Specific Process Knowledge/Etch/DRIE-Pegasus/Notation: Difference between revisions
No edit summary |
No edit summary Tag: Manual revert |
||
| (9 intermediate revisions by the same user not shown) | |||
| Line 1: | Line 1: | ||
<!-- Ok, jmli 20170627 --> | |||
<!-- Ok, jmli 2020-0120 --> | <!-- Ok, jmli 2020-0120 --> | ||
== How to read the | <!-- Page reviewed 9/8-2022 jmli --> | ||
<!-- Page reviewed 28/6-2023 jmli --> | |||
{{contentbydryetch}} | |||
== How to read the notation on process recipes == | |||
<!-- revised 1/6-2015 by jmli --> | <!-- revised 1/6-2015 by jmli --> | ||
Look at two examples from the etch cycle of Step1 of the Process A shown in '''bold''' below: | |||
# The Platen power has the setting ''120 >> 140 (1.5s) 45 '' - it is to be interpreted as: | # The Platen power has the setting ''120 >> 140 (1.5s) 45 '' - it is to be interpreted as: | ||
## In the first 1.5 seconds of the every cycle the platen power has a value that is ramped (indicated by >>) from 120 W initially to 150 W in the end | ## In the first 1.5 seconds of the every cycle the platen power has a value that is ramped (indicated by >>) from 120 W initially to 150 W in the end | ||
| Line 59: | Line 65: | ||
|- | |- | ||
| Common | | Common | ||
| colspan="4" | Temperature 20 degs, HBC 10 torr | | colspan="4" | Temperature 20 degs, HBC 10 torr | ||
|} | |} | ||
Latest revision as of 12:31, 22 September 2024
Unless otherwise stated, the content of this page was created by the dry etch group at DTU Nanolab
How to read the notation on process recipes
Look at two examples from the etch cycle of Step1 of the Process A shown in bold below:
- The Platen power has the setting 120 >> 140 (1.5s) 45 - it is to be interpreted as:
- In the first 1.5 seconds of the every cycle the platen power has a value that is ramped (indicated by >>) from 120 W initially to 150 W in the end
- During the remainder of the cycle the platen power is kept constant at 45 W.
- The Pressure has the setting 25 (1.5 s) 90 >> 150 - it is to be interpreted as:
- In the first 1.5 seconds the pressure is constant at 25 mtorr.
- During the remainder of the cycle the pressure has i higher value that is ramped from 90 initially to 150 mtorr in the last etch cycle.
| Step 1 | Step 2 | |||
| Parameter | Etch | Dep | Etch | Dep |
| Gas flow (sccm) | SF6 350 (1.5 s) 550 | C4F8 200 | SF6 350 (1.5 s) 550 | C4F8 200 |
| Cycle time (secs) | 7.0 | 4.0 | 7.0 | 4.0 |
| Pressure (mtorr) | 25 (1.5 s) 90 >> 150 | 25 | 25 (1.5 s) 150 | 25 |
| Coil power (W) | 2800 | 2000 | 2800 | 2000 |
| Platen power (W) | 120 >> 140 (1.5) 45 | 0 | 140 (1.5) 45 | 0 |
| Cycles | 11 (keep fixed) | 44 (vary this) | ||
| Common | Temperature 20 degs, HBC 10 torr | |||