Specific Process Knowledge/Etch/DRIE-Pegasus/DREM: Difference between revisions

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= DREM 2kW micro =
= DREM 2kW micro =


{{Template:Peg1RecipeTableVerBColors
{{Template:Peg1Table9Head
|TableHeader=DREM 2kW micro
|TableHeader=DREM 2kW micro
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|ActualPressure=
 
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{{Template:Peg1Table9Row
|RecipeName=DREM 2kW micro
|RecipeName=DREM 2kW micro
|PriorProcessSteps=  Pump to base, Clamp Substrate, home platen matching unit, stabilisation
|PriorProcessSteps=  Pump to base, Clamp Substrate, home platen matching unit, stabilisation
|PaddingStyle=padding:0px;
|ActualPressure=
|Keywords=  
|Keywords=  
|PlatenPosition=U          |PlatenFrequency=HF          |StabilisationTime=          |StartCycleEndCycle=D/E
|PlatenPosition=U          |PlatenFrequency=HF          |StabilisationTime=          |StartCycleEndCycle=D/E
Line 14: Line 20:
|PressureDepDelay=          |PressureDepBoost=          |PressureDepMain=100%
|PressureDepDelay=          |PressureDepBoost=          |PressureDepMain=100%
|PressureEtchDelay=        |PressureEtchBoost=          |PressureEtchMain=100%
|PressureEtchDelay=        |PressureEtchBoost=          |PressureEtchMain=100%
|C4F8DepDelay=0.3@5        |C4F8DepBoost= 0.5@50        |C4F8DepMain=200
|C4F8DepDelay=0.3@5        |C4F8DepBoost= 0.5@ 50        |C4F8DepMain=200
|C4F8EtchDelay=0.5@100      |C4F8EtchBoost=              |C4F8EtchMain=5
|C4F8EtchDelay=0.5@ 100      |C4F8EtchBoost=              |C4F8EtchMain=5
|SF6DepDelay=0.3@200        |SF6DepBoost=0.5@200        |SF6DepMain=15
|SF6DepDelay=0.3@ 200        |SF6DepBoost=0.5@ 200        |SF6DepMain=15
|SF6EtchDelay=2@15          |SF6EtchBoost=0.3@100        |SF6EtchMain=200
|SF6EtchDelay=2@ 15          |SF6EtchBoost=0.3@ 100        |SF6EtchMain=200
|O2Dep=                    |O2Etch=                    |ArDep=150                        |ArEtch=150
|O2Dep=                    |O2Etch=                    |ArDep=150                        |ArEtch=150
|WCoilDep=2                |WCoilEtch=2                |WPlatenDep=1  
|WCoilDep=2                |WCoilEtch=2                |WPlatenDep=1  
|WPlatenEtchDelay=1@1      |WPlatenEtchBoost=1@100      |WPlatenEtchMain=1
|WPlatenEtchDelay=1@1      |WPlatenEtchBoost=1@ 100      |WPlatenEtchMain=1
|WClaritasDep=              |WClaritasEtch=       
|WClaritasDep=              |WClaritasEtch=       
|%CoilDepLoad=40            |%CoilDepTune=50            |%CoilEtchLoad=40                  |%CoilEtchTune=50
|%CoilDepLoad=40            |%CoilDepTune=50            |%CoilEtchLoad=40                  |%CoilEtchTune=50
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|Link2RecipeRun=[[Specific Process Knowledge/Etch/DRIE-Pegasus/DREM/DREM 2kW micro | '''8''']]
|Link2RecipeRun=[[Specific Process Knowledge/Etch/DRIE-Pegasus/DREM/DREM 2kW micro | '''8''']]
}}
}}
{{Template:Peg1RecipeTableVerBAddrowColors
{{Template:Peg1Table9Row
|RecipeName=DREM 2kW micro
|RecipeName=DREM 2kW micro
|PriorProcessSteps=  Pump to base, Clamp Substrate, home platen matching unit, stabilisation
|PriorProcessSteps=  Pump to base, Clamp Substrate, home platen matching unit, stabilisation
|PaddingStyle=padding:0px;
|ActualPressure=
|Keywords=  
|Keywords=  
|PlatenPosition=U          |PlatenFrequency=HF          |StabilisationTime=          |StartCycleEndCycle=D/E
|PlatenPosition=U          |PlatenFrequency=HF          |StabilisationTime=          |StartCycleEndCycle=D/E
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|PressureDepDelay=          |PressureDepBoost=          |PressureDepMain=100%
