Specific Process Knowledge/Etch/Etching of Titanium: Difference between revisions
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==Etching of Titanium== | ==Etching of Titanium== | ||
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<br clear="all" /> | <br clear="all" /> | ||
==Comparison of Titanium Etch | ==Comparison of Titanium Etch Methodes== | ||
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! | ! | ||
![[Specific Process Knowledge/Etch/Wet | ![[Specific Process Knowledge/Etch/Wet Titanium Etch|Ti wet etch 1]] | ||
![[Specific Process Knowledge/Etch/Wet | ![[Specific Process Knowledge/Etch/Wet Titanium Etch|Ti wet etch 2]] | ||
![[Specific_Process_Knowledge/Etch/ICP_Metal_Etcher|ICP metal]] | ![[Specific_Process_Knowledge/Etch/ICP_Metal_Etcher|ICP metal]] | ||
![[Specific_Process_Knowledge/Etch/IBE⁄IBSD Ionfab 300|IBE (Ionfab300+)]] | ![[Specific_Process_Knowledge/Etch/IBE⁄IBSD Ionfab 300|IBE (Ionfab300+)]] | ||
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!Generel description | !Generel description | ||
|BHF | |BHF Etch of titanium with or without photoresist mask. | ||
|Cold RCA1 | |Cold RCA1 mix etch of titanium (as stripper or with eagle resist). | ||
|Dry plasma etch of Ti | |Dry plasma etch of Ti | ||
|Sputtering of Ti - pure physical etch | |Sputtering of Ti - pure physical etch | ||
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!Etch rate range | !Etch rate range | ||
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*~ | *~?nm/min | ||
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*~?nm/min | *~?nm/min | ||
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*~ | *~50-200 nm/min (depending on features size and etch load and recipe settings) | ||
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*~ | *~20nm/min | ||
|- | |- | ||
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*smaller pieces on a carrier wafer | *smaller pieces on a carrier wafer | ||
*<nowiki>#</nowiki>1 100mm wafers ( | *<nowiki>#</nowiki>1 100mm wafers (if you place it/bond it on a 150 mm carrier wafer) | ||
*<nowiki>#</nowiki>1 150mm wafers | *<nowiki>#</nowiki>1 150mm wafers | ||
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Smaller pieces glued to carrier wafer | Smaller pieces glued to carrier wafer | ||
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|} | |} | ||