiteSmoke; color:black" | ||
!Restrictions | !Restrictions | ||
| | |Low Tg polymer substrates, type IV films, and resist/polymer on substrate | ||
i.e. no resist coated wafers or | i.e. no resist coated wafers or Crystalbonded chips! | ||
|Wafers with metal is not allowed | |Wafers with metal is not allowed | ||
|Resist is not allowed | |Resist is not allowed | ||
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=Buffered HF-Clean= | =Buffered HF-Clean= | ||
[[image:BHF clean.JPG| | [[image:BHF clean.JPG|400px|thumb||BHF clean wetbench 04 in D-3.]] | ||
Another commonly used method to render the surface of silicon wafers hydrophobic is the dilute HF dip. | Another commonly used method to render the surface of silicon wafers hydrophobic is the dilute HF dip. | ||