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==Etching of Titanium==
==Etching of Titanium==


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==Comparison of Titanium Etch Metodes==
==Comparison of Titanium Etch Methodes==


{|border="1" cellspacing="1" cellpadding="3" style="text-align:left;"  
{|border="1" cellspacing="1" cellpadding="3" style="text-align:left;"  
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|-style="background:WhiteSmoke; color:black"
|-style="background:WhiteSmoke; color:black"
!Generel description
!Generel description
|BHF:Etch of titanium with or without photoresist mask.
|BHF Etch of titanium with or without photoresist mask.
|Cold RCA1: Etch of titanium (as stripper or with eagle resist).  
|Cold RCA1 mix etch of titanium (as stripper or with eagle resist).  
|Dry plasma etch of Ti
|Dry plasma etch of Ti
|Sputtering of Ti - pure physical etch
|Sputtering of Ti - pure physical etch
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*smaller pieces on a carrier wafer
*smaller pieces on a carrier wafer
*<nowiki>#</nowiki>1 100mm wafers (when set up to 100mm wafers)
*<nowiki>#</nowiki>1 100mm wafers (if you place it/bond it on a 150 mm carrier wafer)
*<nowiki>#</nowiki>1 150mm wafers (when set up to 150mm wafers)
*<nowiki>#</nowiki>1 150mm wafers  
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Smaller pieces glued to carrier wafer
Smaller pieces glued to carrier wafer
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Ething of Titanium can be done either wet or dry. For wet etching please see below on this page. Dry etching can be done either with [[Specific Process Knowledge/Etch/ICP Metal Etcher|ICP]] using Chlorine chemistry or with [[Specific Process Knowledge/Etch/IBE/IBSD Ionfab 300|IBE]] by sputtering with Ar ions.
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