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=<span style="background:#FF2800">THIS PAGE IS UNDER CONSTRUCTION</span>[[image:Under_construction.png|200px]]=
{{cc-nanolab}}


'''Feedback to this page''': '''[mailto:labadviser@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php?title=Specific_Process_Knowledge/Lithography click here]'''


=Lithography=
[[Image:DUV_wafers.jpg|500px|frameless|right|]]
__TOC__


'''Feedback to this page''': '''[mailto:photolith@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php?title=Specific_Process_Knowledge/Lithography click here]'''
Lithography is a method used for transferring a pattern from a physical or digital mask onto the substrate. At DTU Nanolab we have four different types of lithography available:
<!-- Replace "http://labadviser.danchip.dtu.dk/..." with the link to the Labadviser page-->
*[[Specific Process Knowledge/Lithography/UVLithography|UV Lithography]]: UV lithography is used for making features as small as about 1 micrometer
 
*[[Specific Process Knowledge/Lithography/DUVStepperLithography|DUV Stepper Lithography]]: DUV lithography is used for features as small as 200 nm
== Available lithography methods at Danchip ==
*[[Specific Process Knowledge/Lithography/EBeamLithography|E-beam Lithography]]: The smallest features can be made in our e-beam writers - about 10 nm
 
*[[Specific_Process_Knowledge/Imprinting|Nano Imprint Lithography]]: for stamping without irradiation
There are a broad varity of lithography methods at Danchip. The methods are compared here to make it easier for you to compare and choose the one that suits your needs.
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*[[/Deposition of silicon nitride using LPCVD|Process description using method 1]]
<!-- Link to the process info page in LabAdviser -->


*[[/Deposition of silicon nitride using LPCVD|Process description using method 2]]
=Comparing lithography methods at DTU Nanolab=
<!-- Link to the process info page in LabAvdiser -->


==Comparing lithography methods at Danchip==
{| class="wikitable" width="100%"
 
{|border="1" cellspacing="1" cellpadding="3" style="text-align:left;"  
|-
|-
 
!  !! [[Specific Process Knowledge/Lithography/UVLithography|UV Lithography]] !! [[Specific Process Knowledge/Lithography/DUVStepperLithography|DUV Stepper Lithography]] !! [[Specific Process Knowledge/Lithography/EBeamLithography|E-beam Lithography]] !! [[Specific_Process_Knowledge/Imprinting|Nano Imprint Lithography]]
|-
|-
|-style="background:silver; color:black"
! scope=row style="text-align: left;" | Generel description
!
| Pattern transfer via ultraviolet (UV) light || Pattern transfer via deep ultraviolet (DUV) light || Patterning by electron beam || Pattern transfer via hot embossing (HE)
![[Specific Process Knowledge/Lithography/UV Lithography|UV Lithography]]
![[/DUV Lithography|DUV Lithography]]
![[Specific Process Knowledge/Thin film deposition/PECVD|E-beam Lithography]]
![[Specific Process Knowledge/Thin film deposition/PECVD|Imprint Lithography]]
![[Specific Process Knowledge/Thin film deposition/PECVD|Two photon polymerization Lithography]]
 
|-
|-
 
! scope=row style="text-align: left;" | Pattern size range
| ~1 µm and up<br>(resist type, thickness, and pattern dependent) || ~200 nm and up<br>(pattern type, shape and pitch dependent) || ~10-1000 nm<br>(and larger at high currents) || ~20 nm and up
|-
|-
|-style="background:WhiteSmoke; color:black"
! scope=row style="text-align: left;" | Resist type
!Generel description
|
|Generel description - method 1
UV sensitive:
|Generel description - method 2
*AZ 5214E, AZ 4562, AZ MiR 701 (positive)
|3
*AZ 5214E, AZ nLOF 2020, SU-8 (negative)
|4
|  
|5
DUV sensitive:
*JSR KRF M230Y, JSR KRF M35G (positive)
*UVN2300-0.8 (negative)
|  
E-beam sensitive:
*AR-P6200 CSAR, ZEP502A , PMMA (positive)
*HSQ, mr-EBL, AR-N 7520 (negative)
|  
Imprint polymers:
*Topas
*PMMA
*mr-I 7030R
|-
|-
 
