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{{cc-nanolab}}
'''Feedback to this page''': '''[mailto:labadviser@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Wafer_and_sample_drying click here]'''  
'''Feedback to this page''': '''[mailto:labadviser@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Wafer_and_sample_drying click here]'''  


=Drying Comparison Table=
=Drying Comparison Table=
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|-style="background:lightgray; color:black"
|-style="background:lightgray; color:black"
!Equipment  
!Equipment  
|[[Specific_Process_Knowledge/Wafer_and_sample_drying #Spin dryers|Spin dryer 1]]
 
|[[Specific_Process_Knowledge/Wafer_and_sample_drying #Spin dryers|Spin dryer 2]]
|[[Specific_Process_Knowledge/Wafer_and_sample_drying #Spin dryer 2|Spin dryer 2]]
|[[Specific_Process_Knowledge/Wafer_and_sample_drying #Spin dryers|Spin dryer 3]]
|[[Specific_Process_Knowledge/Wafer_and_sample_drying #Spin dryer 3|Spin dryer 3]]
|[[Specific_Process_Knowledge/Wafer_and_sample_drying #Spin dryers|Spin dryer 4]]
|[[Specific_Process_Knowledge/Wafer_and_sample_drying #Spin dryer 5|Spin dryer 5]]
|[[Specific_Process_Knowledge/Wafer_and_sample_drying #Single wafer spin dryers|Single wafer spin dryer 1]]
|[[Specific_Process_Knowledge/Wafer_and_sample_drying #Spin dryer 6|Spin dryer 6]]
|[[Specific_Process_Knowledge/Wafer_and_sample_drying #Single wafer spin dryers|Single wafer spin dryer 2]]
|[[Specific_Process_Knowledge/Wafer_and_sample_drying/Critical Point Dryer|Critical point dryer]]
|[[Specific_Process_Knowledge/Wafer_and_sample_drying #Single wafer spin dryers|Single wafer spin dryer 3]]
|[[Specific_Process_Knowledge/Wafer_and_sample_drying #Critical point dryer|Critical point dryer]]
|[[Specific_Process_Knowledge/Wafer_and_sample_drying #Ethanol fume dryer|Ethanol fume dryer]]
|[[Specific_Process_Knowledge/Wafer_and_sample_drying #Nitrogen guns|N<sub>2</sub> guns]]
|[[Specific_Process_Knowledge/Wafer_and_sample_drying #Nitrogen guns|N<sub>2</sub> guns]]
|-
|-
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|-style="background:WhiteSmoke; color:black"
|-style="background:WhiteSmoke; color:black"
!Location
!Location
|
*C-1
|
|
*B-1
*B-1
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*D-3
*D-3
|
|
*E-5
*D-3
|
|
*B-1
*F-3
|
*C-1
|
|
*D-3
*D-3
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*D-3
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*C-1
|
|
*In fumehoods and at chemical benches
*In fumehoods and at chemical benches
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|-style="background:lightgray; color:black"
|-style="background:lightgray; color:black"
!Purpose  
!Purpose  
|
*Drying
|
|
*Drying   
*Drying   
|
*Drying
|
*Drying
*Rinsing + drying
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|
*Drying
*Drying
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|
|
*Drying
*Drying
|
*Rinsing + drying
*Drying sensitive samples. E.g. with cantilevers
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|
*Drying sensitive samples. E.g. with cantilevers
*Drying sensitive samples. E.g. with cantilevers
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!Batch size
!Batch size
|
|
*1-25 100 mm wafers
*100 mm wafers: 1-25
|*1-25 100 mm wafers
*150 mm wafers: 1-25
|
|
*1-25 100 mm wafers
*100 mm wafers: 1-25
*1-25 150 mm wafers
*150 mm wafers: 1-25
|
|
*1-25 50 mm wafers
*100 mm wafers: 1-25
*1-25 100 mm wafers
*150 mm wafers: 1-25
*1-25 150 mm wafers
|
|
*one 100 mm wafer
*100 mm wafers: 1-25
|
*150 mm wafers: 1-25
*one 100 mm wafer
*200 mm wafers: 1-25
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*one 100 mm wafer
|
|
*1 to 5 wafers per run. Sizes: 2”, 4" or 6"
*1 to 5 wafers per run. Sizes: 2”, 4" or 6"
* Pieces (up to 10x10mm)
* Pieces (up to 10x10mm)
|
*1-25 50 mm wafers
*1-25 100 mm wafers
*Pieces if a suitable carrier is available
|
|
*One sample at a time
*One sample at a time
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|-style="background:lightgray; color:black"
|-style="background:lightgray; color:black"
!Allowed materials
!Allowed materials
|
*No restrictions
|
|
*Only for RCA cleaned wafers
*Only for RCA cleaned wafers
|
*No restrictions
|
*No restrictions
|
|
*No restrictions
*No restrictions
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*InAlP, GaAs
*InAlP, GaAs
*SU8
*SU8
|
*No restriction except for polymers
|
|
*No restriction
*No restriction
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'''The user manual, technical information, and contact information can be found in LabManager: [http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=156 Spin dryer 1] [http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=157 Spin dryer 2] [http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=158 Spin dryer 3] [http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=256 Spindryer 4 (4",6")]'''
'''The user manual, technical information, and contact information can be found in LabManager: [http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=157 Spin dryer 2] [http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=158 Spin dryer 3] [https://labmanager.dtu.dk/function.php?module=Machine&view=view&mach=408 Spin dryer 5] [https://labmanager.dtu.dk/function.php?module=Machine&view=view&mach=323 Spin dryer 6 (8")]'''




