Jump to content

Specific Process Knowledge/Etch/DRIE-Pegasus/Pegasus-2: Difference between revisions

← Older edit
VisualWikitext
Jmli (talk | contribs)
DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers
4,565 edits
Bghe (talk | contribs)
DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers, Bureaucrats, Administrators
7,305 edits
 
(7 intermediate revisions by one other user not shown)
Line 6: Line 6:
= DRIE-Pegasus 2=
= DRIE-Pegasus 2=
{{Author-jmli1}}
{{Author-jmli1}}
[[file:Pegasus 2 operator.jpg |frame |300px|The DRIE-Pegasus 2 operator station and load lock in the DTU Nanolab cleanroom A-1. {{photo1}} ]]
[[File:Pegasus 2 operator.jpg|right|400px|The DRIE-Pegasus 2 operator station and load lock in the DTU Nanolab cleanroom A-1. {{photo1}}]]
 
[[File:Pegasus 2 operator.jpg|left|300px|The DRIE-Pegasus 2 operator station and load lock in the DTU Nanolab cleanroom A-1. {{photo1}}]]
'''The user manual(s), user APV(s), technical information and contact information can be found in LabManager:'''
'''The user manual(s), user APV(s), technical information and contact information can be found in LabManager:'''


Line 32: Line 30:


{{Template:Peg2configheader1
{{Template:Peg2configheader1
|TableHeader= 6: Currently valid from June 13 2022 onwards
|TableHeader= 7: Currently valid from May 17 2023 onwards
}}
}}
{{Template:Peg2configcontent1
{{Template:Peg2configcontent1
|ItemName= Available gasses and gas chemistry
|ItemName= Available gasses and gas chemistry
|ItemConfiguration= '''Available gasses:'''
|ItemConfiguration= '''Available gasses:'''
* SF<sub>6</sub>: 50 sccm
* SF<sub>6</sub>-1: 1200 sccm
* SF<sub>6</sub>-2: 50 sccm
* O<sub>2</sub>: 50 sccm
* O<sub>2</sub>: 50 sccm
* Ar: 283  
* Ar: 283  
Line 45: Line 44:
* C<sub>4</sub>F<sub>8</sub> (H<sub>2</sub> currently fitted but closed) : 0 sccm
* C<sub>4</sub>F<sub>8</sub> (H<sub>2</sub> currently fitted but closed) : 0 sccm
* CO<sub>2</sub>: (It is not in the software)  
* CO<sub>2</sub>: (It is not in the software)  
|ItemComment=OnlySF<sub>6</sub> and O<sub>2</sub> are used for Si, PR, and Cr etch. The rest is only make-up
|ItemComment=Only SF<sub>6</sub> and O<sub>2</sub> are used for Si, PR, and Cr etch. The rest is only make-up
}}
}}
{{Template:Peg2configcontent1
{{Template:Peg2configcontent1
Line 71: Line 70:
{{Template:Peg2configcontent1
{{Template:Peg2configcontent1
|ItemName= Recipes
|ItemName= Recipes
|ItemConfiguration= In the past, only recipes in the 'std' folder were allowed to run. Now, you can develop your own recipes '''as long as they don't violate any of the limitations/restrictions and rules in this table.'''
|ItemConfiguration= Do ''not'' run any recipes from the folder called 'z-Archive'.
|ItemComment= Be extremely careful with recipes in other folders than your own or the 'std' folder as they may no longer be safe to run because of hardware changes.
|ItemComment= The configuration of Pegasus 2 has changed over time (hence this table) so there is a large number of recipes that are no longer working. Also, some inappropriate settings in the some recipes (mainly with respect to the pressure control) have been identified. This is why it was decided that all existing (by autumn 2022) recipes be relocated to the folder called 'z-Archive' from which they must serve ''only'' as backup. To run a recipe in the z-Archive folder, it must be verified by the dry etch group and copied to another folder (typically user\group\****).
 
}}
}}
{{Template:Peg2configcontent1
{{Template:Peg2configcontent1
Line 80: Line 80:
}}
}}
{{Template:Peg2configcontent1
{{Template:Peg2configcontent1
|ItemName= Electrostatic clamping, chip bonding with Galden oil and helium backside cooling are no longer being used.
|ItemName= Electrostatic clamping and helium backside cooling are again mandatory.
|ItemConfiguration= The processes run in Pegasus 2 operate at such low powers that they do not require very efficient cooling. It has therefore been decided that the following options/procedures
|ItemConfiguration= The processes run in Pegasus 2 operate at such low powers that they do not require very efficient cooling. It has therefore been decided that the following options/procedures
* Electrostatic clamping of carriers/substrates
* Electrostatic clamping of carriers/substrates
* Helium backside cooling
* The Helium backside cooling is kept at 5 Torr instead of the usual 10 Torr on the other Pegasus tools.
* Using bonding procedures such as droplets of Galden oil to increase thermal contact between chips and carrier
* Using bonding procedures such as droplets of Galden oil to increase thermal contact between chips and carrier
will no longer be required.
will no longer be required.
Line 124: Line 124:
* [[Specific Process Knowledge/Etch/DRIE-Pegasus/Pegasus-2/Black silicon on Demand|Black silicon on Demand]]
* [[Specific Process Knowledge/Etch/DRIE-Pegasus/Pegasus-2/Black silicon on Demand|Black silicon on Demand]]
* [[/ORE with Al2O3 mask|The ORE process with Al2O3 mask]]
* [[/ORE with Al2O3 mask|The ORE process with Al2O3 mask]]
*[[/Nanoscale silicon nitride etch with SF6|Nanoscale silicon nitride etch with SF6]]
Retrieved from "https://labadviser.nanolab.dtu.dk//index.php?title=Specific_Process_Knowledge/Etch/DRIE-Pegasus/Pegasus-2"