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Specific Process Knowledge/Wafer and sample drying: Difference between revisions

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{{cc-nanolab}}
'''Feedback to this page''': '''[mailto:labadviser@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Wafer_and_sample_drying click here]'''  
'''Feedback to this page''': '''[mailto:labadviser@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Wafer_and_sample_drying click here]'''  


'''Unless anything else is stated, everything on this page, text and pictures are made by DTU Nanolab.'''
 
 
=Drying Comparison Table=
=Drying Comparison Table=


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!Equipment  
!Equipment  


|[[Specific_Process_Knowledge/Wafer_and_sample_drying #Spin dryers|Spin dryer 2]]
|[[Specific_Process_Knowledge/Wafer_and_sample_drying #Spin dryer 2|Spin dryer 2]]
|[[Specific_Process_Knowledge/Wafer_and_sample_drying #Spin dryers|Spin dryer 3]]
|[[Specific_Process_Knowledge/Wafer_and_sample_drying #Spin dryer 3|Spin dryer 3]]
|[[Specific_Process_Knowledge/Wafer_and_sample_drying #Spin dryers|Spin dryer 4]]
|[[Specific_Process_Knowledge/Wafer_and_sample_drying #Spin dryer 5|Spin dryer 5]]
|[[Specific_Process_Knowledge/Wafer_and_sample_drying #Spin dryers|Spin dryer 5]]
|[[Specific_Process_Knowledge/Wafer_and_sample_drying #Spin dryer 6|Spin dryer 6]]
|[[Specific_Process_Knowledge/Wafer_and_sample_drying/Critical Point Dryer|Critical point dryer]]
|[[Specific_Process_Knowledge/Wafer_and_sample_drying/Critical Point Dryer|Critical point dryer]]
|[[Specific_Process_Knowledge/Wafer_and_sample_drying #Ethanol fume dryer|Ethanol fume dryer]]
|[[Specific_Process_Knowledge/Wafer_and_sample_drying #Nitrogen guns|N<sub>2</sub> guns]]
|[[Specific_Process_Knowledge/Wafer_and_sample_drying #Nitrogen guns|N<sub>2</sub> guns]]
|-
|-
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*D-3
*D-3
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*C-1
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*In fumehoods and at chemical benches
*In fumehoods and at chemical benches
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*Drying
*Drying
*Rinsing + drying
*Rinsing + drying
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*Drying sensitive samples. E.g. with cantilevers
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*Drying sensitive samples. E.g. with cantilevers
*Drying sensitive samples. E.g. with cantilevers
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!Batch size
!Batch size
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*1-25 100 mm wafers
*100 mm wafers: 1-25
*1-25 150 mm wafers
*150 mm wafers: 1-25
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*1-25 100 mm wafers
*100 mm wafers: 1-25
*1-25 150 mm wafers
*150 mm wafers: 1-25
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*1-25 100 mm wafers
*100 mm wafers: 1-25
*1-25 150 mm wafers
*150 mm wafers: 1-25
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*1-25 100 mm wafers
*100 mm wafers: 1-25
*1-25 150 mm wafers
*150 mm wafers: 1-25
*1-25 200 mm wafers  
*200 mm wafers: 1-25
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*1 to 5 wafers per run. Sizes: 2”, 4" or 6"
*1 to 5 wafers per run. Sizes: 2”, 4" or 6"
* Pieces (up to 10x10mm)
* Pieces (up to 10x10mm)
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*1-25 50 mm wafers
*1-25 100 mm wafers
*Pieces if a suitable carrier is available
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*One sample at a time
*One sample at a time
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*InAlP, GaAs
*InAlP, GaAs
*SU8
*SU8
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*No restriction except for polymers
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*No restriction
*No restriction
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'''The user manual, technical information, and contact information can be found in LabManager: [http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=157 Spin dryer 2] [http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=158 Spin dryer 3]'''
'''The user manual, technical information, and contact information can be found in LabManager: [http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=157 Spin dryer 2] [http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=158 Spin dryer 3]  [https://labmanager.dtu.dk/function.php?module=Machine&view=view&mach=408 Spin dryer 5] [https://labmanager.dtu.dk/function.php?module=Machine&view=view&mach=323 Spin dryer 6 (8")]'''




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#Dry with nitrogen and anti-static purge for 30 seconds at 1800 RPM
#Dry with nitrogen and anti-static purge for 30 seconds at 1800 RPM


All spin dryers use the following carriers:
*100 mm wafers: A72-40MB
*150 mm wafers: A182-60MB
*200 mm wafers: A192-80M
<span style="color:red">It is not allowed to use other carriers in the spin dryers, as this may damage the motor due to incorrect mass distribution. It may also cause fragile wafers to break due to excessive vibrations caused by the mass imbalance.</span>
== Spin dryer 2 ==
[[File:spinDryer_2.jpg|640px|thumb|right]]
Spin dryer 2 is for RCA processing only, and is located in B-1 next to the RCA bench.
*Top chamber: 100 mm wafers
*Bottom chamber: 150 mm wafers
<br clear="all" />
== Spin dryer 3 ==
[[File:spinDryer_3.jpg|640px|thumb|right]]


<gallery caption="Different places to dry your wafers" widths="275px" heights="225px" perrow="5">
Spin dryer 3 is located in D-3 between the working table and wet bench 03.
image:Spin_dryer_2ny.jpg|Spin dryer 2 for RCA cleaned wafers only in B-1. Can take 4" wafers (top) and 6" wafers (bottom).
*Top chamber: 100 mm wafers
image:Spin_dryer_3.jpg|Spin dryer 3 for 4" wafers (top) and 6" wafers (bottom) in D-3.
*Bottom chamber: 150 mm wafers
image:Spin_dryer_5.JPG|Spin dryer 5 for 8", 6" and 4" wafers in the same chamber, with different carrier holders.
</gallery>


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= Ethanol fume dryer =
== Spin dryer 5 ==


If your wafers are fragile or having thin membranes, cantilevers or suspended bridges that risk to stick or adhere to the surface it can be a good idea to dry your wafers in the ethanol fume dryer. Ethanol is heated to 70°C and your wafers are placed in the fumes of Ethanol which will make the water evaporate from the surface.
[[File:spinDryer_4.jpg|640px|thumb|right]]
The Ethanol dryer is placed on a shelf or trolly in D-3 and looks like a US bath. Describtion on how to use is written on the bath.


Spin dryer 5 is located in D-3 between the HF vapor phase etcher and wet bench 07.
*Top chamber: 100 mm wafers
*Bottom chamber: 150 mm wafers


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== Spin dryer 6 ==
[[File:spinDryer_5.jpg|640px|thumb|right]]
Spin dryer 6 is located in F-3 Next to the Developer: TMAH stepper. It has a single process chamber that is capable of processing 100 mm, 150 mm and 200 mm wafers. The wafer size is easily changed, by changing the rotor insert frame.
<br clear="all" /><br clear="all" />


= Nitrogen guns =
= Nitrogen guns =