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'''Feedback to this page''': '''[mailto:labadviser@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Characterization click here]'''  
{{cc-nanolab}}
 
'''Feedback to this page''': '''[mailto:labadviser@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php/Specific_Process_Knowledge/Characterization click here]''' <br>


==Overview of characteristics and where to measure it==
==Overview of characteristics and where to measure it==
{| {{table}}
 
| align="center" style="background:#f0f0f0;"|''''''
{| {{table } }
| align="center" style="background:#f0f0f0;"|'''Microscopes'''
| width="30" align="center" style="writing-mode: vertical-lr; transform: rotate(180deg);background:#f0f0f0;"|  
| align="center" style="background:#f0f0f0;"|'''SEM (incl. EDX)'''
| width="30" align="center" style="writing-mode: vertical-lr; transform: rotate(180deg);background:#f0f0f0;"|[[Specific_Process_Knowledge/Characterization/Optical_microscope| Optical Micro- scopes]]
| align="center" style="background:#f0f0f0;"|'''AFM'''
| width="30" align="center" style="writing-mode: vertical-lr; transform: rotate(180deg);background:#f0f0f0;"|[[Specific Process Knowledge/Characterization/SEM: Scanning Electron Microscopy|SEM (incl. EDX)]]
| align="center" style="background:#f0f0f0;"|'''Stylus profiler'''
| width="30" align="center" style="writing-mode: vertical-lr; transform: rotate(180deg);background:#f0f0f0;"|[[Specific Process Knowledge/Characterization/AFM: Atomic Force Microscopy|AFM]]
| align="center" style="background:#f0f0f0;"|'''Optical profiler'''
| width="30" align="center" style="writing-mode: vertical-lr; transform: rotate(180deg);background:#f0f0f0;"|[[Specific Process Knowledge/Characterization/Profiler|Stylus profiler]]
| align="center" style="background:#f0f0f0;"|'''Filmtek (reflectometer)'''
| width="30" align="center" style="writing-mode: vertical-lr; transform: rotate(180deg);background:#f0f0f0;"|[[Specific_Process_Knowledge/Characterization/Profiler#Optical_Profiler_(Sensofar_S_Neox)|Optical profiler]]
| align="center" style="background:#f0f0f0;"|'''Ellipsometer'''
| width="30" align="center" style="writing-mode: vertical-lr; transform: rotate(180deg);background:#f0f0f0;"|[[Specific_Process_Knowledge/Characterization/Optical_characterization#Filmtek_4000|Filmtek (reflec- tometer)]]
| align="center" style="background:#f0f0f0;"|'''Thickness stylus'''
| width="30" align="center" style="writing-mode: vertical-lr; transform: rotate(180deg);background:#f0f0f0;"|[[Specific_Process_Knowledge/Characterization/Optical_characterization#Ellipsometer|Ellip- someter]]
| align="center" style="background:#f0f0f0;"|'''XPS'''
| width="30" align="center" style="writing-mode: vertical-lr; transform: rotate(180deg);background:#f0f0f0;"|[[Specific_Process_Knowledge/Characterization/Thickness_Measurer|Thickness stylus]]
| align="center" style="background:#f0f0f0;"|'''PL mapper'''