== Process information ==
== Process information ==


Standard process is 120 seconds for 100mm wafers or 180 seconds for 150mm wafers, at 2000 RPM - drying only.
Standard process is:
#Rinse (with DI water) for 60 seconds at 500 RPM
#Dry with nitrogen for 150 seconds at 1800 RPM
#Dry with nitrogen and anti-static purge for 30 seconds at 1800 RPM


''If'' rinsing is used as well, the standard process is 60 seconds of rinse at 500 RPM, followed by 120/180 seconds of drying at 2000 RPM.
All spin dryers use the following carriers:
*100 mm wafers: A72-40MB
*150 mm wafers: A182-60MB
*200 mm wafers: A192-80M


<span style="color:red">It is not allowed to use other carriers in the spin dryers, as this may damage the motor due to incorrect mass distribution. It may also cause fragile wafers to break due to excessive vibrations caused by the mass imbalance.</span>


[[image:spin-rinser-dryer-white.jpg|200x200px|right|thumb|Image(s) of the equipment(s)]]
== Spin dryer 2 ==
 
[[File:spinDryer_2.jpg|640px|thumb|right]]
 
Spin dryer 2 is for RCA processing only, and is located in B-1 next to the RCA bench.
*Top chamber: 100 mm wafers
*Bottom chamber: 150 mm wafers


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== Spin dryer 3 ==


= Single wafer spin dryers =
[[File:spinDryer_3.jpg|640px|thumb|right]]


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Spin dryer 3 is located in D-3 between the working table and wet bench 03.
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*Top chamber: 100 mm wafers
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*Bottom chamber: 150 mm wafers


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= Critical point dryer =
== Spin dryer 5 ==
 
[[File:spinDryer_4.jpg|640px|thumb|right]]
 
Spin dryer 5 is located in D-3 between the HF vapor phase etcher and wet bench 07.
*Top chamber: 100 mm wafers
*Bottom chamber: 150 mm wafers


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== Spin dryer 6 ==


= Ethanol fume dryer =
[[File:spinDryer_5.jpg|640px|thumb|right]]


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Spin dryer 6 is located in F-3 Next to the Developer: TMAH stepper. It has a single process chamber that is capable of processing 100 mm, 150 mm and 200 mm wafers. The wafer size is easily changed, by changing the rotor insert frame.


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= Nitrogen guns =
= Nitrogen guns =
Nitrogen guns are valuable for drying small substrate pieces or samples that otherwise cannot go into the outer drying tools.


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