Specific Process Knowledge/Etch/DRIE-Pegasus/DREM: Difference between revisions
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= The DREM processes = | = The DREM processes = | ||
= DREM 2kW micro = | |||
{{Template:Peg1Table9Head | |||
|TableHeader=DREM 2kW micro | |||
|TableStyle = class="wikitable" | |||
|PaddingStyle=padding:0px; | |||
|ActualPressure= | |||
}} | |||
{{Template:Peg1Table9Row | |||
|RecipeName=DREM 2kW micro | |||
|PriorProcessSteps= Pump to base, Clamp Substrate, home platen matching unit, stabilisation | |||
|PaddingStyle=padding:0px; | |||
|ActualPressure= | |||
|Keywords= | |||
|PlatenPosition=U |PlatenFrequency=HF |StabilisationTime= |StartCycleEndCycle=D/E | |||
|DepositionTime=1.2 |EtchTime=3 |NumberOfCycles= | |||
|PressureDepDelay= |PressureDepBoost= |PressureDepMain=100% | |||
|PressureEtchDelay= |PressureEtchBoost= |PressureEtchMain=100% | |||
|C4F8DepDelay=0.3@5 |C4F8DepBoost= 0.5@ 50 |C4F8DepMain=200 | |||
|C4F8EtchDelay=0.5@ 100 |C4F8EtchBoost= |C4F8EtchMain=5 | |||
|SF6DepDelay=0.3@ 200 |SF6DepBoost=0.5@ 200 |SF6DepMain=15 | |||
|SF6EtchDelay=2@ 15 |SF6EtchBoost=0.3@ 100 |SF6EtchMain=200 | |||
|O2Dep= |O2Etch= |ArDep=150 |ArEtch=150 | |||
|WCoilDep=2 |WCoilEtch=2 |WPlatenDep=1 | |||
|WPlatenEtchDelay=1@1 |WPlatenEtchBoost=1@ 100 |WPlatenEtchMain=1 | |||
|WClaritasDep= |WClaritasEtch= | |||
|%CoilDepLoad=40 |%CoilDepTune=50 |%CoilEtchLoad=40 |%CoilEtchTune=50 | |||
|%PlatenDepLoad=32.5 |%PlatenDepTune=51.9 |%PlatenEtchLoad=32.5 |%PlatenEtchTune=51.9 | |||
|%CLaritasLoad= |%ClaritasTune= |Temperature='''0''' | |||
|Link2RecipeRun=[[Specific Process Knowledge/Etch/DRIE-Pegasus/DREM/DREM 2kW micro | '''8''']] | |||
}} | |||
{{Template:Peg1Table9Row | |||
|RecipeName=DREM 2kW micro | |||
|PriorProcessSteps= Pump to base, Clamp Substrate, home platen matching unit, stabilisation | |||
|PaddingStyle=padding:0px; | |||
|ActualPressure= | |||
|Keywords= | |||
|PlatenPosition=U |PlatenFrequency=HF |StabilisationTime= |StartCycleEndCycle=D/E | |||
|DepositionTime=1.2 |EtchTime=3 |NumberOfCycles= | |||
|PressureDepDelay= |PressureDepBoost= |PressureDepMain=100% | |||
|PressureEtchDelay= |PressureEtchBoost= |PressureEtchMain=100% | |||
|C4F8DepDelay=0.3 @5 |C4F8DepBoost= 0.5@ 50 |C4F8DepMain=200 | |||
|C4F8EtchDelay=0.5@ 100 |C4F8EtchBoost= |C4F8EtchMain=5 | |||
|SF6DepDelay=0.3@ 200 |SF6DepBoost=0.5@ 200 |SF6DepMain=15 | |||
|SF6EtchDelay=2@ 15 |SF6EtchBoost=0.3@ 100 |SF6EtchMain=200 | |||
|O2Dep= |O2Etch= |ArDep=150 |ArEtch=150 | |||
|WCoilDep=2 |WCoilEtch=2 |WPlatenDep=1 | |||
|WPlatenEtchDelay=1@1 |WPlatenEtchBoost=1@ 100 |WPlatenEtchMain=1 | |||
|WClaritasDep= |WClaritasEtch= | |||
|%CoilDepLoad=40 |%CoilDepTune=50 |%CoilEtchLoad=40 |%CoilEtchTune=50 | |||
|%PlatenDepLoad=32.5 |%PlatenDepTune=51.9 |%PlatenEtchLoad=32.5 |%PlatenEtchTune=51.9 | |||
|%CLaritasLoad= |%ClaritasTune= |Temperature='''-19''' | |||
|Link2RecipeRun=[[Specific Process Knowledge/Etch/DRIE-Pegasus/DREM/DREM 2kW micro at -19 degrees | '''1''']] | |||
}} | |||
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