| width="30" align="center" style="writing-mode: vertical-lr; transform: rotate(180deg);background:#f0f0f0;"|[[Specific_Process_Knowledge/Characterization/XPS|XPS]]
| align="center" style="background:#f0f0f0;"|'''4-point probe'''
| width="30" align="center" style="writing-mode: vertical-lr; transform: rotate(180deg);background:#f0f0f0;"|[[Specific_Process_Knowledge/Characterization/PL_mapper|PL mapper]]
| align="center" style="background:#f0f0f0;"|'''Probe station'''
| width="30" align="center" style="writing-mode: vertical-lr; transform: rotate(180deg);background:#f0f0f0;"|[[Specific_Process_Knowledge/Characterization/4-Point_Probe|4-point probe]]
| align="center" style="background:#f0f0f0;"|'''XRD'''
| width="30" align="center" style="writing-mode: vertical-lr; transform: rotate(180deg);background:#f0f0f0;"|[[Specific_Process_Knowledge/Characterization/Probe_station|Probe station]]
| align="center" style="background:#f0f0f0;"|'''Life time scanner'''
| width="30" align="center" style="writing-mode: vertical-lr; transform: rotate(180deg);background:#f0f0f0;"|[[Specific_Process_Knowledge/Characterization/XRD|XRD]]
| align="center" style="background:#f0f0f0;"|'''Drop shape analyser'''
| width="30" align="center" style="writing-mode: vertical-lr; transform: rotate(180deg);background:#f0f0f0;"|[[Specific_Process_Knowledge/Characterization/Lifetime_scanner_MDPmap|Life time scanner]]
| align="center" style="background:#f0f0f0;"|'''Hardness tester'''
| width="30" align="center" style="writing-mode: vertical-lr; transform: rotate(180deg);background:#f0f0f0;"|[[Specific_Process_Knowledge/Characterization/Drop_Shape_Analyzer|Drop shape analyser]]
| width="30" align="center" style="writing-mode: vertical-lr; transform: rotate(180deg);background:#f0f0f0;"|[[Specific_Process_Knowledge/Characterization/Hardness_measurement|Hardness tester]]
|  width="30" align="center" style="writing-mode: vertical-lr; transform: rotate(180deg);background:#f0f0f0;"|[[Specific Process Knowledge/Characterization/Particle Scanner Takano|Particle scanner]]
|  width="30" align="center" style="writing-mode: vertical-lr; transform: rotate(180deg);background:#f0f0f0;"|IR-camera
|  width="30" align="center" style="writing-mode: vertical-lr; transform: rotate(180deg);background:#f0f0f0;"|[[Specific Process Knowledge/Characterization/III-V_ECV-profiler|III-V ECV-profiler]]
|  width="30" align="center" style="writing-mode: vertical-lr; transform: rotate(180deg);background:#f0f0f0;"|[[Specific Process Knowledge/Characterization/MicroSpectroPhotometer (Craic 20/30 PV)|Microspectrophotometer (Craic 20/30 PV)]]
|-
|-
|-style="background:#C0C0C0;"
|-style="background:#DCDCDC;" align="center"
| Thin film thickness||x  1)||x  1)||x  2)||x  2)||x  ||x||x||||||||x  3)||||x||||||
|align="left"| Breakdown voltage
|||||||||||||||||||||||||||||||||||||||
|-
|-
|-style="background:#DCDCDC;"
|-style="background:#C0C0C0;" align="center"
| Defects||x||||||||||||||||||x||||||||||||
|align="left"| Carrier density/doping profile
|||||||||||||||||||||||||||||||||||||x||
 