|PressureDepDelay=          |PressureDepBoost=          |PressureDepMain=100%
|PressureEtchDelay=        |PressureEtchBoost=          |PressureEtchMain=100%
|PressureEtchDelay=        |PressureEtchBoost=          |PressureEtchMain=100%
|C4F8DepDelay=0.3@5        |C4F8DepBoost= 0.5@50        |C4F8DepMain=200
|C4F8DepDelay=0.3 @5        |C4F8DepBoost= 0.5@ 50        |C4F8DepMain=200
|C4F8EtchDelay=0.5@100      |C4F8EtchBoost=              |C4F8EtchMain=5
|C4F8EtchDelay=0.5@ 100      |C4F8EtchBoost=              |C4F8EtchMain=5
|SF6DepDelay=0.3@200        |SF6DepBoost=0.5@200        |SF6DepMain=15
|SF6DepDelay=0.3@ 200        |SF6DepBoost=0.5@ 200        |SF6DepMain=15
|SF6EtchDelay=2@15          |SF6EtchBoost=0.3@100        |SF6EtchMain=200
|SF6EtchDelay=2@ 15          |SF6EtchBoost=0.3@ 100        |SF6EtchMain=200
|O2Dep=                    |O2Etch=                    |ArDep=150                        |ArEtch=150
|O2Dep=                    |O2Etch=                    |ArDep=150                        |ArEtch=150
|WCoilDep=2                |WCoilEtch=2                |WPlatenDep=1  
|WCoilDep=2                |WCoilEtch=2                |WPlatenDep=1  
|WPlatenEtchDelay=1@1      |WPlatenEtchBoost=1@100      |WPlatenEtchMain=1
|WPlatenEtchDelay=1@1      |WPlatenEtchBoost=1@ 100      |WPlatenEtchMain=1
|WClaritasDep=              |WClaritasEtch=       
|WClaritasDep=              |WClaritasEtch=       
|%CoilDepLoad=40            |%CoilDepTune=50            |%CoilEtchLoad=40                  |%CoilEtchTune=50
|%CoilDepLoad=40            |%CoilDepTune=50            |%CoilEtchLoad=40                  |%CoilEtchTune=50
Line 48: Line 56:
|Link2RecipeRun=[[Specific Process Knowledge/Etch/DRIE-Pegasus/DREM/DREM 2kW micro at -19 degrees | '''1''']]
|Link2RecipeRun=[[Specific Process Knowledge/Etch/DRIE-Pegasus/DREM/DREM 2kW micro at -19 degrees | '''1''']]
}}
}}
|}
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==Overview of micro and nano fabrication steps - a guide to where you can find fabrication information in LabAdviser==
{| style="color: black;vertical-align:top" width="100%" border=0 cellpadding="4" cellspacing="0"
| colspan="2" |
|-
| style="width: 50%; vertical-align:top;"|
{| id="linkTable" border="1" cellpadding="0" cellspacing="0" style="text-align:center;"
! class="hideImage" style="display:none"| Front Image
! style="display:none"|-
! style="display:none"|-
! style="display:none"|-
|-
! class="hideImage" width="150" height="180px"| Clean your sample[[file:jehanClean.png|130px|frameless ]]
! class="hideImage" width="150" | Dry your sample [[file:jehanDry.png|130px|frameless  ]]
! class="hideImage" width="150" | Create a thin film on your sample [[file:jehanfilm.png|130px|frameless  ]]
! class="hideImage" width="150" | Dope your sample [[file:jehanDope.png|130px|frameless ]]
|-
! class="hideImage" width="150" height="180px"| Thermal treatment of your sample [[file:jehanThermal.png|130px|frameless ]]
! class="hideImage" width="150" | Make a mask on your sample[[file:jehanmask.png|130px|frameless ]]
! class="hideImage" width="150" | Transfer pattern to your sample [[file:jehanTransfer.png|130px|frameless ]]
! class="hideImage" width="150" | Define your structure directly [[file:jehandefine.jpg|130px|frameless ]]
|-
|}
| style="color:black; width: 50%; vertical-align: top;"|
{| class="wikitable hideable hidden" border="1" cellspacing="0" cellpadding="0"  align="left" width="400px" style="float:right;"
! style="text-align:right;" | [[image:DUV6.jpg|center|400px]]
|-
|}
| style="color:black; width: 50%; vertical-align: top"|
