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Specific Process Knowledge/Wafer and sample drying/Spin Dryers: Difference between revisions

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Created page with "=== Spin dryers === 200x200px|right|thumb|Image(s) of the equipment(s) A tool used for drying wafers. A single cassette of wafers is p..."
 
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=== Spin dryers ===
'''Feedback to this page''': '''[mailto:pvd@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php?title=Specific_Process_Knowledge/Wafer_and_sample_drying/Spin_Dryers click here]'''
 
 
 
= Spin dryers =


[[image:spin-rinser-dryer-white.jpg|200x200px|right|thumb|Image(s) of the equipment(s)]]
[[image:spin-rinser-dryer-white.jpg|200x200px|right|thumb|Image(s) of the equipment(s)]]
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'''The user manual(s), quality control procedure(s) and results, user APV(s), technical information and contact information can be found in LabManager: [http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=156 LabManager]'''
'''The user manual, technical information, and contact information can be found in LabManager: [http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=157 Spin dryer 2] [http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=158 Spin dryer 3] [https://labmanager.dtu.dk/function.php?module=Machine&view=view&mach=408 Spin dryer 5][https://labmanager.dtu.dk/function.php?module=Machine&view=view&mach=323 Spindryer 6 (8")]'''  
 
 
== Process information ==
 
Standard process is 120 seconds for 100mm wafers or 180 seconds for 150mm wafers, at 2000 RPM - drying only.
 
''If'' rinsing is used as well, the standard process is 60 seconds of rinse at 500 RPM, followed by 120/180 seconds of drying at 2000 RPM.
 
 
<br clear="all" />
 
{| border="2" cellspacing="0" cellpadding="2"
 
!colspan="2" border="none" style="background:silver; color:black;" align="center"|Equipment
|style="background:WhiteSmoke; color:black"|<b>Spin dryer 2</b>
|style="background:WhiteSmoke; color:black"|<b>Spin dryer 3</b>
|style="background:WhiteSmoke; color:black"|<b>Spin dryer 5</b>
|style="background:WhiteSmoke; color:black"|<b>Spin dryer 6</b>
|-
!style="background:silver; color:black;" align="center" width="60"|Location
|style="background:LightGrey; color:black"|
|style="background:WhiteSmoke; color:black"|
*B-1
|style="background:WhiteSmoke; color:black"|
*D-3
|style="background:WhiteSmoke; color:black"|
*D-3
|style="background:WhiteSmoke; color:black"|
*F-3
|-
!style="background:silver; color:black;" align="center" width="60"|Purpose
|style="background:LightGrey; color:black"|
|style="background:WhiteSmoke; color:black"|
*Drying
|style="background:WhiteSmoke; color:black"|
*Drying
*Rinsing + drying
|style="background:WhiteSmoke; color:black"|
*Drying
|style="background:WhiteSmoke; color:black"|
*Drying
*Rinsing + drying
|-
!style="background:silver; color:black" align="center" valign="center" rowspan="3"|Substrates
|style="background:LightGrey; color:black"|Batch size
|style="background:WhiteSmoke; color:black"|
*1-25 100 mm wafers
|style="background:WhiteSmoke; color:black"|
*1-25 100 mm wafers
*1-25 150 mm wafers
|style="background:WhiteSmoke; color:black"|
*1-25 100 mm wafers
*1-25 150 mm wafers
|style="background:WhiteSmoke; color:black"|
*1-25 100 mm wafers
*1-25 150 mm wafers
*1-25 200 mm wafers
|-
| style="background:LightGrey; color:black"|Allowed materials
|style="background:WhiteSmoke; color:black"|
*Only for RCA cleaned wafers
|style="background:WhiteSmoke; color:black"|
*No restrictions
|style="background:WhiteSmoke; color:black"|
*No restrictions
|style="background:WhiteSmoke; color:black"|
*No restrictions
|-
|}
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