! scope=row style="text-align: left;" | Resist thickness range  
|-
| ~0.5 µm to 200 µm || ~50 nm to 2 µm || ~30 nm to 1 µm || ~100 nm to 2 µm
|-style="background:LightGrey; color:black"
!Pattern size range
|
*~1µm and up
|
*~200nm and up
|
*~10nm and up
|
*~20nm and up
|
*3D: 0.3 µm spot; 1.3 µm high
|-
 
|-
|-style="background:WhiteSmoke; color:black"
!Resist type
|
*UV sensitive:
**AZ
**SU-8
|
*DUV sensitive
**KSF M230Y
**KSF M35G
|
*E-beam sensitive
**ZEP502A (positive)
**HSQ (negative)
**SU-8
|
*Imprint polymers:
**??
|
*UV cross-linking:
**IP photoresists
**SU-8
|-
|-
|-style="background:LightGrey; color:black"
!Resist thickness range
|
*~0.5µm to 20µm?
|
*~50nm to 2µm?
|
*~30nm to 0.5 µm
|
*~20nm to 10µm?
|
*?nm - ?µm
|-
 
|-
|-style="background:WhiteSmoke; color:black"
!Typical exposure time
|
2s-30s pr. wafer
|
?-? pr. ?
|
Depends on dose (in units of muC/cm2), estimate exposure time on sheet 2 of e-beam logbook
|
? pr. wafer
|
? pr. µm2
|-
|-
! scope=row style="text-align: left;" | Typical exposure time
| Mask aligner: 10-180 s per wafer<br>Maskless aligner: 5-60 minutes per wafer
|
Process dependent:
*Pattern
*Pattern area
*Dose


Throughput is up to 60 wafers/hour
|
Process dependent:
*Dose [µC/cm<sup>2</sup>]: <math>Q</math>
*Beam current [A]: <math>I</math>
*Pattern area [cm<sup>2</sup>]: <math>a</math>


Process time [s]: <math>t = \frac{Q \sdot a}{I}</math>
| Process dependent, including heating/cooling rates
|-
|-
|-style="background:LightGrey; color:black"
! scope=row style="text-align: left;" | Substrate size
!Substrate size
|  
|
*chips down to 3 mm x 3 mm
*small samples
*50 mm wafers
*50 mm wafers
*100 mm wafers
*100 mm wafers
*150 mm wafers  
*150 mm wafers  
|
*200 mm wafers
|  
*100 mm wafers
*100 mm wafers
*150 mm wafers  
*150 mm wafers  
*200 mm wafers
*200 mm wafers
|
|  
We have cassettes that fit to
We have cassettes fitting:
*4 small samples (20mm, 12mm, 8mm, 4mm)
*4 small samples (slit openings: 20mm, 12mm, 8mm, 4mm)
*6 wafers of 50 mm in size
*6 wafers of 50 mm in size
*2 wafers of 100 mm in size
*3 wafers of 100 mm in size
*1 wafer of 150 mm in size  
*1 wafer of 150 mm in size  
Only one cassette can be loaded at time
*1 wafer of 200 mm in size
|
Only one cassette can be loaded at a time
|  
*small samples
*small samples
*50 mm wafers
*50 mm wafers
*100 mm wafers
*100 mm wafers
*150 mm wafers  
*150 mm wafers
|
*Cover slides
*50 mm wafers
*100 mm wafers
*IBIDI
|-
|-
|-style="background:WhiteSmoke; color:black"
! scope=row style="text-align: left;" | Allowed materials  
!'''Allowed materials'''
| Any standard cleanroom material
|
| Any standard cleanroom material
*Allowed material 1
|  
*Allowed material 2
Any standard cleanroom material, except:
|
*Materials that will degas
*Allowed material 1
*Graphene requires special treatment
*Allowed material 2
| Any standard cleanroom material  
*Allowed material 3
|
*Si, SiO2, III-V materials
|
*Allowed material 1
*Allowed material 2
*Allowed material 3
|
*Allowed material 1
*Allowed material 2
*Allowed material 3
|-
|-
|}
|}
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=Equipment and Process Pages=
{{:Specific Process Knowledge/Lithography/UVlithographyProcessPages}}
=Lithography Tool Package Training=
DTU Nanolab offers a Tool Package Training course for Lithography (TPT Lithography), which covers the basic theory of lithography as well as an introduction to some of the most used tools for lithographic processing.
You are required to pass this course in order to become eligible for tool training on the lithography equipment in the cleanroom facility of DTU Nanolab. The course includes theory on lithographic processes and common equipment operation and consists of lecture videos followed by a quiz for each video. Once completed successfully, you may continue to the online equipment training for the specific lithography equipment you want to use. After completing the online equipment training, you can then request hands-on training for the equipment in the cleanroom via [mailto:training@nanolab.dtu.dk training@nanolab.dtu.dk].
The course is available via DTU Learn. You sign up for the course by enrolling yourself in the course [https://www.nanolab.dtu.dk/access/cleanroom-access/equipment-training/lithography-tool-training here]
'''TPT lithography course contents'''
* Online lecture videos
* Online quiz for each lecture video
'''Learning objectives'''
* Coating
* Exposure
* Development
* Resist, substrates and pre-treatment
* Post-lithography steps
'''Course responsible'''
* Jens Hindborg Hemmingsen
* Thomas Aarøe Anhøj
If you have questions you can contact us via [mailto:lithography@nanolab.dtu.dk lithography@nanolab.dtu.dk]