{| class="wikitable hideable hidden" border="1" cellspacing="0" cellpadding="0"  align="left" width="430px"
! colspan="3" style="text-align:left;" | [[image:Clean your sample.png|x100px|Clean your sample]] Clean your sample
|-
!Entry page in LabAdviser
!Techniques
!Materials
|-
|rowspan="5" valign="top" |[[Specific Process Knowledge/Wafer cleaning|Wafer cleaning]]
|Soap Sonic
|Removes dust and particles
|-
|7-up & Piranha
|Removes traces of organics and alkali ions
|-
|RCA
|Two step process to remove traces of organics and metals
|-
|5% HF
|Removes native oxide
|-
|IMEC
|Removing dust, traces of organics and alkali ions and slightly polish the surface.
Make the surface hydrophillic
|-
|}
{| class="wikitable hideable hidden" border="1" cellspacing="1" cellpadding="2"  align="left" width="430px"
!colspan="3" style="text-align:left;" | [[image:Dry your sample.png|x130px|Dry your sample]] Dry your sample
|-
!Entry page in LabAdviser
!Techniques
!Materials
|-
|rowspan="4" valign="top" |[[Specific Process Knowledge/Wafer and sample drying|Wafer and sample drying]]
|Spin dryers
|Whole wafers
|-
|Critial point dryer
|Sensitive wafers
|-
|Ethanol fume drying
|Sensitive wafers
|-
|N2 blow drying
|N2 pistols
|-
|}
{| class="wikitable hideable hidden" border="1" cellspacing="1" cellpadding="2"  align="left" width="600px"
!colspan="3" style="text-align:left;" | [[image:Create a film on your sample.png|x100px|Create a layer/film on your sample]] Create a layer/film on your sample
|-
!Entry page in LabAdviser
!Techniques
!Materials
|-
|[[Specific Process Knowledge/Thermal Process/Oxidation| Thermal Process/Oxidation]]
|Thermal oxidation
|Thermal SiO2
|-
|rowspan="8" valign="top"|[[Specific Process Knowledge/Thin film deposition| Thin film deposition]]
|Sputter deposition
|Metals: Al, Ti, Cr, Co, Ni, Cu, Mo, Pd, Ag, Sn, Ta, W, Pt, Au, Fe, Mg, Nb, Ru <br>
Semiconductors: Si, Ge, ZnO <br>
Oxides: SiO<sub>2</sub>, ITO, TiO<sub>2</sub>, Al<sub>2</sub>O<sub>3</sub>, MgO, Ta<sub>2</sub>O<sub>5</sub> Cr<sub>2</sub>O<sub>3</sub><br>
Transparent Conducting Oxides: ITO, AZO<br>
Alloys: TiW, NiCr, AlTi, NiV, AlCu, CoFe, CuTi, FeMn, MnIr, NiCo, NiFe, YSZ <br>
|-
|Thermal evaporation
|Al, Ge, Ag
|-
|E-beam evaporation
|Metals: Ti, Cr, Al, Ni, Pt, Au, Mo, Nb, Pd, Ag, Cu, W, Ta <br>
Semiconductors: Si, Ge <br>
Oxides: SiO<sub>2</sub>, TiO<sub>2</sub> <br>
Alloys: NiCr, TiAl
|-
|LPCVD
|Si<sub>3</sub>N<sub>4</sub>, SRN, SiO<sub>2</sub>, Si (poly and amorph)
|-
|PECVD
|Si<sub>3</sub>N<sub>4</sub>, SiO<sub>2</sub>, PBSG
|-
|MVD
|FDTS
|-
|Electroplating
|Ni
|-
|Epitaxial growth /MOCVD
|Al, As, Ga, In, P. doping: Si, Zn
|-
|rowspan="2" valign="top"| [[Specific Process Knowledge/Lithography/Coaters|Lithography/Coaters]]
|Spin coating
|resists, polymers
|-
|Spray coating
|resists, polymers
|-
|}
{| class="wikitable hideable hidden" border="1" cellspacing="1" cellpadding="2"  align="left" width="430px"
!colspan="3" style="text-align:left;" | [[image:Dope your sample.png|x100px|Dope your sample]] Dope your sample
|-
|-
!Entry page in LabAdviser
!Techniques
!Materials
|-
|rowspan="5" valign="top"| [[Specific Process Knowledge/Doping|Doping]]
|Ion implant
|e.g. P, B, As 
|-
|[[Specific Process Knowledge/Thin film deposition/PECVD| PECVD]]
|Deposition of SiO2 or Si3N4 doped with P,B and Ge
|-
|[[Specific Process Knowledge/Thin film deposition/Furnace LPCVD PolySilicon|LPCVD ]]
|Deposition of PolySi doped with B or P
|-
|[[Specific Process Knowledge/Thermal Process/Dope with Boron|Predeposition and drive-in]]
|Doping Silicon wafers with boron
|-
|[[Specific Process Knowledge/Thermal Process/Dope with Phosphorus|Predeposition and drive-in]]
|Doping Silicon wafers with phosphorus