|-
|-
|-style="background:#C0C0C0;"
|-style="background:#DCDCDC;" align="center"
| Wafer thickness||x  1)||x  1)||||||||||||x||||||||||||||||
|align="left"| Charge carrier life time||||||||||||||||||||||||||||x||||||||||||
|-
|-
|-style="background:#DCDCDC;"
|-style="background:#C0C0C0;" align="center"
| Step coverage||x  1)||x  1)||||||||||||||||||||||||||||
|align="left"| Contact angle hydrophobic/hydrophillic||||||||||||||||||||||||||||||x||||||||||
|-
|-
|-style="background:#C0C0C0;"
|-style="background:#DCDCDC;" align="center"
| Particles||x||x||x||||||||||||||||||||||||||
|align="left"| Crystallinity||||||||||||||||||||||||||x||||||||||||||
|-
|-
|-style="background:#DCDCDC;"
|-style="background:#C0C0C0;" align="center"
| Element analysis||||x||||||||||||||x||x  4)||||||x  4)||||||
|align="left"| Deposition uniformity||||||||||x||x||x||||||||||||||||||||||||||
|-
|-
|-style="background:#C0C0C0;"
|-style="background:#DCDCDC;" align="center"
| Surface roughness||||||x||x||x||||||||||||||||||||||
|align="left"|[[Specific_Process_Knowledge/Characterization/Sample_imaging|Dimensions(in plane)]]||x||x||(x)||(x)||x||||||||||||||||||||||||||||||x
|-
|-
|-style="background:#DCDCDC;"
|-style="background:#C0C0C0;" align="center"
| Deposition uniformity||||||||||x||x||x||||||||||||||||||
|align="left"|[[Specific_Process_Knowledge/Characterization/Topographic_measurement|Dimensions(height)/Topography]]||(x)||(x)||x||x||x||||||||||||||||||||||||||||||
|-
|-
|-style="background:#C0C0C0;"
|-style="background:#DCDCDC;" align="center"
| Film stress||||||||x||||||||||||||||||x||||||
|align="left"| Electrical conductivity||||||||||||||||||||||||x||||||||||||||||
|-
|-
|-style="background:#DCDCDC;"
|-style="background:#C0C0C0;" align="center"
| Refractive index||||||||||||x||x||||||||||||||||||
|align="left"| [[Specific_Process_Knowledge/Characterization/Element_analysis|Element analysis]]||||x||||||||||||||x||x   4)||||||x  4)||||||||||||||
|-
|-
|-style="background:#C0C0C0;"
|-style="background:#DCDCDC;" align="center"
| Reflectivity||||||||||||x||x||||||(x)||||||||||||
|align="left"| [[Specific_Process_Knowledge/Characterization/Stress_measurement|Film stress]]||||||||x||||||||||||||||||x   7)||||||||||||||
|-
|-
|-style="background:#DCDCDC;"
|-style="background:#C0C0C0;" align="center"
| Resistivity||||||||||||||||||||||x||||||||||
|align="left"|[[Specific_Process_Knowledge/Characterization/Sample_imaging|Imaging]]||x||x||x||||x||||||||||||||||||||||||||||||x
|-
|-
|-style="background:#C0C0C0;"
|-style="background:#DCDCDC;" align="center"
| Breakdown voltage||||||||||||||||||||||||||||||||
|align="left"| [[Specific_Process_Knowledge/Characterization/Hardness_measurement|Material Hardness]]||||||||||||||||||||||||||||||||x||||||||
|-
|-
|-style="background:#DCDCDC;"
|-style="background:#C0C0C0;" align="center"
| Electrical conductivity||||||||||||||||||||||||x||||||||
|align="left"| Band gap||||||||||||||x||||x||x||||||||||||||||||||
|-
|-
|-style="background:#C0C0C0;"
|-style="background:#DCDCDC;" align="center"
| Thermal conductivity||||||||||||||||||||||||||||||||
|align="left"| Particles||x||x||x||||||||||||||||||||||||||||x||||||x
|-
|-
|-style="background:#DCDCDC;"
|-style="background:#C0C0C0;" align="center"
| Optical gap||||||||||||||x||||||x||||||||||||
|align="left"| Phase changes||||||||||||||||||||||||||||||||||||||||
|-
|-
|-style="background:#C0C0C0;"
|-style="background:#DCDCDC;" align="center"
| Crystalinity||||||||||||||||||||||||||x||||||
|align="left"| Reflectivity||||||||||||x||x||||||x 6)||||||||||||||||||||x
|-
|-
|-style="background:#DCDCDC;"
|-style="background:#C0C0C0;" align="center"
| Charge carrier life time||||||||||||||||||||||||||||x||||
|align="left"| [[Specific_Process_Knowledge/Characterization/Measurement_of_film_thickness_and_optical_constants|Refractive index]]||||||||||||x||x||||||||||||||||||||||||||
|-
|-
|-style="background:#C0C0C0;"
|-style="background:#DCDCDC;" align="center"
| Contact angle hydrofob/hydrofil||||||||||||||||||||||||||||||x||
|align="left"| Resistivity||||||||||||||||||||||x||||||||||||||||||
|-
|-
|-style="background:#DCDCDC;"
|-style="background:#C0C0C0;" align="center"
| Material Hardness||||||||||||||||||||||||||||||||x
|align="left"| Step coverage||x  1)||x  1)||||||||||||||||||||||||||||||||||||
|-
|-
|  
|-style="background:#DCDCDC;" align="center"
|align="left"| Surface roughness||||||x||x||x||||||||||||||||x||||||||||||||
|-
|-style="background:#C0C0C0;" align="center"
|align="left"| Thermal conductivity||||||||||||||||||||||||||||||||||||||||
|-
|-style="background:#DCDCDC;" align="center"
|align="left"| [[Specific_Process_Knowledge/Characterization/Measurement_of_film_thickness_and_optical_constants|Thin film thickness]]||x  1)||x  1)||x  2)||x  2)||x  ||x||x||||||x 5)||x  3)||||x||||||||||||||
|-
|-style="background:#C0C0C0;" align="center"
|align="left"| Voids in wafer bonding||x||||||||||||||||||x||||||||||||||||x||||
|-
|-style="background:#DCDCDC;" align="center"
|align="left"| [[Specific_Process_Knowledge/Characterization/Thickness_Measurer|Wafer thickness]]||x  1)||x  1)||||||||||||x||||||||||||||||||||||||
|-
|-style="background:#C0C0C0;" align="center"
|align="left"| Work function||||||||||||||||||x||||||||||||||||||||||
|-
|}
|}