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=Knowledge and Information about Lithography=
{| style="color: black;" width="90%"
| colspan="3" |
|-
| style="width: 20%"; valign="top"|
'''<big>Literature</big>'''
*[http://onlinelibrary.wiley.com/doi/10.1002/9781119990413.ch9/pdf  Franssila, 2010, Chapter 9: Optical Lithography]
*[http://onlinelibrary.wiley.com/doi/10.1002/9781119990413.ch10/pdf Franssila, 2010, Chapter 10: Advanced Lithography]
*[https://archive.org/details/manualzilla-id-5701639/page/n39/mode/2up Handbook of Microlithography, Micromachining, and Microfabrication, Chapter 2: E-beam Lithography]
*[http://onlinelibrary.wiley.com/doi/10.1002/9781118557662.ch3/summary Stefan Landis,Lithography, Chapter 3: E-beam Lithography]
*[https://www.microchemicals.com/downloads/application_notes.html Application notes] from MicroChemicals GmbH, e.g. [https://www.microchemicals.com/dokumente/application_notes/lithography_trouble_shooting.pdf Lithography Trouble-Shooter]




==Equipment Pages==
'''<big>Lecture videos</big>'''
*Lithography TPT lecture videos:
**Current version (6 videos, 1:28 hours:minutes in total) on [https://www.youtube.com/playlist?list=PLjWVU97LayHCp7x9OujmVlZWLAnK4CDFR YouTube]
**Old version (7 videos, 2:41 hours in total) on [https://www.youtube.com/playlist?list=PLjWVU97LayHCHDueZ8qdT1LXJLGr4wLOa YouTube]
*A full [https://www.youtube.com/watch?v=TdwUGOxCdUc&index=39&list=PLM2eE_hI4gSDjK4SiDbhpmpjw31Xyqfo_ lecture series] from a UT Austin course on microfabrication by "litho guru" Chris Mack. Half of the lectures are on (projection) lithography :-)


===[[Specific Process Knowledge/Lithography/Pretreatment|Pretreatment]]===
| style="width: 20%"; valign="top"|
*[[Specific Process Knowledge/Lithography/Pretreatment#HMDS|HMDS]]
<!-- Removed by TARAN 2024-09-27
*[[Specific Process Knowledge/Lithography/Pretreatment#BHF|BHF]]
'''<big>Lithography TPT lecture slides</big>'''<br>
*[[Specific Process Knowledge/Lithography/Pretreatment#250_C_oven_for_pretreatment|250C Oven for Pretreatment]]
''' NB: Access to slides require login'''
*[https://labmanager.dtu.dk/view_binary.php?class=MiscDocument&id=4&name=Litho_Tool_Package_-_Introduction.pdf TPT slides: Introduction]
*[https://labmanager.dtu.dk/view_binary.php?class=MiscDocument&id=4&name=Litho_Tool_Package_-_Spin_coating.pdf TPT slides: Spin Coating]
*[https://labmanager.dtu.dk/view_binary.php?class=MiscDocument&id=4&name=Litho_Tool_Package_-_Exposure.pdf TPT slides: UV Exposure]
*[https://labmanager.dtu.dk/view_binary.php?class=MiscDocument&id=4&name=Litho_Tool_Package_-_Development.pdf TPT slides: Development]
*[https://labmanager.dtu.dk/view_binary.php?class=MiscDocument&id=4&name=Litho_Tool_Package_-_Post_processing.pdf TPT slides: Post-processing]
*[https://labmanager.dtu.dk/view_binary.php?class=MiscDocument&id=4&name=Litho_Tool_Package_-_Process_effects_and_examples.pdf TPT slides: Process Effects and Examples]
-->


