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Specific Process Knowledge/Lithography/Coaters/GammaDUV: Difference between revisions

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==Spin coater: Süss stepper==
==Spin coater: Süss stepper==
[[Image:Gamma_2M.jpg|300x300px|right|thumb|The SÜSS Spinner-Stepper is placed in F-3]]
[[Image:Gamma_2M.jpg|400px|right|thumb|The SÜSS Spinner-Stepper is placed in F-3]]


This spinner is dedicated for spinning DUV resists. The spinner is fully automatic and can run up to 25 substrates in a batch  4", 6", and 8" size (8" requires tool change). The machine is equipped with the 3 resist lines (DUV42S-6, KRF M230Y, and KRF M35G), as well as a syringe dispense system.
This spinner is dedicated for spinning DUV resists. The spinner is fully automatic and can run up to 25 substrates in a batch  4", 6", and 8" size (8" requires tool change). The machine is equipped with the 3 resist lines (DUV42S-6, KRF M230Y, and KRF M35G), as well as a syringe dispense system.
   
   
'''The user manual, quality control procedures and results, user APVs, and contact information can be found in LabManager:'''
The user manual, quality control procedures and results, user APVs, and contact information can be found in LabManager:
Equipment info in [http://labmanager.dtu.dk/function.php?module=Machine&view=view&mach=279 LabManager]
 
Equipment info in [http://labmanager.dtu.dk/function.php?module=Machine&view=view&mach=279 LabManager] - '''requires login'''


{{:Specific Process Knowledge/Lithography/Resist/DUVresist}}
{{:Specific Process Knowledge/Lithography/Resist/DUVresist}}
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===Equipment performance and process related parameters===
===Equipment performance and process related parameters===


{| border="2" cellspacing="0" cellpadding="2"  
{|border="1" cellspacing="1" cellpadding="10" style="text-align:left;"  


!style="background:silver; color:black;" align="center" width="60"|Purpose  
!style="background:silver; color:black;" align="center" width="60"|Purpose  
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|-
|-


!style="background:silver; color:black;" align="center" width="60"|Resist  
!style="background:silver; color:black; width="60"|Resist  
|style="background:LightGrey; color:black"|
|style="background:LightGrey; color:black"|
|style="background:WhiteSmoke; color:black" align="center" colspan="2"|
|style="background:WhiteSmoke; color:black" colspan="2"|
*BARC DUV42S-6
*BARC DUV42S-6
*Positive tone resist KRF M230Y
*Positive tone resist KRF M230Y
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!style="background:silver; color:black;" align="center" width="60"|Performance
!style="background:silver; color:black;" align="center" width="60"|Performance
|style="background:LightGrey; color:black"|Coating thickness
|style="background:LightGrey; color:black"|Coating thickness
|style="background:WhiteSmoke; color:black" align="center" colspan="2"|
|style="background:WhiteSmoke; color:black" colspan="2"|
*BARC DUV42S-6 60-90nm
*BARC DUV42S-6 60-90nm
*Positive tone resist KRF M230Y 300-600nm
*Positive tone resist KRF M230Y 300-600nm
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!style="background:silver; color:black" align="center" valign="center" rowspan="3"|Process parameters
!style="background:silver; color:black" align="center" valign="center" rowspan="3"|Process parameters
|style="background:LightGrey; color:black"|Spin speed
|style="background:LightGrey; color:black"|Spin speed
|style="background:WhiteSmoke; color:black" align="center" colspan="2"|
|style="background:WhiteSmoke; color:black" colspan="2"|
10 - 5000 rpm
  10 - 5000 rpm
|-
|-
|style="background:LightGrey; color:black"|Spin acceleration
|style="background:LightGrey; color:black"|Spin acceleration
|style="background:WhiteSmoke; color:black" align="center" colspan="2"|
|style="background:WhiteSmoke; color:black" colspan="2"|
100 - 10000 rpm/s
  100 - 10000 rpm/s
|-
|-
|style="background:LightGrey; color:black"|Hotplate temperature
|style="background:LightGrey; color:black"|Hotplate temperature
|style="background:WhiteSmoke; color:black" align="center" colspan="2"|
|style="background:WhiteSmoke; color:black" colspan="2"|
*175°C for BARC baking
*175°C for BARC baking
*130°C for positive tone resist soft baking and post exposure baking
*130°C for positive tone resist soft baking and post exposure baking
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!style="background:silver; color:black" align="center" valign="center" rowspan="3"|Substrates
!style="background:silver; color:black" align="center" valign="center" rowspan="3"|Substrates
|style="background:LightGrey; color:black"|Substrate size
|style="background:LightGrey; color:black"|Substrate size
|style="background:WhiteSmoke; color:black" align="center" colspan="2"|
|style="background:WhiteSmoke; color:black" colspan="2"|
*100 mm wafers
*100 mm wafers
*150 mm wafers
*150 mm wafers
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|-
|-
| style="background:LightGrey; color:black"|Allowed materials
| style="background:LightGrey; color:black"|Allowed materials
|style="background:WhiteSmoke; color:black" align="center" colspan="2"|
|style="background:WhiteSmoke; color:black" colspan="2"|
*Any standard cleanroom material  
*Any standard cleanroom material  
|-
|-
|style="background:LightGrey; color:black"|Batch
|style="background:LightGrey; color:black"|Batch
|style="background:WhiteSmoke; color:black" align="center" colspan="2"|
|style="background:WhiteSmoke; color:black" colspan="2"|
1 - 25
  1 - 25
|-  
|-  
|}
|}
<br clear="all" />
<br clear="all" />