# Using the cross section method
# Using the cross section method
# Using the create step method
# Using the create step method
# With known resistivity
# With known resistivity
# Composition information
# Composition information for crystalline materials
# Only single layer
# Good for characterization of VCSEL structures and DBR mirrors
# Only for crystalline films


== Choose characterization topic ==
== Choose characterization topic ==
*[[Specific Process Knowledge/Characterization/III-V_ECV-profiler|Carrier density (doping) profiler]]
*[[Specific_Process_Knowledge/Characterization/Drop_Shape_Analyzer|Contact angle measurement]]
*[[/Element analysis|Element analysis]]
*[[/Element analysis|Element analysis]]
*[[/Measurement of film thickness and optical constants|Measurement of film thickness and optical constants]]
*[[/Measurement of film thickness and optical constants|Film thickness and optical constants]]
*[[/Hardness measurement|Hardness measurement]]
*[[/PL mapper|Photoluminescence mapping]]
*[[/PL mapper|Photoluminescence mapping]]
*[[/Four-Point_Probe|Four-Point Probe (Resistivity measurement)]] <!-- [[/Resistivity measurement|Resistivity measurement]] -->
*[[/Sample imaging|Sample imaging]]
*[[/Sample imaging|Sample imaging]]
*[[/Sample preparation|Sample preparation for inspection]]
*[[/Sample preparation|Sample preparation for inspection]]
*[[Specific Process Knowledge/Characterization/SEM: Scanning Electron Microscopy|Scanning Electron Microscopy]]
*[[/Stress measurement|Stress measurement]]
*[[/Stress measurement|Stress measurement]]
*[[/Hardness measurement|Hardness measurement]]
*[[/Thickness Measurer|Wafer thickness measurement]]
*[[/Thickness Measurer|Wafer thickness measurement]]
*[[/Topographic measurement|Topographic measurement]]
*[[/Topographic measurement|Topographic measurement]]
*[[Specific Process Knowledge/Characterization/XRD|X-ray diffraction]]  
*[[Specific_Process_Knowledge/Characterization/Drop_Shape_Analyzer|Contact angle measurement]]
*[[/Four-Point_Probe|Four-Point Probe (Resistivity measurement)]] <!-- [[/Resistivity measurement|Resistivity measurement]] -->
*[[Specific Process Knowledge/Characterization/III-V_ECV-profiler|Carrier density (doping) profiler]]
*[[Specific Process Knowledge/Characterization/SEM: Scanning Electron Microscopy|Scanning Electron Microscopy]]  
<!--
<!--
*[[/Other electrical measurements|Other electrical measurements]]
*[[/Other electrical measurements|Other electrical measurements]]
Line 112: Line 145:
===AFM===
===AFM===
*[[/AFM: Atomic Force Microscopy|AFM - ''Atomic Force Microscopy'']]
*[[/AFM: Atomic Force Microscopy|AFM - ''Atomic Force Microscopy'']]
===Electrical measurements===
*[[/4-Point Probe|4-Point Probe]]
*[[/Probe station|Probe station]]
*[[/III-V ECV-profiler|III-V ECV-profiler (Electrochemical Capacitance-Voltage carrier density profiler)]]


===Element analysis===
===Element analysis===
*[[/SIMS: Secondary Ion Mass Spectrometry#Atomika_SIMS|Atomika SIMS]]
*[[/SEM Supra 2|SEM with EDX]]
*[[/XPS#XPS-ThermoScientific|XPS-ThermoScientific ]]
*[[/XPS|XPS tools ]]


===Optical and stylus profilers===
===Optical and stylus profilers===
*[[/Profiler#Optical_Profiler_(Sensofar)|Optical Profiler (Sensofar)]]
*[[/Profiler#Optical_Profiler_(Sensofar)|Optical Profiler (Sensofar)]]
*[[/Profiler#Dektak XTA_new stylus profiler|Dektak XTA_new]]
*[[/Profiler#Dektak XTA_new stylus profiler|Dektak XTA stylus profiler]]
*[[/Profiler#Dektak _8 stylus _profiler|Dektak 8 stylus profiler]]
*[[/Profiler#Stylus Profiler (Tencor P17)|P17 stylus profiler from KLA-Tencor]]
*[[/Profiler#Dektak_III-V_Profiler|III V Profiler]]
*[[/Profiler#Dektak_III-V_Profiler|Dektak 3ST stylus profiler]]
'''Optical microscopes'''
*[[/Profiler#Stylus_Profiler:_Dektak150|Stylus Profiler:Dektak150]]
*[[/Optical microscope|Optical microscope]]
 
'''Optical characterization'''
===Optical microscopes===
*[[/Optical microscope|Optical microscopes]]
 