===[[Specific Process Knowledge/Lithography/Coaters|Coaters]]===
'''<big>Training videos</big>'''
*[[Specific Process Knowledge/Lithography/Coaters#SSES pinner|SSE Spinner]]
*[https://www.youtube.com/watch?v=3JhM3rmLVpA Training Video: Automatic Spin Coater]
*[[Specific Process Knowledge/Lithography/Coaters#Track 1 + 2|Track 1 + 2]]
*[https://www.youtube.com/watch?v=_neUkDsQhsM: Training Video: Manual Spin Coater Labspin]
*[[Specific Process Knowledge/Lithography/Coaters#KS Spinner|KS Spinner]]
*[https://www.youtube.com/watch?v=o8IBtfQHNzU Training Video: UV Mask Aligner Part I (Operation)]
*[[Specific Process Knowledge/Lithography/Coaters#Manual Spinner (Polymers)|Manual Spinner (Polymers)]]
*[https://www.youtube.com/watch?v=rvUuXYgw-xU Training Video: UV Mask Aligner Part II (Alignment)]
*[https://www.youtube.com/watch?v=GyTQNmbev2c Training Video: Maskless aligner Training Video]
*[https://www.youtube.com/watch?v=Vpa9QoCHA4I Training Video: Maskless aligner Conversion]
*[https://www.youtube.com/watch?v=wIF-oqVR1Dc Training Video: Maskless aligner Series and Navigation]
*[https://youtu.be/yclriey6xpM Training Video: Maskless aligner Alignment]
*[https://www.youtube.com/watch?v=fs9DRH0Eo3k Training Video: Automatic Puddle Developer]
*[https://www.youtube.com/watch?v=btinNzYnLnY Training Video: Manual Puddle Developer]
'''Playlists on YouTube:'''
*[https://www.youtube.com/playlist?list=PLjWVU97LayHAiCabstMfAUeeWyQoQI_cV Maskless aligner (MLA) training videos]
*[https://www.youtube.com/playlist?list=PLjWVU97LayHCX4sz2AH_YiPbNRmkrBYe5 Lithography equipment training videos (old)]




===[[Specific Process Knowledge/Lithography/UVExposure|UV Exposure]]===
| style="width: 20%"; valign="top"|
===[[Specific Process Knowledge/Lithography/Baking|Baking]]===
'''<big>Manuals</big>'''<br>
===[[Specific Process Knowledge/Lithography/Developing|Developing]]===
''NB: Access to manuals require DTU login''
===[[Specific Process Knowledge/Lithography/StripLiftOff|Strip, Lift-off]]===
*Automatic Spin Coater: [https://labmanager.dtu.dk/d4mb/show.php?dokId=4140&mach=359 Spin Coater: Gamma UV]
===[[Specific Process Knowledge/Lithography/WaferCleaning|Wafer Cleaning]]===
*Manual Spin Coater: [https://labmanager.dtu.dk/d4mb/show.php?dokId=5073&mach=362 Spin Coater: Labspin 02] or [https://labmanager.dtu.dk/d4mb/show.php?dokId=5074&mach=387 Spin Coater: Labspin 03]
===[[Specific Process Knowledge/Lithography/Characterization|Characterization]]===
*Maskless Aligners: [https://labmanager.dtu.dk/d4mb/show.php?dokId=4975&mach=422 MLA 01] or [https://labmanager.dtu.dk/d4mb/show.php?dokId=6270&mach=440 MLA 02] or [https://labmanager.dtu.dk/d4mb/show.php?dokId=6618&mach=464 MLA 02]
===[[Specific Process Knowledge/Lithography/LaserWriter|LaserWriter]]===
*UV Mask Aligner: [https://labmanager.dtu.dk/d4mb/show.php?dokId=3822&mach=339 MA6-2]
===[[Specific Process Knowledge/Lithography/DUVStepper|DUV Stepper]]===
*Automatic Puddle Developer: [https://labmanager.dtu.dk/d4mb/show.php?dokId=3561&mach=329 Developer: TMAH UV-lithography]
===[[Specific Process Knowledge/Lithography/EBeamLithography|E-Beam Lithography]]===
*Manual Puddle Developer: [https://labmanager.dtu.dk/d4mb/show.php?dokId=3274&mach=324 Developer: TMAH Manual]
===[[Specific Process Knowledge/Lithography/NanoImprintLithography|NanoImprint Lithography]]===
*Manual E-beam Developer: [https://labmanager.dtu.dk/d4mb/show.php?dokId=20599&mach=527 Developer: E-beam Manual]
===[[Specific Process Knowledge/Lithography/3DLithography|3D Lithography]]===
 
 
'''<big>Process Flows</big>'''
*[[Specific_Process_Knowledge/Lithography/Resist#UV_resist_comparison_table|UV resist process flows]]
*[[Specific_Process_Knowledge/Lithography/EBeamLithography/FirstEBL#Resist_coating|E-beam resist process flows]]
|}
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