Specific Process Knowledge/Etch/Etching of Titanium: Difference between revisions
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<!--Page reviewed by jmli 1/8-2016 --> | <!--Page reviewed by jmli 1/8-2016 --> | ||
==Etching of Titanium== | ==Etching of Titanium== | ||
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|-style="background:WhiteSmoke; color:black" | |-style="background:WhiteSmoke; color:black" | ||
!Generel description | !Generel description | ||
|BHF | |BHF Etch of titanium with or without photoresist mask. | ||
|Cold RCA1 | |Cold RCA1 mix etch of titanium (as stripper or with eagle resist). | ||
|Dry plasma etch of Ti | |Dry plasma etch of Ti | ||
|Sputtering of Ti - pure physical etch | |Sputtering of Ti - pure physical etch | ||
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*smaller pieces on a carrier wafer | *smaller pieces on a carrier wafer | ||
*<nowiki>#</nowiki>1 100mm wafers ( | *<nowiki>#</nowiki>1 100mm wafers (if you place it/bond it on a 150 mm carrier wafer) | ||
*<nowiki>#</nowiki>1 150mm wafers | *<nowiki>#</nowiki>1 150mm wafers | ||
| | | | ||
Smaller pieces glued to carrier wafer | Smaller pieces glued to carrier wafer | ||