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Ething of Gold can be done either wet or dry. For wet etching please see below on this page. Dry etching can be done with [[Specific Process Knowledge/Etch/IBE⁄IBSD Ionfab 300|IBE]] by sputtering with Ar ions.  
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==Etching of Gold==
==Etching of Gold==


Etching of Gold can be done either by wet etch, dry etch or by sputtering with ions.
Etching of Gold can be done either by wet etch, or by sputtering with ions.
*[[Specific Process Knowledge/Etch/Wet Gold Etch|Etching of Gold by wet etch]]
*[[Specific Process Knowledge/Etch/Wet Gold Etch|Etching of Gold by wet etch]]
*[[Specific_Process_Knowledge/Etch/IBE&frasl;IBSD Ionfab 300/IBE Au etch|Sputtering of Au]]
*[[Specific_Process_Knowledge/Etch/IBE&frasl;IBSD Ionfab 300/IBE Au etch|Sputtering of Au]]
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|-style="background:WhiteSmoke; color:black"
|-style="background:WhiteSmoke; color:black"
!Generel description
!Generel description
|Wet etch of Au using Iodine based chemistry
|Wet etch of Au using iodine based chemistry
|Wet etch of Au using Aqua Regina
|Wet etch of Au using Aqua Regina
|Sputtering of Au - pure physical etch
|Sputtering of Au - pure physical etch
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*~100nm/min
*~100nm/min
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|
*~?nm/min - fast etch
*680 nm/min (dilute) or faster (concentrated). Mainly used for complete removal of metals
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|
*~55nm/min (acceptance test)  
*~55nm/min (acceptance test)  
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*Photoresist
*Photoresist
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|
*None (only used for stipping Au)
*None (mainly used for stripping Au)
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|
*Any material that is allowed in the chamber, photoresists included  
*Any material that is allowed in the chamber, photoresists included  
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