Specific Process Knowledge/Bonding: Difference between revisions

@@ Line 1: / Line 1: @@
-'''Feedback to this page''': '''[mailto:labadviser@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Bonding click here]'''
+{{cc-nanolab}}
+'''Feedback to this page''': '''[mailto:labadviser@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php/Specific_Process_Knowledge/Bonding click here]'''
+<BR>
+<BR>
+==Bonding==
+For bonding samples to a carrier wafer in order to enable '''dry etching''', please go [[Specific_Process_Knowledge/Etch/DryEtchProcessing/Bonding|here]].
+For bonding samples to a carrier wafer for '''UV-lithography''' using automatic coater and developer, please see this process flow: [[media:Process_Flow_ChipOnCarrier.docx‎|Process_Flow_ChipOnCarrier.docx‎]], and refer to the [[Specific_Process_Knowledge/Etch/DryEtchProcessing/Bonding#Bonding|bonding procedure]] for dry etching.
 == Choose equipment ==
@@ Line 54: / Line 61: @@
 |-style="background:WhiteSmoke; color:black"
 !Substrate size
-|Up to 6"
+|Up to 4"
-|Up to 6"
+|Up to 4"
-|Up to 6"
+|Up to 4"
 |-