|-
|}
{| class="wikitable hideable hidden" border="1" cellspacing="1" cellpadding="2"  align="left" width="430px"
!colspan="3" style="text-align:left;" | [[image:Thermal treat your sample.png|x100px|Thermal treatment of your sample]] Thermal treatment of your sample
|-
!Entry page in LabAdviser
!Techniques
!Materials
|-
|rowspan="5" valign="top"|[[Specific Process Knowledge/Thermal Process|Thermal Process]]
|Annealing (>350C)
|Si, PECVD layers, Al, BCB curing, Polymer
|-
|Oxidation
|Si wafers
|-
|Doping with B/P
|Si wafers
|-
|Pyrolysis
|Resists: AZ, SU8, PDMS
|-
|Rapid Thermal Anneal (RTP)
|SiO2, Si3N4, Ti, III-V
|-
|
[[Specific Process Knowledge/Lithography/Baking| Lithography/Baking]] <br>
|Baking (<300dg)
|baking resist and polymers
|-
|}
{| class="wikitable hideable hidden" border="1" cellspacing="1" cellpadding="2"  align="left" width="430px"
!colspan="3" style="text-align:left;" | [[image:Make a mask on your sample.png|x100px|Make a mask on your sample]] Make a mask on your sample
|-
!Entry page in LabAdviser
!Techniques
!Materials
|-
|rowspan="5" valign="top"|[[Specific Process Knowledge/Lithography| Lithography]]
|Pattern design & Mask fabrication
|
|-
|Photolithography
|UV resists
|-
|Deep UV lithography
|DUV resists
|-
|E-beam lithography
|E-beam resists
|-
|Imprinting
|Polymers
|-
|}
{| class="wikitable hideable hidden" border="1" cellspacing="1" cellpadding="2"  align="left" width="430px"
!colspan="3" style="text-align:left;" | [[image:Transfer mask pattrn to your sample.png|x100px|Transfer mask pattern to your sample]] Transfer mask pattern to your sample
|-
!Entry page in LabAdviser
!Techniques
!Materials
|-
|rowspan="2" valign="top"|[[Specific Process Knowledge/Etch| Etch]]
|Wet etch
|Si, Glass, SiO2, Si3N4, Al, Cr, Ti, Au, Pt, InP, InGaAsP, GaAs/AlGaAs
|-
|Dry etch
|Any material
|-
|[[Specific Process Knowledge/Lithography/LiftOff| Lithography/Lift-off]]
|Lift-off
|Most materials
|-
|}
{| class="wikitable hideable hidden" border="1" cellspacing="1" cellpadding="2"  align="left" width="430px"
!colspan="3" style="text-align:left;" | [[image:Define your structure directly.png|x100px|Define the structure directly on your sample]] Define your structure directly
|-
!Entry page in LabAdviser
!Techniques
!Materials
|-
|rowspan="5" valign="top"|[[Specific Process Knowledge/Direct Structure Definition|Direct Structure Definition]]
|Polymer Injection molding
|Topas, PP, PE, PS
|-
|LASER micro machining
|Silicon, Metal, Graphene (on silicon), Glass (Pyrex, fused silica), TOPAS, PMMA
|-
|Dicing saw
|Silicon, Glass (Pyrex, fused silica)
|-
|[[Specific Process Knowledge/Imprinting|Imprinting]]
|TOPAS, PMMA
|-
|Hot Embosser
|Topas, PP, PE, PS, PC, PMMA, ...
|-
|[[Specific Process Knowledge/Lithography|Lithography definition]]
|SU8, AZ resists
|-
|}
|-
|}
|}

Latest revision as of 09:20, 20 November 2024

The DREM processes

DREM 2kW micro

DREM 2kW micro
Recipe General Pressure Gases Generators Matching Results
C4F8 SF6 Coil Platen Coil Platen
T S/E Dp D B M D B M D B M Dp Dep L T L T Pressure Runs
H/L Cyc Et D B M D B M D B M Et D B M L T L T Keywords
DREM 2kW micro Pump to base, Clamp Substrate, home platen matching unit, stabilisation 8
0 D/E 1.2 100% 0.3@5 0.5@ 50 200 0.3@ 200 0.5@ 200 15 2 1 40 50 32.5 51.9
HF 3 100% 0.5@ 100 5 2@ 15 0.3@ 100 200 2 1@1 1@ 100 1 40 50 32.5 51.9
DREM 2kW micro Pump to base, Clamp Substrate, home platen matching unit, stabilisation 1
-19 D/E 1.2 100% 0.3 @5 0.5@ 50 200 0.3@ 200 0.5@ 200 15 2 1 40 50 32.5 51.9
HF 3 100% 0.5@ 100 5 2@ 15 0.3@ 100 200 2 1@1 1@ 100 1 40 50 32.5 51.9
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