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Ething of Gold can be done either wet or dry. For wet etching please see below on this page. Dry etching can be done with [[Specific Process Knowledge/Etch/IBE⁄IBSD Ionfab 300|IBE]] by sputtering with Ar ions.  
'''Unless anything else is stated, everything on this page, text and pictures are made by DTU Nanolab.'''


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==Etching of Gold==
'''Feedback to this page''': '''[mailto:labadviser@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php/Specific_Process_Knowledge/Etch/Etching_of_Gold click here]'''
[[Image:fumehoodetch-gold.jpg |300x300px|thumb|Wet Gold Etch: Done in the fumehood positioned in cleanroom 2]]
Etching of Gold is done wet at Danchip making your own set up in a beaker in the fumehood. We have two different solutions:
 
# Iodine etch: KI:I<sub>2</sub>:H<sub>2</sub>O - 100g:25g:500ml - standard at Danchip. Can be used with AZ resist as mask.
# Aqua Regia (Kongevand): HNO<sub>3</sub>:HCl - 1:3 - A very strong acid witch will etch most metals and are therefore used when you wish to remove all the gold from your wafer. '''you have to be very carefull when you work with Aqua Regia (Kongevand) It can generate nitrous gases witch are very toxic!!'''
 
 
===Comparing the two solutions===
 
{| border="2" cellspacing="0" cellpadding="4" align="left"
!
! Iodine based gold etch
! Aqua Regia (Kongevand)
|-
|'''General description'''
|
Etch of pure Gold with or without photoresist mask.
|
Etch of pure Gold (as stripper).
|-
|'''Chemical solution'''
|KI:I<sub>2</sub>:H<sub>2</sub>O  (100g:25g:500ml)
|HCl:HNO<sub>3</sub>  (3:1)
|-
|'''Process temperature'''
|20 <sup>o</sup>C
 
|20 <sup>o</sup>C
 
|-
 
|'''Possible masking materials'''
|
Photoresist (1.5 µm AZ5214E)
|
Unmasked - used as a stripper
|-
|'''Etch rate'''
|
~100 nm/min
|
~(??) nm/min - fast etch
|-
|'''Batch size'''
|
1-5  4" wafers at a time
|
1-5 4" wafer at a time
|-
|'''Size of substrate'''
|
2-6" wafers
|
2-6" wafers
|-
|}
 
 
'''Feedback to this page''': '''[mailto:labadviser@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Etch/Etching_of_Gold click here]'''
 
=<span style="background:#FF2800">THIS PAGE IS UNDER CONSTRUCTION</span>[[image:Under_construction.png|200px]]=
 


==Etching of Gold==
==Etching of Gold==


Etching of Gold can be done either by wet etch, dry etch or by sputtering with ions.
Etching of Gold can be done either by wet etch, or by sputtering with ions.
*[[Specific Process Knowledge/Etch/Wet Gold Etch|Etching of Gold by wet etch]]
*[[Specific Process Knowledge/Etch/Wet Gold Etch|Etching of Gold by wet etch]]
*[[Specific_Process_Knowledge/Etch/IBE&frasl;IBSD Ionfab 300/IBE Au etch|Sputtering of Au]]
*[[Specific_Process_Knowledge/Etch/IBE&frasl;IBSD Ionfab 300/IBE Au etch|Sputtering of Au]]
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==Comparison of Gold Etch Methods==
==Comparison of Gold Etch Methods==


{|border="1" cellspacing="1" cellpadding="1" style="text-align:left;"  
{|border="1" cellspacing="1" cellpadding="3" style="text-align:left;"  
|-
|-


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|-style="background:WhiteSmoke; color:black"
|-style="background:WhiteSmoke; color:black"
!Generel description
!Generel description
|Wet etch of Au using Iodine based chemistry
|Wet etch of Au using iodine based chemistry
|Wet etch of Au using Aqua Regina
|Wet etch of Au using Aqua Regina
|Sputtering of Au - pure physical etch
|Sputtering of Au - pure physical etch
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*~100nm/min
*~100nm/min
|
|
*~?nm/min - fast etch
*680 nm/min (dilute) or faster (concentrated). Mainly used for complete removal of metals
|
|
*~55nm/min (acceptance test)  
*~55nm/min (acceptance test)  
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|
|
*Anisotropic (angles sidewalls, typical around 70 dg)
*Anisotropic (angles sidewalls, typical around 70 dg)
|-
|-style="background:LightGrey; color:black"
!Masking material
|
*Photoresist
|
*None (mainly used for stripping Au)
|
*Any material that is allowed in the chamber, photoresists included
|-
|-




|-
|-
|-style="background:LightGrey; color:black"
|-style="background:WhiteSmoke; color:black"
!Substrate size
!Substrate size
|
|
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|-
|-
|-style="background:WhiteSmoke; color:black"
|-style="background:LightGrey; color:black"
!'''Allowed materials'''
!'''Allowed materials'''
|
|
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