Specific Process Knowledge/Thin film deposition/Deposition of Carbon: Difference between revisions
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== Deposition of Carbon == | == Deposition of Carbon == | ||
Carbon can be deposited by DC-sputtering method. So far the process has been tested only using Sputter-System (Lesker): | Carbon can be deposited by DC-sputtering method. So far the process has been tested only using [[Specific Process Knowledge/Thin film deposition/Lesker|Sputter-System (Lesker)]]: | ||
*[[/Deposition of C in Sputter-System Lesker|Deposition of Carbon in Sputter-System (Lesker)]] | *[[/Deposition of C in Sputter-System Lesker|Deposition of Carbon in Sputter-System (Lesker)]] | ||
In order to deposit carbon, all other parts of the chamber will be covered with Al foil to prevent cross-contamination. | |||
Latest revision as of 16:09, 9 January 2025
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Deposition of Carbon
Carbon can be deposited by DC-sputtering method. So far the process has been tested only using Sputter-System (Lesker):
In order to deposit carbon, all other parts of the chamber will be covered with Al foil to prevent cross-contamination.