===Optical characterization===
*[[/Optical characterization#Ellipsometer|Ellipsometer]]
*[[/Optical characterization#Ellipsometer|Ellipsometer]]
*[[/Optical characterization#Filmtek_4000|Filmtek 4000]]
*[[/Optical characterization#Filmtek_4000|Filmtek 4000]]
*[[/Optical characterization#Prism_Coupler|Prism Coupler]]
*[[/PL mapper|PL mapper - ''Photoluminescence mapper'']]
*[[/PL mapper|PL mapper - ''Photoluminescence mapper'']]
*[[/Lifetime scanner MDPmap|Lifetime scanner MDPmap]]
*[[/Lifetime scanner MDPmap|Lifetime scanner MDPmap]]


 
===SEMs at DTU Nanolab - building 307/314===
===SEM's at CEN===
<!-- *[[LabAdviser/CEN/Quanta 3D FIB/SEM|FIB-SEM FEI QUANTA 200 3D]] -->
*[[LabAdviser/CEN/Quanta 3D FIB/SEM|FIB-SEM FEI QUANTA 200 3D]]
*[[LabAdviser/CEN/Helios Nanolab 600|Dual Beam FEI Helios Nanolab 600]]
*[[LabAdviser/CEN/Helios Nanolab 600|Dual Beam FEI Helios Nanolab 600]]
*[[LabAdviser/CEN/Nova NanoSEM 600|SEM FEI Nova 600 NanoSEM]]
*[[LabAdviser/CEN/Nova NanoSEM 600|SEM FEI Nova 600 NanoSEM]]
*[[LabAdviser/CEN/Quanta FEG 200 ESEM|SEM FEI Quanta 200 ESEM FEG]]
*[[LabAdviser/CEN/Quanta FEG 200 ESEM|SEM FEI Quanta 200 ESEM FEG]]
*[[LabAdviser/CEN/Inspect S|SEM Inspect S]]
<!-- *[[LabAdviser/CEN/Inspect S|SEM Inspect S]] -->


===SEM's at Danchip===
===SEM's in building 346===
*[[/SEM: Scanning Electron Microscopy |SEM Comparison page]]
*[[/SEM: Scanning Electron Microscopy |SEM Comparison page]]
*[[/SEM LEO|SEM LEO]]
*[[/SEM Supra 1|SEM Supra 1]]
*[[/SEM Supra 1|SEM Supra 1]]
*[[/SEM Supra 2|SEM Supra 2]]
*[[/SEM Supra 2|SEM Supra 2]]
Line 147: Line 185:
*[[/SEM Tabletop 1|SEM Tabletop 1]]
*[[/SEM Tabletop 1|SEM Tabletop 1]]


===TEM's at CEN===
===TEMs at DTU Nanolab - building 307/314===
*[[LabAdviser/CEN/Titan ATEM |Titan ATEM]]
*[[LabAdviser/CEN/Titan ATEM |Titan ATEM]]
*[[LabAdviser/CEN/Titan ETEM |Titan ETEM]]
*[[LabAdviser/CEN/Titan ETEM |Titan ETEM]]
*[[LabAdviser/CEN/Tecnai TEM |Tecnai TEM]]
*[[LabAdviser/CEN/Tecnai TEM |Tecnai TEM]]
===XRD===
*[[/XRD|General page on XRD]], page describing general info relevant to both our XRD's
*[[/XRD/XRD Powder|XRD Powder]], tabletop XRD for Bregg-Brentano measurements of powders
*[[/XRD/XRD SmartLab|XRD SmartLab]], advanced multipurpose instrument in the cleanroom
*[[/XRD/XRD SmartLab 9kW Rotating Anode|XRD SmartLab 9kW Rotating Anode]] multipurpose system outside the cleanroom


===Various===
===Various===
*[[/Drop Shape Analyzer|Drop Shape Analyzer]]
*[[/Drop Shape Analyzer|Drop Shape Analyzer]]
*[[/4-Point Probe|4-Point Probe]]
*[[/Thickness Measurer|Thickness Measurer]]
*[[/Thickness Measurer|Thickness Measurer]]
*[[/Hardness measurement|Hardness tester]]
*[[/Particle Scanner Takano|Particle Scanner Takano]]


*[[/Probe station|Probe station]]
==Decommissioned equipment==
 
*[[/KLA-Tencor Surfscan 6420|KLA-Tencor Surfscan 6420]]
*[[/KLA-Tencor Surfscan 6420|KLA-Tencor Surfscan 6420]]
*[[/III-V ECV-profiler|III-V ECV-profiler (Electrochemical Capacitance-Voltage carrier density profiler)]]
*[[/X-Ray Diffractometer|Phillips X-Ray Diffractometer that was owned by DTU Fotonik]]
*[[/X-Ray Diffractometer|X-Ray Diffractometer ]]
*[[/XRD|XRD SmartLab]]
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